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Diamond heat spreading and cooling technique for integrated circuits 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/24
출원번호 US-0828617 (2001-04-06)
발명자 / 주소
  • O'Connor, Michael
  • Haley, Kevin J.
  • Sur, Biswajit
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 54  인용 특허 : 14

초록 ▼

A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at

대표청구항 ▼

A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at

이 특허에 인용된 특허 (14)

  1. Ohno Yasuhide (Kawasaki JPX) Ohzeki Yoshio (Kawasaki JPX), Composite lead frame and semiconductor device using the same.
    상세보기
  2. Marmillion Patricia McGuinness ; Palagonia Anthony Michael ; Pierson Bernadette Ann ; Schmidt Dennis Arthur, Cooling method for silicon on insulator devices.
    상세보기
  3. Eilers Carl-Ernst (Heidenheim DEX) Pachonik Horst (Taufkirchen DEX), Device for cathode sputtering of at least two different materials.
    상세보기
  4. Belopolsky Yakov (Hockessin DE), Electronic assembly with optimum heat dissipation.
    상세보기
  5. Joshi Rajiv Vasant ; Reohr William Robert, Embedded thermal conductors for semiconductor chips.
    상세보기
  6. Gold Glenn E. (Coconut Creek FL) Suppelsa Anthony B. (Coral Springs FL) Suppelsa Anthony J. (Coral Springs FL), Encapsulated electronic component having a heat diffusing layer.
    상세보기
  7. Miremadi Jian ; Schuyler Marc P., Multiple chip assembly.
    상세보기
  8. Andres Fernandez ; Marian Mankos ; Tai-Hon Philip Chang ; Kim Lee ; Steven T. Coyle, Patterned heat conducting photocathode for electron beam source.
    상세보기
  9. Einzinger Josef (Unterschleissheim DEX) Leipold Ludwig (Munich DEX) Tihanyi Jenoe (Munich DEX) Weber Roland (Munich DEX), Power MOSFET with current-monitoring.
    상세보기
  10. Jansen Frank (Webster NY) Machonkin Mary A. (Webster NY), Processes for the preparation of polycrystalline diamond films.
    상세보기
  11. McCarthy Anthony M. (Menlo Park CA), Silicon on insulator achieved using electrochemical etching.
    상세보기
  12. Lacap Efren M., Thermally enhanced integrated circuit packaging system.
    상세보기
  13. Jenoe Tihanyi DE; Horst Schafer DE, VLSI circuit with temperature monitoring.
    상세보기
  14. Johnson Eric A. ; Park Seungbae, Warpage compensating heat spreader.
    상세보기

이 특허를 인용한 특허 (54)

