$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Thermal interface material having a zone-coated release linear 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0692345 (2000-10-19)
발명자 / 주소
  • Bergin, Jonathan M.
출원인 / 주소
  • Parker-Hannifin Corporation
대리인 / 주소
    Molnar, Jr., John A.
인용정보 피인용 횟수 : 41  인용 특허 : 88

초록

A release liner particularly adapted for use with a layer of a thermal interface material having a first surface and a second surface which is bondable to the heat transfer surface of a thermal dissipation member. The liner has an exterior surface and an interior surface disposable in adhering conta

대표청구항

A release liner particularly adapted for use with a layer of a thermal interface material having a first surface and a second surface which is bondable to the heat transfer surface of a thermal dissipation member. The liner has an exterior surface and an interior surface disposable in adhering conta

이 특허에 인용된 특허 (88)

  1. Dunn David J. (Twinsburg OH) Vano Patrick P. (Parma OH) Moran ; Jr. James P. (Farmington CT) Holmes Mark (Quaker Hill CT) Frauenglass Elliott (Newington CT), Aluminum filled compositions.
  2. Chiu Chia-Pin, Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device.
  3. Wilson Ronald (Lunenburg MA), Carrier release sheet.
  4. Jorden Ralph Z. (Cherry Hill NJ) Lenig Ronald S. (Corrales NM), Circuit card assembly cold plate.
  5. Mattor John A. (Bar Mills ME) Price Lawrence (Old Orchard Beach ME), Coating composition for release sheets.
  6. Greuse Herve (St. Denis BEX) Siraux Guy (Mignault BEX), Colored release liner.
  7. Konishi Toshiharu (Osaka JPX) Takashashi Hadekazu (Osaka JPX) Hasegawa Yoshitsugu (Osaka JPX) Yamamoto Kazunori (Osaka JPX) Sano Kenji (Osaka JPX) Okada Hideyuki (Osaka JPX), Composite release sheet material.
  8. Lin Shiow C. (Ellicott City MD) Barber Craig S. (Columbia MD), Conductive thermosetting compositions and process for using same.
  9. Bunyan Michael H. ; de Sorgo Miksa, Conformal thermal interface material for electronic components.
  10. Martin Jacob H. (Wellesley MA), Conforming heat sink assembly.
  11. Artus Raymonde G. C. (The Cedars ; 95 Crescent Road Reading ; Berkshire GB2), Cooled component assembly.
  12. Itoh Hideyuki,JPX ; Ohba Toshio,JPX ; Isobe Kenichi,JPX ; Irifune Shinji,JPX ; Toyoda Takamasa,JPX, Curable silicone release composition and release sheet.
  13. Moeller Scott A. ; Baker Jay O. ; Chess Stanley C., Curl free silicone coated release liner.
  14. Kohara, Masanobu; Nakao, Shin; Shibata, Hiroshi, Dimensionally stable semiconductor device.
  15. Michael H. Bunyan, Double-side thermally conductive adhesive tape for plastic-packaged electronic components.
  16. Thomas Daniel L. (Portland OR), Electrically insulating thermally conductive pad for mounting electronic components.
  17. Casperson, Paul G., Electronic component heat sink attachment using a low force spring.
  18. Anderson Albert G. (Wilmington DE) Howard ; Jr. Edward G. (Hockessin DE), Ethylene polymer composite heat storage material.
  19. Tzeng Jing-Wen ; Getz ; Jr. George ; Weber Thomas William, Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner.
  20. Levy Fernand J. (Puteaux FRX), Flexible, electrically conductive jointing material, particularly suitable for aircraft.
  21. Kendziorski Craig K. (Midland MI) Neal ; Jr. Charles E. (Midland MI) Sobieski Loretta A. (Midland MI) Tangney Thomas J. (Midland MI) Stickles David L. (Midland MI), Fluorosilicone compounds and compositions for adhesive release liners.
  22. Kerins John E. ; Genke Nathan A., Flushable double-sided release liner.
  23. Horvath Joseph L. (Poughkeepsie NY) Biskeborn Robert G. (Pawling NY) Harvilchuck Joseph M. (Billings NY), High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology.
  24. Jamison William L. (Fishers IN) Larsen Gary J. (Carmel IN) Sears ; Jr. George E. (Indianapolis IN), Hydrophilic thermally conductive grease.
