$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Synthetic resin capping layer on a printed circuit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-005/00
  • H05K-005/04
  • H05K-005/06
출원번호 US-0024637 (1998-02-17)
우선권정보 EP-0200470 (1997-02-18)
발명자 / 주소
  • Wimberger Friedl, Reinhold
  • Broeksema, Egbert
  • Deeben, Henricus A.C.
출원인 / 주소
  • Koninklijke Philips Electronics N.V.
대리인 / 주소
    Biren, Steven R.
인용정보 피인용 횟수 : 26  인용 특허 : 17

초록

A printed circuit is provided with a synthetic resin capping layer that exhibits a continuous variation of mechanical properties in a direction at right angles to its surface. The printed circuit can be in a mobile telephone or other portable device, and the capping layer of the printed circuit can

대표청구항

1. A printed circuit which is provided with a synthetic resin capping layer, said circuit comprising a printed circuit board having at least one electric component, and the capping layer comprising a foam-forming reactive injection-moulding material exhibiting a variation of mechanical properties in

이 특허에 인용된 특허 (17)

  1. Klein Dean A., Computer component carrier that directs airflow to critical components.
  2. Schlett Egon,DEX ; Helfrich Rudolf,DEX ; Vath Norbert,DEX, Covering means for air-bag-collision-safety means as well as process for the production thereof.
  3. Satoh Hideaki (Kanagawa JPX) Itakura Sakae (Ayase JPX) Waragai Kenichi (Fujisawa JPX), Electronic apparatus case with wiring member embedded in a molded plastic hinge.
  4. Gold Glenn E. (Coconut Creek FL) Suppelsa Anthony B. (Coral Springs FL) Suppelsa Anthony J. (Coral Springs FL), Encapsulated electronic component having a heat diffusing layer.
  5. von Bonin Wulf (Odenthal DEX) von Gizycki Ulrich (Leverkusen DEX), Fire retardant elements.
  6. Juskey Frank J. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL) Freyman Bruce J. (Plantation FL) Suppelsa Anthony B. (Coral Springs FL), Method of making a transfer molded semiconductor device.
  7. Komathu Kathuzi (Kawagoe JPX), Method of molding a protective cover on a pin grid array.
  8. Cuntz Harald (Crailsheim DEX) Rau Martin (Oberiexingen DEX) Karr Dieter (Tiefenbronn DEX), Moisture proof of electric device for motor vehicles.
  9. Verma Shailendra, Molded housing with EMI shield.
  10. Matsumoto Kunio (Yokohama JPX) Hirota Kazuo (Chigasaki JPX) Kishimoto Munehisa (Kamakura JPX), Mounting structure and electronic device employing the same.
  11. Ahrens John R. (Dousman WI), Multidensity foam article and method of preparation.
  12. Satoh Hideaki (Kanagawa-ken JPX) Itakura Sakae (Ayase JPX) Waragai Kenichi (Fujisawa JPX), Portable telephone apparatus having case with wiring member embedded in a molded plastic hinge.
  13. Liptak Julius M. ; Gerlach Michael Joseph, Protective containment apparatus for potted electronic circuits.
  14. Suzuki Masataka,JPX ; Ashiya Hiroyuki,JPX ; Maki Yayoi,JPX ; Masuda Atsushi,JPX, Resin-coated mount substrate and method of producing the same.
  15. Jones Allen M. (Novi MI), Shielded self-molding package for an electronic component.
  16. Heiss Reinhold (Deutenhausen DEX), Shielding for flat modules.
  17. Reh Carter K. (Santa Ana CA) Robak Edward (Orange CA), Soft shroud for screen display device.

이 특허를 인용한 특허 (26)

  1. Manullang, Tyson B.; Lynch, Stephen B.; Sanford, Emery A., Active screen protection for electronic device.
  2. Montevirgen, Anthony S.; Lynch, Stephen B., Buckling shock mounting.
  3. Zornberg,Jorge G.; McCartney,John S., Centrifuge permeameter for unsaturated soils system.
  4. Zornberg,Jorge G.; McCartney,John S., Centrifuge permeameter for unsaturated soils system.
  5. Furukawa, Koji, Connector.
  6. Shukla, Ashutosh Y.; Pakula, David A.; Cohen, Sawyer I., Coupling reduction for electromechanical actuator.
  7. Peterson, Carl R.; Wodrich, Justin R.; Gibbs, Kevin D.; Smith, Samuel G., Drop countermeasures for electronic device.
  8. Peterson, Carl R.; Wodrich, Justin R.; Gibbs, Kevin D.; Smith, Samuel G., Drop countermeasures for electronic device.
  9. Rothkopf, Fletcher; Ely, Colin M., Dynamic center of mass.
  10. Ely, Colin M.; Hecht, Avi, Dynamic mass reconfiguration.
  11. Nakamura, Tadashi; Tsuzuki, Takeo, Electronic circuit device.
  12. Moon, Minhyung (Kevin), Electronic device housing.
  13. Myers, Scott A.; Weber, Douglas; Tan, Tang Yew; Dinh, Richard Hung Minh; Pakula, David A.; Sloey, Jason, Electronic devices with moisture resistant openings.
  14. Yarza,Jorge Gimenez, Leak-tight system for boxes containing electrical and electronic components.
  15. Persson, Lars, Method and assembly for injection moulding.
  16. Jaklin,Ralf; Wallrafen,Werner, Method of producing an electronic device and electronic device.
  17. Rothkopf, Fletcher; Ely, Colin M.; Lynch, Stephen B., Protecting an electronic device.
  18. Rothkopf, Fletcher; Ely, Colin M.; Lynch, Stephen B., Protecting an electronic device.
  19. Sanford, Emery A.; Wu, Wei Guang; Carey, Sarah E.; Lang, Matthew E., Screen protection using actuated bumpers.
  20. Shedletsky, Anna-Katrina; Rothkopf, Fletcher R.; Mittleman, Adam; Lynch, Stephen Brian, Shock mounting cover glass in consumer electronic devices.
  21. Shedletsky, Anna-Katrina; Rothkopf, Fletcher R.; Mittleman, Adam; Lynch, Stephen Brian, Shock mounting cover glass in consumer electronic devices.
  22. Takiar,Hem; Middlekauff,Warren; Miller,Robert C., SiP module with a single sided lid.
  23. Prest, Christopher, Viscoelastic material for shock protection in an electronic device.
  24. Prest, Christopher, Viscoelastic material for shock protection in an electronic device.
  25. Cheng, Shan; Taussig, Carl Philip, Water resistant connectors with conductive elements.
  26. Shiu, George; Koh, Wei, Waterproof USB drives and method of making.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로