초록 ▼

A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are

A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are spatially completely separated from each other. Each of the pads for wiring paths for radio-frequency signals and for power supply/control signals and ground pads are provided within each package and at opposing surfaces of packages to be stacked with corresponding pads joined by a gold bump.

대표청구항 ▼

1. A stacked radio-frequency module formed by stacking dielectric multi-layer substrates onto which radio-frequency circuits are provided, wherein, at least two of the dielectric multi-layer substrates comprise: a substrate having dielectric walls provided on its periphery; a closed space in w

1. A stacked radio-frequency module formed by stacking dielectric multi-layer substrates onto which radio-frequency circuits are provided, wherein, at least two of the dielectric multi-layer substrates comprise: a substrate having dielectric walls provided on its periphery; a closed space in which the radio-frequency circuits are stored, formed by surrounding the space with the dielectric walls and the dielectric multi-layer substrate provided as an upper stage; an input/output terminal for radio-frequency signals provided on at least one of the upper surfaces of the dielectric walls and the bottom surface of the substrate at a position where the dielectric walls are provided, at a position opposing an input/output terminal for radio-frequency signals of the dielectric multi-layer substrate at the upper stage or lower stage; an input/output terminal for power supply/control signals provided on at least one of the upper surfaces of the dielectric walls and the bottom surface of the substrate at a position where the dielectric walls are provided, at a position opposing an input/output terminal for power supply/control signals of the dielectric multi-layer substrate at the upper stage or lower stage; a transmission path within the substrate for radio-frequency signals provided inside the dielectric multi-layer substrate, for connecting the input/output terminal for radio-frequency signals and the radio-frequency circuits; and a transmission path within the substrate for power supply/control signals provided inside the dielectric multi-layer substrate, for connecting the input/output terminal for power supply/control signals and the radio-frequency circuits, and gold bumps provided for joining the input/output terminals for radio-frequency signals that are provided at opposing positions and for joining the input/output terminals for power supply/control signals provided at opposing positions. 2. A stacked radio-frequency module according to claim 1, further comprising a dielectric multi-layer substrate for storing a control circuit for setting power supply/control signals for the radio frequency circuits. 3. A stacked radio-frequency module according to claim 1, wherein a sealing lid for sealing the circuits is provided in the closed space. 4. A stacked radio-frequency module according to claim 1, wherein a large-capacitance capacitor is provided on the bottom surface of the dielectric multi-layer substrate forming the closed space. 5. A stacked radio-frequency module according to claim 1, wherein at least one of an external input/output terminal for radio-frequency signals and an external input/output terminal for power supply/control signals is provided on a side surface of a dielectric wall of the dielectric multi-layer substrate. 6. A stacked radio-frequency module according to claim 1, wherein the input/output terminal for radio-frequency signals and the input/output terminal for power supply/control signals are provided on a surface created by partially removing at least one layer which forms the dielectric multi-layer substrate. 7. A stacked radio-frequency module according to claim 1, wherein an electric wave absorber is provided in the closed space. 8. A stacked radio-frequency module according to claim 2, wherein a sealing lid for sealing the circuit is provided within the closed space.