  25. Kraft Roger E. (Fort Scott KS) Mercer Merlin F. (Fort Scott KS) Johnson Roy A. (Fort Scott KS), Integrated label having controlled release.
  26. Fick Herbert J. (Northfield MN), Interfacing for heat sinks.
  27. Fick Herbert J. (Northfield MN), Interfacing of heat sinks with electrical devices, and the like.
  28. Braun Joseph T. (Midland MI) Johnson Virgil J. (Bay City MI) Mealey Shawn K. (Midland MI), Laminate article comprising moisture-curable silicone pressure sensitive adhesive and release liner.
  29. Johnson Michael A. (St. Paul MN) Gates Milton R. (St. Paul MN) Shibahara Norihito (St. Paul MN), Low temperature shock resistant release liner.
  30. Perlman Daniel (Arlington MA), Method for containment of a laboratory chemical.
  31. Call Anson J. (Holmes NY) Meisner Stephen H. (Hudson NY) Pompeo Frank L. (Walden NY) Zitz Jeffrey A. (Poughkeepsie NY), Method for directly joining a chip to a heat sink.
  32. Call Anson J. (Holmes NY) Meisner Stephen H. (Hudson NY) Pompeo Frank L. (Walden NY) Zitz Jeffrey A. (Poughkeepsie NY), Method for forming chip carrier with a single protective encapsulant.
  33. McIntyre Frederic S. (Wellesley MA), Method of and apparatus for producing adhesive-coated sheet materials usable with radiation-cured silicone release coati.
  34. Attley Begona,GB3, Method of coating.
  35. Ohara Shuzo (Kawanishi JPX) Kitamura Ryoichi (Takaishi JPX), Method of manufacturing release sheet.
  36. Fick Herbert J. (Northfield MN), Method of preparing interfacings of heat sinks with electrical devices.
  37. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel ; Jr. Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and materials for conducting heat from electronic components and the like.
  38. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and materials for conducting heat from electronic components and the like.
  39. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and means for conducting heat from electronic components and the like.
  40. DeGree David C. (Burnsville MN) Bergquist Carl R. (Minnetonka MN) Humphrey Dallas R. (Golden Valley MN) West Roger A. (Woodbury MN), Mounting base pad means for semiconductor devices and method of preparing same.
  41. Kaufman, Lance R., Mounting of a compact circuit package to a heat sink or the like.
  42. Seth Jayshree, Nonwoven pressure sensitive adhesive tape.
  43. Hudgin Donald E. (33 Berkshire Dr. Princeton Junction NJ 08550) Semsarzadeh Mohammad A. (32-10 Quail Ridge Plainsboro NJ 08536), Polymer-metal blend.
  44. Besso Erica M. (Manotick CAX), Polymethylpentene release sheet method of use.
  45. Hinshaw Howard G. ; Smithers Matthew C., Pre-application of grease to heat sinks with a protective coating.
  46. Brown Paul L. (Saginaw MI) Stickles David L. (Midland MI), Pressure sensitive adhesive release liner.
  47. Brown Paul L. (Saginaw MI) Stickles David L. (Midland MI), Pressure sensitive adhesive release liner and fluorosilicone compounds, compositions and method therefor.
  48. Brown Paul L. (Saginaw MI) Stickles David L. (Midland MI), Pressure sensitive adhesive release liner and fluorosilicone compounds, compositions and method therefor.
  49. McClintock Jack M. (Pittsburgh PA) Knittel Gerald H. (Brecksville OH), Pressure sensitive adhesive tape with central release liner.
  50. McClintock Jack M. (Pittsburgh PA) Knittel Gerald H. (Brecksville OH) Leggett Lana (Wadsworth OH), Pressure sensitive adhesive tape with central release liner and its use on a jacket portion of insulation member.
  51. Bennett Greggory S. (Hudson WI) Haak Christopher A. (Oakdale MN), Pressure sensitive adhesives with good low energy surface adhesion.
  52. Epple Thomas C. (Madison OH), Pressure-sensitive adhesive release liner.