  1. Hua, Fay; Chrysler, Gregory M.; Maveety, James G.; Ravi, Kramadhati V., Apparatus to minimize thermal impedance using copper on die backside.
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  2. Hua,Fay; Chrysler,Gregory M.; Maveety,James G.; Ravi,Kramadhati V., Apparatus to minimize thermal impedance using copper on die backside.
    상세보기
  3. Ghaffari, Roozbeh; Callsen, Gilman; Arora, William J.; Schlatka, Benjamin, Catheter balloon having stretchable integrated circuitry and sensor array.
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  4. Houle,Sabina J., Composite thermal interface devices and methods for integrated circuit heat transfer.
    상세보기
  5. Toy,Ben K., Diamond foam spray cooling system.
    상세보기
  6. Hua,Fay; Fitzgerald,Thomas J.; Deppisch,Carl L.; Chrysler,Gregory M., Electronic assembly having an indium wetting layer on a thermally conductive body.
    상세보기
  7. Rafferty, Conor; Dalal, Mitul, Embedding thin chips in polymer.
    상세보기
  8. Tilton, Charles L.; Tilton, Donald E., Etched open microchannel spray cooling.
    상세보기
  9. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.
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  10. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.
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  11. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.
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  12. Elolampi, Brian; Ghaffari, Roozbeh; de Graff, Bassel; Arora, William; Hu, Xiaolong, Flexible electronic structure.
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  13. Vos, David L., Fluid-cooled module for integrated circuit devices.
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  14. Vos, David L., Fluid-cooled module for integrated circuit devices.
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  15. Narkhede,Madhuri R.; Lappin,Tom M., Gap control between interposer and substrate in electronic assemblies.
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  16. Dani, Ashay A.; Houle, Sabina J.; Rumer, Christopher L.; Fitzgerald, Thomas J, Heat dissipating device with preselected designed interface for thermal interface materials.
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  17. Houle, Sabina J.; Deppisch, Carl, Heat sink with preattached thermal interface material and method of making same.
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  18. Houle,Sabina J.; Deppisch,Carl, Heat sink with preattached thermal interface material and method of making same.
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  19. Lemak, Richard J.; Rao, V. N. Padmanabha, Heat spreader and method of making the same.
    상세보기
  20. Lemak, Richard James; Rao, V. N. Padmanabha, Heat spreader and method of making the same.
    상세보기
  21. Tilton,Charles L; Weir,Thomas D; Knight,Paul A, Hotspot coldplate spray cooling system.
    상세보기
  22. de Graff, Bassel; Arora, William J.; Callsen, Gilman; Ghaffari, Roozbeh, Methods and applications of non-planar imaging arrays.
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  23. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
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  24. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
    상세보기
  25. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
    상세보기
  26. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
    상세보기
  27. Chiriac, Victor Adrian; Yu, Youmin; Chun, Dexter Tamio; Molloy, Stephen Arthur, Multi-layer heat dissipating apparatus for an electronic device.
    상세보기
  28. Dubin, Valery M.; Dory, Thomas S., Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface.
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  29. Dubin,Valery M.; Dory,Thomas S., Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface.
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  30. Dubin, Valery M; Dory, Thomas S., Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface.
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  31. Rogers, John A.; Kim, Tae Ho; Choi, Won Mook; Kim, Dae Hyeong; Meitl, Matthew; Menard, Etienne; Carlisle, John, Printable, flexible and stretchable diamond for thermal management.
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  32. Ghaffari, Roozbeh; Schlatka, Benjamin; Callsen, Gilman; de Graff, Bassel, Protective cases with integrated electronics.
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  33. Adar,Eliezer; Gotlib,Vladimir, Semiconductor cooling system and process for manufacturing the same.
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  34. Yoshimura,Hideaki, Semiconductor device with improved heat dissipation, and a method of making semiconductor device.
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  35. Rogers, John A.; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
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  36. Rogers, John A; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
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  37. Rogers, John A; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
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  38. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  39. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  40. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  41. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  42. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  43. Freedman,Philip D., Structure with heat dissipating device and method.
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  44. De Graff, Bassel; Ghaffari, Roozbeh; Arora, William J., Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy.
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  45. de Graff, Bassel; Ghaffari, Roozbeh; Arora, William J., Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy.
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  46. Ghaffari, Roozbeh; de Graff, Bassel; Callsen, Gilman; Arora, William J.; Schlatka, Benjamin; Kuznetsov, Eugene, Systems, methods, and devices using stretchable or flexible electronics for medical applications.
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  47. Houle, Sabina J.; Matayabas, Jr., James Christopher, Thermal interface structure with integrated liquid cooling and methods.
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  48. Houle,Sabina J.; Matayabas, Jr.,James Christopher, Thermal interface structure with integrated liquid cooling and methods.
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  49. Houle,Sabina J.; Matayabas, Jr.,James Christopher, Thermal interface structure with integrated liquid cooling and methods.
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  50. Jewram, Radesh; Misra, Sanjay, Thermal interface with non-tacky surface.
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  51. Jewram, Radesh; Misra, Sanjay, Thermal interface with non-tacky surface.
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  52. Rogers, John A.; Kim, Hoon-Sik; Huang, Yonggang, Thermally managed LED arrays assembled by printing.
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  53. Limaye, Ameya; Harries, Richard J.; Sane, Sandeep B., Using collapse limiter structures between elements to reduce solder bump bridging.
    상세보기
  54. Simonian, Dmitri; Basin, Grigoriy, Wavelength converted semiconductor light emitting device.
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