$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Control system for ablating high-density array of vias or indentation in surface of object 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/36
출원번호 US-0183806 (2002-06-26)
발명자 / 주소
  • Lizotte, Todd E.
  • Ohar, Orest
출원인 / 주소
  • NanoVia, LP
대리인 / 주소
    Davis & Bujold PLLC
인용정보 피인용 횟수 : 6  인용 특허 : 36

초록

A laser beam delivery system for ablating a desired array of features in an object to be processed. The imaging system comprises a laser, a shaping apparatus for shaping the laser beam into a plurality of separate laser beams, first and second repeat positioners for redirecting the beams, a convergi

대표청구항

A laser beam delivery system for ablating a desired array of features in an object to be processed. The imaging system comprises a laser, a shaping apparatus for shaping the laser beam into a plurality of separate laser beams, first and second repeat positioners for redirecting the beams, a convergi

이 특허에 인용된 특허 (36)

  1. Smith Adlai H. (San Diego CA) McArthur Bruce B. (San Diego CA) Hunter ; Jr. Robert O. (Rancho Santa Fe CA), Apparatus and process for high speed laminate processing with computer generated holograms.
  2. Smith Adlai H. (San Diego CA) Hunter ; Jr. Robert O. (Rancho Santa Fe CA) McArthur Bruce B. (San Diego CA), Apparatus and process for using Fresnel zone plate array for processing materials.
  3. Todd E. Lizotte ; Orest Ohar ; Sunny Collar Waters, Control system for ablating high-density array of vias or indentation in surface of object.
  4. Watanabe Kenichi (Chiba JPX), Control system for automatic electronic-part mounter.
  5. Harris Ronald M. ; Feng Ke ; Burgess Alan R., Controlled color laser marking of plastics.
  6. Hunter ; Jr. Robert O. (Rancho Santa Fe CA) Smith Adlai H. (San Diego CA) McArthur Bruce B. (San Diego CA), Direct etch processes for the manufacture of high density multichip modules.
  7. Jacobs Fred (New York NY), High resolution piggyback linear motor design for placement systems and the like.
  8. Kosmowski Wojciech B., High speed drilling spindle with reciprocating ceramic shaft and edoubl-gripping centrifugal chuck.
  9. Myer Jon H. (Woodland Hills CA), High speed laser marking system.
  10. Kosmowski Wojciech B., Hole forming system with multiple spindles per station.
  11. Brian J. Monaghan ; Anthony W. Heath, Hologram production technique.
  12. Wilt Donald R. ; Sidell Richard S., Illumination system for OCR of indicia on a substrate.
  13. Hunter ; Jr. Robert O. (Rancho Santa Fe CA) McArthur Bruce B. (San Diego CA) Smith Adlai H. (San Diego CA), Laser ablation control system and method.
  14. Okumura Kiyoshi (Hitachi JPX) Nishimura Kazuhiko (Hitachi JPX) Fujimoto Minoru (Hitachi JPX) Ohkawa Hiroo (Hitachi JPX) Mera Kazuo (Hitachi JPX) Shiono Shigeo (Hitachi JPX), Laser marking system.
  15. Costin Darryl J., Laser method and system of scribing graphics.
  16. Costin Darryl ; Colwell Heath, Laser method of scribing graphics.
  17. Owen Mark D. (Beaverton OR), Laser system and method for plating vias.
  18. Sun Yunlong ; Swenson Edward J., Laser system for functional trimming of films and devices.
  19. Garcia Douglas J., Method and apparatus for loading electronic components.
  20. Overbeck James W. (Hingham MA), Method and apparatus for positioning a focused beam on an integrated circuit.
  21. Owen Mark D. ; Larson Bonnie A. ; Puymbroeck Jozef Van,BEX, Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered ta.
  22. Subbarao Saligrama N. (Plainsboro NJ) Huang Ho-Chung (Princeton Junction NJ), Method for fabricating via holes in a semiconductor wafer.
  23. Lantzer Thomas D. (Fuquay-Varina NC), Method for forming through holes in a polyimide substrate.
  24. Wang Carl B. (Chapel Hill NC), Method for forming vias in multilayer circuits.
  25. Merlin Pierre (Venelles FRX) Coiton Gerard (Venelles FRX), Method for the marking of a connector of a chip card with a laser beam.
  26. Magnante Peter C., Methods and devices to design and fabricate surfaces on contact lenses and on corneal tissue that correct the eye's optical aberrations.
  27. Cutler Donald R. ; Pailthorp Robert M. ; Unrath Mark A. ; Richardson Thomas W. ; Cable Alan J., Multi-tool positioning system.
  28. Caicedo ; Jr. Gustavo (Westminster CA) Hanson Scott L. (Costa Mesa CA), Optical alignment system for aligning a multiple gap tape head assembly.
  29. Nakatani Hajime,JPX ; Sugitatsu Atsushi,JPX ; Izumo Masao,JPX ; Minagawa Tadao,JPX ; Minamitani Yasushi,JPX ; Matsushita Yoshifumi,JPX ; Yagi Toshinori,JPX ; Zumoto Nobuyuki,JPX, Optical processing method and apparatus for carrying out the same.
  30. Wilt Donald R., Optical viewing system for simultaneously viewing indicia located on top and bottom surfaces of a substrate.
  31. Smith Adlai H. (San Diego CA) Hunter ; Jr. Robert O. (Rancho Santa Fe CA) McArthur Bruce (San Diego CA) Blair Steven (San Diego CA) Wilkinson Jim (San Diego CA), Process for ablating high density vias in flexible substrate.
  32. Lasermann Franz (Bielefeld DEX) Wittenbreder Eduard (Bielefeld DEX), Process for longitudinal adjustment of tools.
  33. Anthony Thomas R. (Schenectady NY), Reverse laser drilling.
  34. Owen Mark D. (Beaverton OR) O\Brien James N. (Bend OR), Ultraviolet laser system and method for forming vias in multi-layered targets.
  35. Hunter ; Jr. Robert O. (Rancho Santa Fe CA) Smith Adlai H. (San Diego CA) Guest Clark C. (San Diego CA) McArthur Bruce B. (San Diego CA), Use of fresnel zone plates for material processing.
  36. Lincoln Thomas S. (Arvada CO) Bauer Charles E. (Evergreen CO), Via formation method for multilayer interconnect board.

이 특허를 인용한 특허 (6)

  1. Kucher,Trent Steven; Raab,Karen Renee; Jiang,Xiangyang, Cylinder rod with position sensor surface markings.
  2. Belcastro,Marc D.; Duvekot,Loren; Rudolph, Jr.,Kenneth E.; Thompson,Marvin G., High speed laser perforation of cigarette tipping paper.
  3. Belcastro,Marc D.; Duvekot,Loren; Rudolph, Jr.,Kenneth E.; Thompson,Marvin G., High speed laser perforation of cigarette tipping paper.
  4. Tamura, Yutaka, High speed laser scribing method of fragile material.
  5. Lizotte, Todd E.; Ohar, Orest, Laser beam delivery system with trepanning module.
  6. Flanagan, Aiden, Laser stent cutting.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로