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A method for producing a thin openly porous metal film from a metal powder that can be sintered. The metal powder is suspended in a carrier fluid with a specific size distribution of particles, the suspension is applied to a supporting material in at least one thin film and dried, and the green laye

A method for producing a thin openly porous metal film from a metal powder that can be sintered. The metal powder is suspended in a carrier fluid with a specific size distribution of particles, the suspension is applied to a supporting material in at least one thin film and dried, and the green layer thus formed is sintered. The thickness of the layer formed by suspension thus applied corresponds at least to the thickness (s) of the metal film to be produced after sintering, whereby (s) is at least three times the value of the diameter (D) of the powder particles, D=1-50 urn and the maximum thickness of the finished metal film is 500 μm.

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1. A process for manufacturing an openly porous, thin metal film from a sinterable metal powder comprising pure powder of a single metal, a mixture of pure powders of two or more metals, powders of metal alloys, or mixtures of said alloy powders with one or more pure metal powders, said sinterable m

1. A process for manufacturing an openly porous, thin metal film from a sinterable metal powder comprising pure powder of a single metal, a mixture of pure powders of two or more metals, powders of metal alloys, or mixtures of said alloy powders with one or more pure metal powders, said sinterable metal powder having an average powder particle size of 1-50 microns, the process comprising the steps of: (a) suspending the powder in a carrier fluid comprising a binder and a solvent; (b) applying the suspension to a carrier substrate to form a metal layer having a thickness at least three times the diameter of the powder particles and a maximum thickness of 500 microns; (c) drying the metal layer to form a green layer; (d) sintering the green layer to form a metal film having a thickness corresponding to the thickness of the metal layer applied in step (b). 2. The process of claim 1 wherein the applying step (b) comprises adding two or more partial layers of suspension onto the carrier substrate to form said metal layer. 3. The process of claim 2 wherein said adding step includes application of at least two partial layers, and wherein the suspended powders used to apply at least one partial layer have a different particle size distribution than the suspended particles used to apply at least one other partial layer. 4. The process of claim 2 or 3 wherein said adding step includes application of at least two partial layers, and wherein the suspended powders used to apply at least one partial layer comprise a metal powder different from the metal powder used to apply at least one other partial layer. 5. The process of claim 2 or 3 wherein a first partial layer of the adding step is dried to form a green partial layer prior to application of a subsequent partial layer. 6. The process of claim 4 wherein a first partial layer of the adding step is dried to form a green partial layer prior to application of a subsequent partial layer. 7. The process of claim 5 wherein the first partial layer of said adding step is sintered prior to application of a subsequent partial layer. 8. The process of claim 6 wherein the first partial layer of said adding step is sintered prior to application of a subsequent partial layer. 9. The process of claim 1 wherein a contour mask is disposed on the carrier substrate prior to said applying step (b). 10. The process of claim 1 wherein the suspension in said applying step (b) is applied to the carrier substrate through thin film casting, spraying, or immersion. 11. The process of claim 1 wherein the suspension in said applying step (b) is applied to the carrier substrate through a head that is moved relative to the carrier substrate. 12. The process of claim 1 wherein said green layer is separated from the carrier substrate prior to said sintering step (d). 13. The process of claim 1 wherein said metal film is separated from the carrier substrate after said sintering step (d). 14. The process of claim 1 wherein said carrier substrate is tubular. 15. The process of claim 14 wherein the tubular carrier substrate has a central axis and is rotated about said central axis during said applying step (b) and during at least a portion of said drying step (c). 16. The process of claim 1 further comprising the step of calibrating said metal film by rolling. 17. The process of claim 12 wherein the substrate is flat and flexible. 18. The process of claim 13 wherein the substrate is resistant to high temperature. 19. The process of claim 13 or 18 wherein the substrate is flat. 20. The process of claim 12 or 13 further comprising the step of calibrating said metal film by rolling.