초록 ▼

The present invention describes a process of cleaning an enamel surface with a liquid acidic composition comprising an enamel safe acid wherein the pKaof said acid is 3.5 or higher, with the proviso that non mono-lower alkyl ethers or phenyl ethers or benzyl ethers of diethylene glycol, wherein the

The present invention describes a process of cleaning an enamel surface with a liquid acidic composition comprising an enamel safe acid wherein the pKaof said acid is 3.5 or higher, with the proviso that non mono-lower alkyl ethers or phenyl ethers or benzyl ethers of diethylene glycol, wherein the lower alkyl is of 2 to 6 carbon atoms, are present in said composition. The composition employed in said process is safe to enamel.

대표청구항 ▼

1. A process of cleaning an enamel surface with a liquid acidic composition comprising at least one enamel safe acid, the process comprising applying the composition directly to the enamel surface in either dilute or neat form, wherein the at least one enamel safe acid has a pKaof 3.5 or higher, whe

1. A process of cleaning an enamel surface with a liquid acidic composition comprising at least one enamel safe acid, the process comprising applying the composition directly to the enamel surface in either dilute or neat form, wherein the at least one enamel safe acid has a pKaof 3.5 or higher, wherein the composition is free of any acid having a pKaof less than 3.5 and free of mono-lower alkyl, phenyl or benzyl ethers of diethylene glycol, wherein the lower alkyl comprises 2 to 6 carbon atoms, and wherein the composition is substantially free of any source of enamel-damaging cations. 2. The process according to claim 1 wherein the pKaof the at least one enamel safe acid is greater than 4.0. 3. A process according to claim 1 wherein said composition comprises from 0.1% to 10% by weight of the total composition of said enamel safe acid. 4. A process according to claim 1 wherein said composition further comprises a surfactant. 5. A process according to claim 4 wherein said composition comprises up to 15% by weight of the total composition of said surfactant. 6. A process according to claim 1 wherein said composition further comprises a solvent. 7. A process according to claim 6 wherein said composition comprises from 0.1% to 8% by weight of the total composition of said solvent. 8. The process according to claim 1 wherein the pKaof the at least one enamel safe acid is greater than 4.5. 9. The process according to claim 1 wherein the composition has a pH of from 1 to 5. 10. The process according to claim 1 wherein the composition has a pH of from 2 to 4.