IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0665151
(2000-09-19)
|
|
발명자
/ 주소 |
|
| 출원인 / 주소 |
|
| 대리인 / 주소 |
|
| 인용정보 |
피인용 횟수 :
74 인용 특허 :
3 |
초록
▼
An ultraviolet area sterilizer (UVAS) is mobile or stationary. The UVAS is positioned in a room, such an operating room or intensive care unit. Motion detectors sense movement, to assure that personnel have evacuated the space to be sterilized. Subsequently, UV-C generators, such as a bank of mercur
An ultraviolet area sterilizer (UVAS) is mobile or stationary. The UVAS is positioned in a room, such an operating room or intensive care unit. Motion detectors sense movement, to assure that personnel have evacuated the space to be sterilized. Subsequently, UV-C generators, such as a bank of mercury bulbs, generate intense levels of UV-C. An array of multiple UV-C sensors scan the room, and determine the darkest area, or the area reflecting the lowest level of UV-C back to the sensors. A BASIC Stamp contained in the device calculates the time required to obtain a bactericidal dose of UV-C reflected back from darkest area. Once a bactericidal dose has been reflected to all the sensors, the unit notifies the operator and shuts down. By relying on reflected doses rather than direct exposure, the UVAS is able to sterilize or sanitize all surfaces within the room that are within view of an exposed wall or ceiling.
대표청구항
▼
An ultraviolet area sterilizer (UVAS) is mobile or stationary. The UVAS is positioned in a room, such an operating room or intensive care unit. Motion detectors sense movement, to assure that personnel have evacuated the space to be sterilized. Subsequently, UV-C generators, such as a bank of mercur
An ultraviolet area sterilizer (UVAS) is mobile or stationary. The UVAS is positioned in a room, such an operating room or intensive care unit. Motion detectors sense movement, to assure that personnel have evacuated the space to be sterilized. Subsequently, UV-C generators, such as a bank of mercury bulbs, generate intense levels of UV-C. An array of multiple UV-C sensors scan the room, and determine the darkest area, or the area reflecting the lowest level of UV-C back to the sensors. A BASIC Stamp contained in the device calculates the time required to obtain a bactericidal dose of UV-C reflected back from darkest area. Once a bactericidal dose has been reflected to all the sensors, the unit notifies the operator and shuts down. By relying on reflected doses rather than direct exposure, the UVAS is able to sterilize or sanitize all surfaces within the room that are within view of an exposed wall or ceiling. nd having a higher eutectic point with gold than the melting point of an eutectic of tin and gold, wherein the metal additive ranges from 0.1 to 9% by weight of the tin-gold-metal additive composition, wherein the metal additive is silicon; and wherein the die-bonding solder material is used for bonding components of a pressure transducer. 6. The die-bonding solder material of claim 5, wherein an amount of said metal additive included in the tin-gold-metal additive composition is deposited such that excessive growth of crystal grains is suppressed during cooling process. 7. The die-bonding solder material of claim 5, wherein the metal additive is deposited during cooling of the tin-gold composition in liquid phase to suppress excessive growth of crystal grains. 8. A die-bonding solder material consisting essentially of: tin; gold, wherein a composition ratio of tin and gold include a eutectic point having 90 to 95 percent by weight tin; a metal additive having a higher melting point than tin, forming no eutectic with tin, and having a higher eutectic point with gold than the melting point of an eutectic of tin and gold, wherein the metal additive ranges from 0.1 to 9% by weight of the tin-gold-metal additive composition, wherein the metal additive is silicon; and wherein the die-bonding solder material is used for bonding components of a pressure transducer, the pressure transducer including a pressure sensor, a carrier and a base coupled between the pressure sensor and the carrier, wherein the die-bonding solder material is used to bond the base to the carrier.
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