An optoelectric module includes a cylindrical ferrule defining an optical axis and having a first end constructed to receive an optical fiber aligned along the optical axis. An optical element, including a lens, is engaged in the ferrule between the first and second ends and positioned to convey lig
An optoelectric module includes a cylindrical ferrule defining an optical axis and having a first end constructed to receive an optical fiber aligned along the optical axis. An optical element, including a lens, is engaged in the ferrule between the first and second ends and positioned to convey light along the optical axis. The second end of the ferrule is closed by a base. An optical component is mounted on the base so that light is directed through the lens from the optical component to the optical fiber or from the optical fiber to the optical component. Either a laser driver or an amplifier is mounted on the base and electrically connected to the optical component and external connections are made to the laser driver or the amplifier by electrical traces on a surface of the base, vias through the base, or flex leads mounted on the base.
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An optoelectric module includes a cylindrical ferrule defining an optical axis and having a first end constructed to receive an optical fiber aligned along the optical axis. An optical element, including a lens, is engaged in the ferrule between the first and second ends and positioned to convey lig
An optoelectric module includes a cylindrical ferrule defining an optical axis and having a first end constructed to receive an optical fiber aligned along the optical axis. An optical element, including a lens, is engaged in the ferrule between the first and second ends and positioned to convey light along the optical axis. The second end of the ferrule is closed by a base. An optical component is mounted on the base so that light is directed through the lens from the optical component to the optical fiber or from the optical fiber to the optical component. Either a laser driver or an amplifier is mounted on the base and electrically connected to the optical component and external connections are made to the laser driver or the amplifier by electrical traces on a surface of the base, vias through the base, or flex leads mounted on the base. ssists said optical coupling. 19. An optoelectronic packaging assembly according to claim 18, further including clamps for clamping said optical spacer. 20. An optoelectronic packaging assembly according to claim 18, wherein said electro-optical device is on an optical bench that includes an alignment slot for assisting optical alignment of the electro-optical device with said optical fiber. 21. An optoelectronic packaging assembly according to claim 20, further including conductors between said pins and said optical bench. 22. An optoelectronic packaging assembly according to claim 1, wherein said submount includes a liquid crystal polymer. 23. An optoelectronic packaging assembly according to claim 1, wherein said submount includes a metal. 24. An optoelectronic packaging assembly, comprising: a submount having sidewalls, a front wall, pins, protrusions, and an optical input receptacle, wherein said protrusions are dimensioned to receive an optical bench, wherein said walls define a cavity, wherein said walls retain said pins, and wherein said optical input receptacle extends from said front wall; a bottom cover having walls configured to receive said submount such that said submount and said bottom cover form an enclosed bottom cavity, and such that said optical input receptacle extends from said bottom cavity; and a top cover configured to be received on said submount such that said submount and said top cover form an enclosed top cavity. 25. An optoelectronic packaging assembly according to claim 24, wherein said bottom cover includes a mounting flange having a mounting hole. 26. An optoelectronic packaging assembly according to claim 24, wherein said pins have rectangular cross-sections. 27. An optoelectronic packaging assembly according to claim 24, wherein said pins have circular cross-sections. 28. An optoelectronic packaging assembly according to claim 24, wherein said pins are insert molded in said submount. 29. An optoelectronic packaging assembly according to claim 24, wherein said optical input receptacle includes a half-moon shaped slot. 30. An optoelectronic packaging assembly according to claim 24, further including a thermal-electric-cooler disposed in said top cavity. 31. An optoelectronic packaging assembly according to claim 30, wherein said thermal-electric-cooler is electrically connected to at least one of said pins. 32. An optoelectronic packaging assembly according to claim 24, further including an optical bench on said protrusions. 33. An optoelectronic packaging assembly according to claim 32, further including an electro-optic device on said optical bench. 34. An optoelectronic packaging assembly according to claim 33, further including an optical ferrule in said optical fiber input receptacle. 35. An optoelectronic packaging assembly according to claim 34, further including an optical fiber inserted in said optical ferrule. 36. An optoelectronic packaging assembly according to claim 35, wherein said electro-optic device is optically coupled to said optical fiber. 37. An optoelectronic packaging assembly according to claim 36, further including an optical spacer that assists said optical coupling. 