초록 ▼

A method for forming a gate structure beginning with a semiconductor substrate provided with an isolation region formed therein. An HfO2layer and a conductive layer are formed on the semiconductor substrate, subsequently. The conductive layer and the HfO2layer are patterned into the gate structure.

A method for forming a gate structure beginning with a semiconductor substrate provided with an isolation region formed therein. An HfO2layer and a conductive layer are formed on the semiconductor substrate, subsequently. The conductive layer and the HfO2layer are patterned into the gate structure. By utilizing an HfO2layer as a gate dielectric, an effective K of the gate dielectric can be controlled to within 18 to 25. In addition, by employing a CVD method for forming the HfO2layer, it is possible to obtain a high K gate dielectric with excellent leakage current characteristic as well as a low interface state with both a gate electrode and a semiconductor substrate.

대표청구항 ▼

A method for forming a gate structure beginning with a semiconductor substrate provided with an isolation region formed therein. An HfO2layer and a conductive layer are formed on the semiconductor substrate, subsequently. The conductive layer and the HfO2layer are patterned into the gate structure.

A method for forming a gate structure beginning with a semiconductor substrate provided with an isolation region formed therein. An HfO2layer and a conductive layer are formed on the semiconductor substrate, subsequently. The conductive layer and the HfO2layer are patterned into the gate structure. By utilizing an HfO2layer as a gate dielectric, an effective K of the gate dielectric can be controlled to within 18 to 25. In addition, by employing a CVD method for forming the HfO2layer, it is possible to obtain a high K gate dielectric with excellent leakage current characteristic as well as a low interface state with both a gate electrode and a semiconductor substrate. d wiring board, a position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers of the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.