[특허]Method of making a proximity probe

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-003/00
출원번호	US-0833244 (2001-04-10)
발명자 / 주소	Rose, Robert Ivan
출원인 / 주소	Bently Nevada LLC
대리인 / 주소	DeBoo, Dennis A.
인용정보	피인용 횟수 : 6 인용 특허 : 51

초록 ▼

Method of making a proximity probe including providing a preform having an interior cavity accessible by an opened rearward end; coupling a coil to the preform proximate a forward most end of the preform for defining an assembly; locating a single support pin through the rearward end such that the s

Method of making a proximity probe including providing a preform having an interior cavity accessible by an opened rearward end; coupling a coil to the preform proximate a forward most end of the preform for defining an assembly; locating a single support pin through the rearward end such that the support pin extends within the interior cavity while having an end emanating from the rearward end; cantilevering the emanating end between an upper and a lower mold plate defining a mold cavity for supporting the assembly; injecting moldable material into the mold cavity for molding an encapsulation of material over the assembly for defining an encapsulated probe tip, allowing the encapsulated probe tip to cure; removing the encapsulated probe tip from the mold cavity; removing the support pin from the assembly, and coupling a cable to the encapsulated probe tip for forming the proximity probe.

대표청구항 ▼

Method of making a proximity probe including providing a preform having an interior cavity accessible by an opened rearward end; coupling a coil to the preform proximate a forward most end of the preform for defining an assembly; locating a single support pin through the rearward end such that the s

Method of making a proximity probe including providing a preform having an interior cavity accessible by an opened rearward end; coupling a coil to the preform proximate a forward most end of the preform for defining an assembly; locating a single support pin through the rearward end such that the support pin extends within the interior cavity while having an end emanating from the rearward end; cantilevering the emanating end between an upper and a lower mold plate defining a mold cavity for supporting the assembly; injecting moldable material into the mold cavity for molding an encapsulation of material over the assembly for defining an encapsulated probe tip, allowing the encapsulated probe tip to cure; removing the encapsulated probe tip from the mold cavity; removing the support pin from the assembly, and coupling a cable to the encapsulated probe tip for forming the proximity probe. � �0

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이 특허에 인용된 특허 (51) 인용/피인용 타임라인 분석