  53. Katchmar Roman,CAX, Printed circuit board and heat sink arrangement.
  54. Morley Richard E. (Mason NH) Baker David A. (Mason NH), Printed circuit board heat sink.
  55. Dunn David J. (Twinsburg OH) Vano Patrick P. (Parma OH) Moran ; Jr. James P. (Farmington CT) Holmes Mark (Quaker Hill CT) Frauenglass Elliott (Newington CT), Process of bonding surfaces employing/anaerobic aluminum filled compositions.
  56. Mason Daniel T. ; Epple Thomas C., Release coated liners and security labels containing such release coated liners.
  57. Tsujinaka Koji (Kanagawa JPX) Akasaki Ichimoto (Kanagawa JPX), Release coating composition and release sheet.
  58. Johnson Michael A. (Stillwater MN) Kuypers Maurice H. (Oakdale MN), Release liner.
  59. Munninger Wilhelm,DEX ; Wattendorf Hans,DEX, Release liner.
  60. Kelley T. Doyle (Greenville SC), Release liner and method of using same.
  61. Knauf Gary H. (Appleton WI), Release liner base stock for printed films or labels.
  62. All Frank E. (Newark NY) Lu Pang-Chia (Pittsford NY) Reid Leland W. (Palmyra NY) Weber Ralph J. (Fairport NY), Release sheet.
  63. Chang Keunsuk P. (Fairport NY) Lu Pang-Chia (Pittsford NY), Release sheet.
  64. Hosoda Yukio (Utsunomiya JPX) Ohtsubo Hiro (Utsunomiya JPX) Yamada Hiroyuki (Utsunomiya JPX), Release sheet.
  65. Kato Takahisa (Tokyo) Ebato Seigo (Tokyo JPX), Release sheet.
  66. Lu Pang-Chia (Pittsford NY), Release sheet.
  67. Takeshita, Kazuhisa; Takeda, Yasuo, Release sheet and a method for making thereof.
  68. Power ; George Edward ; Bolling ; Donald Louis, Release sheet of a cellulosic paper coated with a resin mixture.
  69. Power ; George Edward ; Bolling ; Donald Louis, Release sheet of a coated cellulose paper.
  70. Mattor John A. (Bar Mills MA) Price Lawrence (Old Orchard Beach MA), Release sheet with dried and cured coating composition.
  71. Jaisle Richard F. (Batesville IN) Bunkowski Kenneth D. (Cincinnati OH), Release sheets and process of use.
  72. Morrow Charles M. (St. Paul MN), Sheet material having composite fluorochemical-silicone release coatings.
  73. Cook, Ronald S.; Token, Kenneth H., Simple thermal joint.
  74. Krankkala George (Naperville IL) Bachman John (Chicago IL), Stabilized paper substrate for release liners.
  75. Campbell Karen J. (Anoka MN) Evans Jack L. (St. Paul MN), Stable silicone-coated release liner for pressure-sensitive adhesive sheets.
  76. Altoz Frank E. (Catonsville MD), Thermal coupling to enhance heat transfer.
  77. Jamison William L. (Fishers IN) Larsen Gary J. (Carmel IN) Sears ; Jr. George E. (Indianapolis IN), Thermal coupling with water-washable thermally conductive grease.
  78. Daszkowski Joseph M. (New Hyde Park NY), Thermal link.
  79. Block Jacob (Rockville MD) Rice Roy W. (Alexandria VA) Morgan Charles R. (Brookeville MD), Thermally conductive elastomer.
  80. Block Jacob (Rockville MD) Lau John W. K. (Gaithersburg MD), Thermally conductive elastomer containing alumina platelets.
  81. Liberty James (Hollis NH) Jones Peter (Londonderry NH), Thermally conductive electrical assembly.
  82. Ameen Joseph G. (Bear DE) Mortimer ; Jr. William P. (Conowingo MD) Yokimcus Victor P. (Newark DE), Thermally conductive interface.
  83. Bergerson Steven E. (St. Louis Park MN), Thermally conductive interface for electronic devices.
  84. Liberty James (Hollis NH) Jones Peter (Londonderry NH), Thermally conductive interface materials and methods of using the same.
  85. Squitieri Vincent (Billerica MA), Thermally conductive materials.
  86. Nakano Akio (Annaka JPX) Yoneyama Tsutomu (Annaka JPX) Tomizawa Nobumasa (Harunamachi JPX), Thermally conductive silicone rubber composition containing organo polysiloxanes with high and low polymerization degree.
  87. Friedman Michael, Thermoplastic seal and wrapping film.
  88. Patterson Robert (Neenah WI) Papez Stephen M. (Oshkosh WI), Undercoated silicone release sheet.