38. An optoelectronic packaging assembly according to claim 33, wherein said electro-optical device is disposed adjacent said bottom cover. 39. An optoelectronic packaging assembly according to claim 38, wherein said pins include exposed contact surfaces inside said optoelectronic packaging assembly, and further including conductors electrically connecting said optical bench to said exposed contact surfaces. 40. An optoelectronic packaging assembly according to claim 24, wherein said pins include exposed contact surfaces inside said optoelectronic packaging assembly. 41. An optoelectronic packaging assembly according to claim 24, wherein said submount includes a liquid crystal polymer. 42. An optoelectronic packaging assembly according to claim 24, wherein said submount includes a metal. 43. An opt oelectronic packaging assembly, comprising: a base having a bottom wall and a front wall with a protruding optical input receptacle; a submount attached to said bottom wall; and a heat-sink that mates with said base to form an enclosed volume, said heat-sink including a top surface with a slot; and an insert in said slot, said insert including pins that extend into said enclosed volume. 44. An optoelectronic packaging assembly according to claim 43, wherein said heat-sink includes cooling fins. 45. An optoelectronic packaging assembly according to claim 43, wherein said pins have rectangular cross-sections. 46. An optoelectronic packaging assembly according to claim 43, wherein said pins have circular cross-sections. 47. An optoelectronic packaging assembly according to claim 43, wherein said pins are insert molded in said insert. 48. An optoelectronic packaging assembly according to claim 43, wherein said optical input receptacle includes a half-moon shaped slot. 49. An optoelectronic packaging assembly according to claim 43, further including an optical bench on said submount. 50. An optoelectronic packaging assembly according to claim 49, further including an electro-optical device on said optical bench. 51. An optoelectronic packaging assembly according to claim 50, wherein said optical bench includes an alignment slot. 52. An optoelectronic packaging assembly according to claim 51, further including an optical ferrule in said optical fiber input receptacle. 53. An optoelectronic packaging assembly according to claim 52, further including an optical fiber inserted into said optical ferrule. 54. An optoelectronic packaging assembly according to claim 53, wherein said electro-optical device is optically coupled to said optical fiber. 55. An optoelectronic packaging assembly according to claim 50, wherein said optical bench includes a plurality of contacts in electrical contact with said pins. 56. An optoelectronic packaging assembly according to claim 43, wherein said submount includes a liquid crystal polymer. 57. An optoelectronic packaging assembly according to claim 43, wherein said submount includes a metal. 58. An optoelectronic packaging assembly according to claim 50, wherein said electro-optical device is disposed on said optical bench opposite said submount. 59. An optoelectronic packaging assembly, comprising: a base having a plate and a front wall with an optical input receptacle; a submount on said plate; an optical bench on said submount, said optical bench including a plurality of electrical contacts; a heat-sink in thermal communication with said plate; and an insert with pins that electrically connect to said plurality of electrical contacts, wherein said pins are insert molded in said insert. 60. An optoelectronic packaging assembly according to claim 59, wherein said heat-sink includes cooling fins. 61. An optoelectronic packaging assembly according to claim 59, wherein said pins have rectangular cross-sections. 62. An optoelectronic packaging assembly according to claim 59, wherein said pins have circular cross-sections. 63. An optoelectronic packaging assembly according to claim 59, wherein said optical input receptacle includes a half-moon shaped slot. 64. An optoelectronic packaging assembly according to claim 59, further including an optical ferrule in said optical fiber input receptacle. 65. An optoelectronic packaging assembly according to claim 64, further including an optical fiber inserted into said optical ferrule. 66. An optoelectronic packaging assembly according to claim 59, further including an electro-optical device on said optical bench. 67. An optoelectronic packaging assembly according to claim 66, wherein said electro-optical device is disposed on said optical bench opposite said submount. 68. An optoelectronic packaging assembly according to claim 67, where in said electro-optical device is optically coupled to said optical fiber. 69. An optoelectronic packaging assemb
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이 특허에 인용된 특허 (5)
Chan, Benson; Fortier, Paul F.; Guindon, Francois M.; Johnson, Glen W.; Letourneau, Martial A.; Sherman, John H.; Tetreault, Real, Alignment systems for subassemblies of overmolded optoelectronic modules.
Jensen Earl M. (Sunnyvale CA) Sun Mei H. (Los Altos CA) Vecht David L. (San Jose CA) Melen Robert E. (Saratoga CA), Modular luminescence-based measuring system using fast digital signal processing.
Blair, Thomas H.; Edwards, Phillip J.; Fleischer, Siegfried; Lebby, Michael S.; Levin, Bradley S.; Northup, Oliver W.; O'Toole, Michael M.; Vandenberg, Joseph John; Zaborsky, Brett M., Optoelectric module.
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