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Hermle Eduard (Kirchstrasse 20 D-7303 Neuhausen a.d.Fildern DEX), Electric proximity sensor.
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Forster Joachim (Winnenden DEX), Encapsulated apparatus.
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Plunkett James P. (West Dundee IL) Latchford Joseph T. (Bowmanville CA), Encapsulated coil and method of making the same.
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Van Den Berg Dave, Encapsulated transducer and method of manufacture.
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Van Den Berg Dave, Encapsulated transducer having a protective sleeve.
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Berg Dave Van Den, Encapsulated transducer with an alignment plug and method of manufacture.
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Van Den Berg Dave, Encapsulated transducer with an integrally formed full length sleeve and a component alignment preform and method of man.
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Byrne John R. (Watertown WI), Floating insert injection mold.
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Lavallee Gerald A. (Belchertown MA) Jarmuzewski Mario R. (Chicopee MA), Golf ball injection mold.
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Dickmeyer David A. (Fort Wayne IN) Maurer ; III Kenneth G. (Fort Wayne IN) Redmon Larry L. (Fort Wayne IN), High output and environmentally impervious variable reluctance sensor.
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Dickmeyer David A. (Fort Wayne IN) Maurer ; III Kenneth G. (Fort Wayne IN) Redmon Larry L. (Fort Wayne IN), High output and environmentally impervious variable reluctance sensor.
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Dickmeyer David A. ; Maurer ; III Kenneth G. ; Redmon Larry L., High output and environmentally impervious variable reluctance sensor.
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Mehnert Wolfgang (Lindau-Reutin DEX), Housing for electronic switchgear.
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Fay John E. (Leominster MA) Faulkner Michael T. (Leominster MA), Injection molding mechanism for forming a monolithic tubular pipette.
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Ormson Timothy J. (2131 Woodruff Blvd. Janesville WI 53545), Kitchen tools and method of preparation.
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Pierpont, Ralph E., Method for encapsulating a radial leaded electrical component.
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Yokoyama Takaaki (Niiza JPX), Method for manufacturing plastic encapsulated electronic semiconductor devices.
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Yokoyama Takaaki (Niiza JPX), Method for manufacturing plastic encapsulated electronic semiconductor devices.
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Bruening Werner,DEX, Method for producing a nozzle cartridge.
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Dickmeyer David A. (Fort Wayne IN), Method of assembly of a variable reluctance sensor.
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Kilgore David C. (Yorktown VA), Method of making a hermetically sealed overmolded free-standing solenoid coil.
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Schutts Mark E. (Reno NV), Method of making a proximity sensor.
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Van Den Berg Dave (Minden NV), Method of making a transducer.
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Van Den Berg Dave, Method of making an encapsulated transducer with an alignment plug.
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Van Den Berg Dave, Method of manufacture of an encapsulated transducer.
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Van Den Berg Dave, Method of manufacturing an encapsulated transducer with an integrally formed full length sleeve and a component alignment preform.
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Saito Hidetoshi (Hyogo JPX) Kume Masahiro (Hyogo JPX), Method of manufacturing rotation sensor and structure of rotation sensor.
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Yokoyama Takaaki (Niiza JPX), Mold assembly.
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Sano Takezo (Shiga JPX) Tsuruyoshi Kenichi (Kusatsu JPX), Molding apparatus with retractable preform support pins.
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Shead Terence H. C. (Chorley Wood EN) Wills David G. (St. Albans EN), Moulding.
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Anderson Weston, Nuclear magnetic resonance method and apparatus.
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Kohen Isak (Rillieux la Pape FRX), Pickup having encapsulated electrical and magnetic elements.
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Allshouse Gary W. (Muncy PA) Cawthern ; Jr. James E. (Linden PA) Hopkins Randall K. (Milford MA), Probe assembly mounting for a grinding machine.
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Prox Rolf (Mettmann DEX), Proximity sensing head.
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Schutts Mark E. (Reno NV), Proximity sensor resistant to axial and torsional forces.
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Bernardon Edward (Bedford MA) Foley Michael F. (Cambridge MA), Reconfigurable fiber-forming resin transfer system.
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Shaw, Clifford O., Resonant probe and radio frequency coupler.
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Giza John (10 Morningside Ave. Acushnet MA 02743), Retractable pin for an injection mold.
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Giza John P. (Acushnet MA), Retractable pin mold.
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Guichard Robert Charles (Normal IL), Shielding arrangement for sensing the proximity of a metallic object.
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Echasseriau Gilbert (Toulouse FRX) Oliveau Patrice (Toulouse FRX), Variable reluctance electromagnetic sensor with pole piece-magnet assembly locking mechanism and method of assembly.
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Gorrell Todd A. (Angola IN) Gerber Gregory P. (Hudson IN), Variable reluctance sensor having hermetically sealed housing and damping element.
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이 특허를 인용한 특허 (6) 인용/피인용 타임라인 분석

Sufka, Stephen James; Tahti, Thane Fleming; Price, David Ray; Wickstead, Kristoffer Wayne, Apparatus for attachment of a plastic probe tip to a metal component.
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Sufka,Stephen James; Tahti,Thane Fleming; Price,David Ray; Roy,Steven Francis; Wickstead,Kristoffer Wayne, Apparatus for the automated manufacture of a probe tip.
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Kurimoto, Wataru; Itakura, Hiromichi, Cannula casting mould and casting method.
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Sufka, Stephen James; Tahti, Thane Fleming; Price, David Ray; Roy, Steven Francis; Wickstead, Kristoffer Wayne, Method and apparatus for automated manufacture of a probe tip.
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Sufka,Stephen James; Tahti,Thane Fleming; Price,David Ray; Wickstead,Kristoffer Wayne, Method for attachment of a plastic probe tip to a metal component.
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Suma, Takashi; Fujikawa, Yukinori; Sakurai, Nozomu, Proximity sensor.
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