이 특허를 인용한 특허 (41)

  1. Rockford, David M.; Leggett, William F., Adhesive bond with integrated release mechanism.
  2. Abul Haj, Roxanne E.; Abul Haj, N. Alan; Stippick, Timothy W.; Hazen, Kevin H., Apparatus for absorbing and dissipating excess heat generated by a system.
  3. Storm, Bruce H; Chen, Dingding; Song, Haoshi, Cooling apparatus, systems, and methods.
  4. Nguyen,Yen Teresa; Brenes,Manrique J.; Neal,Rachel C.; Zimmerman,Craig A., Ethernet switch with configurable alarms.
  5. Dong, Shun Chi; Huang, Chung-Yuan, Heat dissipation assembly.
  6. Zhou, Zhi-Yong; Qin, Ji-Yun; He, Xiao-Jian, Heat dissipation assembly.
  7. Wu, Wow, Heat sink assembly incorporating mounting frame.
  8. Miyamura,Harold; Chen,Rong Che, Heat sink attachment.
  9. Wu, Yi Qiang; Chen, Chun Chi, Heat sink having protective device for thermal interface material spread thereon.
  10. Storm, Jr., Bruce H.; Schultz, Roger L.; Fripp, Michael L., Heating and cooling electrical components in a downhole operation.
  11. Abul-Haj, Roxanne E.; Abul-Haj, N. Alan; Stippick, Timothy W.; Hazen, Kevin H., Heatsink method and apparatus.
  12. Nguyen, Yen Teresa; Brenes, Manrique J.; Collinge, James E., Industrial ethernet switch.
  13. Nguyen,Yen Teresa; Brenes,Manrique J.; Colinge,James E., Industrial ethernet switch.
  14. Zimmerman,Craig A.; Boone,Earl W.; Grimm,Matthew D.; Johnson,William C; Nix,Daniel, Industrial ethernet switch.
  15. Rumer, Christopher L.; Houle, Sabina J.; Jayaraman, Saikumar; Koning, Paul A.; Dani, Ashay, Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly.
  16. Storm,Bruce H.; Song,Haoshi, Method and apparatus for managing the temperature of thermal components.
  17. Reeves, Matthew A.; Holland, Robert Scott; Loong, Sy-Jenq, Method of producing a liquid cooled coldplate.
  18. Loong, Sy-Jenq; Smith, Donald Lynn, Method of producing an enhanced base plate.
  19. Loong, Sy-Jenq; Smith, Donald Lynn, Method of producing electronics substrate with enhanced direct bonded metal.
  20. Zhang, Qiming; Lu, Sheng-Guo; Li, Xinyu; Gorny, Lee; Cheng, Jiping; Neese, Bret P.; Chu, Baojin, Polymer-based electrocaloric cooling devices.
  21. Zhou, Shi-Wen; Cao, Jun; Xu, Qing-Song, Protective device for protecting thermal interface material and fasteners of heat dissipation device.
  22. Tomaru,Kazuhiko; Mita,Kunihiko; Yoneyama,Tsutomu, Radiating structural body of electronic part and radiating sheet used for the radiating structural body.
  23. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Rechargeable energy storage device in a downhole operation.
  24. Wang,Frank; Cheng,Yi Lun; Fan,Jui Chan; Chang,Chun Yi; Lin,Chun Lung; Yang,Chih Kai, Recyclable protective cover for a heat-conductive medium.
  25. Anderson, Nicole; Zhu, Bizhong, Reinforced silicone resin film and method of preparing same.
  26. Bailey, Debbie; Katsoulis, Dimitris Elias; Suto, Michitaka; Zhu, Bizhong, Reinforced silicone resin film and method of preparing same.
  27. Bailey, Debbie; Katsoulis, Dimitris Elias; Suto, Michitaka; Zhu, Bizhong, Reinforced silicone resin film and method of preparing same.
  28. Zhu, Bizhong, Reinforced silicone resin films.
  29. Zhu, Bizhong, Reinforced silicone resin films.
  30. Tetsuka, Takashi; Yamamoto, Hiroki, Semiconductor device and method of manufacturing the same.
  31. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.
  32. Fisher, Mark David; Zhu, Bizhong, Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition.
  33. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Switchable power allocation in a downhole operation.
  34. Hartmann, Mark; Kelly, Joseph, Systems, structures and materials for electrochemical device thermal management.
  35. Jarrett, Robert N.; Merritt, Craig K., Technique for forming a thermally conductive interface with patterned metal foil.
  36. Czubarow, Paul; Segal, Jay R.; Adam, Jr., Arthur L., Thermal interface material and methods for assembling and operating devices using such material.
  37. Frank, Paul P.; Radford, Kenneth C.; Schoch, Jr., Karl F.; Wojtal, Eileen M.; Panackal, Philip A., Thermal interface material for electronic assemblies.
  38. Kirk, Graham Charles, Thermal interface material for reducing thermal resistance and method of making the same.
  39. Strader, Jason L.; Wisniewski, Mark; Bruzda, Karen; Craig, Michael D., Thermal interface material with thin transfer film or metallization.
  40. Strader, Jason; Wisniewski, Mark, Thermal interface material with thin transfer film or metallization.
  41. Strader, Jason L.; Wisniewski, Mark; Bruzda, Karen; Craig, Michael D., Thermal interface materials with thin film or metallization.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로