IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0837512
(2001-04-19)
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발명자
/ 주소 |
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| 인용정보 |
피인용 횟수 :
246 인용 특허 :
19 |
초록
▼
A system and method of neuromodulation adjunct (add-on) therapy for atrial fibrillation, refractory hypertension, and inappropriate sinus tachycardia comprises an implantable lead-receiver and an external stimulator. Neuromodulation is performed using pulsed electrical stimulation. The external stim
A system and method of neuromodulation adjunct (add-on) therapy for atrial fibrillation, refractory hypertension, and inappropriate sinus tachycardia comprises an implantable lead-receiver and an external stimulator. Neuromodulation is performed using pulsed electrical stimulation. The external stimulator contains a power source, controlling circuitry, a primary coil, and predetermined programs. The primary coil of the external stimulator inductively transfers electrical signals to the implanted lead-receiver, which is also in electrical contact with a vagus nerve. The external stimulator emits electrical pulses to stimulate the vagus nerve according to a predetermined program. In a second mode of operation, an operator may manually override the predetermined sequence of stimulation. The external stimulator may also be equipped with a telecommunications module to control the predetermined programs remotely.
대표청구항
▼
A system and method of neuromodulation adjunct (add-on) therapy for atrial fibrillation, refractory hypertension, and inappropriate sinus tachycardia comprises an implantable lead-receiver and an external stimulator. Neuromodulation is performed using pulsed electrical stimulation. The external stim
A system and method of neuromodulation adjunct (add-on) therapy for atrial fibrillation, refractory hypertension, and inappropriate sinus tachycardia comprises an implantable lead-receiver and an external stimulator. Neuromodulation is performed using pulsed electrical stimulation. The external stimulator contains a power source, controlling circuitry, a primary coil, and predetermined programs. The primary coil of the external stimulator inductively transfers electrical signals to the implanted lead-receiver, which is also in electrical contact with a vagus nerve. The external stimulator emits electrical pulses to stimulate the vagus nerve according to a predetermined program. In a second mode of operation, an operator may manually override the predetermined sequence of stimulation. The external stimulator may also be equipped with a telecommunications module to control the predetermined programs remotely. Hastings et al.; US-5515239, 19960500, Kamerman et al.; US-5528454, 19960600, Niklos; US-5587877, 19961200, Ryan et al.; US-5602721, 19970200, Slade et al.; US-5691883, 19971100, Nelson; US-5793616, 19980800, Aubuchon et al., 361/784; US-5813243, 19980900, Johnson et al.; US-5896273, 19990400, Varghese et al.; US-5909357, 19990600, Orr; US-5947570, 19990900, Anderson et al.; US-5956227, 19990900, Kitaoka; US-6052276, 20000400, Do et al., 361/684; US-6195493, 20010200, Bridges, 385/134 selected from the group consisting of a printed circuit board (PCB), a multi-chip module (MOM), and a flexible substrate. 15. The method of claim 13 wherein said substrate is selected from the group consisting of a printed circuit board (PCB), a multi-chip module (MCM), and a flexible substrate. 16. The method of claim 1 wherein said heat pipes are partially exposed to said component. 17. The method of claim 2 wherein said heat pipes are partially exposed to said component. 18. The method of claim 8 wherein said heat pipes are partially exposed to said component. 19. The method of claim 1, further comprising: disposing at least one heat dissipation fin on the heat dissipation base. 20. The method of claim 19, wherein the dissipation fin includes a plurality of fin holes, and wherein each fin hole is aligned with a corresponding hole in the heat dissipation base to form a vertical well to receive one of the screws when the screws are attached to the substrate. 21. A method for assembling a heat dissipation assembly to at least one component, comprising: providing a heat dissipation assembly including a heat dissipation base having a plurality heat-pipes embedded in an interior of the heat dissipation base, the heat dissipation base including a plurality of holes and a flat top surface for supporting a heat dissipation fin; placing said heat dissipation base on at least one component supported by a substrate; and coupling said heat dissipation base to said substrate by use of screws, wherein each one of the screws is inserted into an associated one of the holes in the heat dissipation base and wherein the screws are attached to the substrate. 22. The method of claim 21 wherein said heat dissipation base comprises a pair of opposed sides, and said heat pipes extend from one opposed side to the other opposed side. 23. The method of claim 21 additionally comprising maintaining said heat dissipation base at substantially an isothermal condition. 24. The method of claim 22 additionally comprising maintaining said heat dissipation base at substantially an isothermal condition. 25. The method of claim 21 wherein said heat pipes are parallel with respect to each other. 26. The method of claim 22 wherein said heat pipes are parallel with respect to each other. 27. The method of claim 24 wherein said heat pipes are parallel with respect to each other. 28. The method of claim 21 wherein said component comprises an electrical component. 29. The method of claim 22 wherein said component comprises an electrical component. 30. The method of claim 27 wherein said component comprises an electrical component. 31. The method of claim 21 wherein said substrate is selected from the group consisting of a printed circuit board (PCB), a multi-chip module (MCM), and a flexible substrate. 32. The method of claim 30 wherein said substrate is selected from the group consisting of a printed circuit board (PCB), a multi-chip module (MCM), and a flexible substrate. 33. The method of claim 21, further comprising: disposing at least one heat dissipation fin on the heat dissipation base. 34. The method of claim 33, wherein the dissipation fin includes a plurality of fin holes, and wherein each fin hole is aligned with a corresponding hole in the heat dissipation base to form a vertical well to receive one of the screws when the screws are attached to the substrate. 35. A substrate assembly comprising a substrate; at least one component supported by said substrate; a heat dissipation assembly coupled to said substrate and including a heat dissipation base having a structure defining a plurality of base channels having a plurality of heat-pipes disposed in said plurality of base channels in an interior of the heat dissipation base, the heat dissipation base including a plurality of holes and a flat top surface for supporting a heat dissipation fin, wherein the heat dissipation base is placed on the at least one component and wherein the heat diss ipation base is coupled to the substrate by screws, each one of the screws is inserted into an associated one of the holes in the heat dissipation base and wherein the screws are attached to the substrate. 36. The substrate assembly of claim 35 wherein said heat dissipation base comprises a pair of opposed sides, and each of said base channels has a heat pipe and extends from one opposed side to the other opposed side. 37. The substrate assembly of claim 35 wherein said heat dissipation base comprises a pair of opposed sides, and said base channels and said heat pipes extend from one opposed side to the other opposed side. 38. The substrate assembly of claim 35 wherein said heat dissipation base comprises a pair of opposed sides, and each of said base channels has a heat pipe, and said base channels and said heat pipes extend from one opposed side to the other opposed side. 39. The substrate assembly of claim 35 wherein said heat pipes are parallel with respect to each other. 40. The substrate assembly of claim 36 wherein said heat pipes are parallel with respect to each other. 41. The substrate assembly of claim 37 wherein said heat pipes are parallel with respect to each other. 42. The substrate assembly of claim 38 wherein said heat pipes are parallel with respect to each other. 43. The substrate assembly of claim 35 wherein said heat pipes are coupled to said component. 44. The substrate assembly of claim 36 wherein said heat pipes are coupled to said component. 45. The substrate assembly of claim 37 wherein said heat pipes are coupled to said component. 46. The substrate assembly of claim 38 wherein said heat pipes are coupled to said component. 47. The substrate assembly of claim 39 wherein said heat pipes are coupled to said component. 48. The substrate assembly of claim 40 wherein said heat pipes are coupled to said component. 49. The substrate assembly of claim 41 wherein said heat pipes are coupled to said component. 50. The substrate assembly of claim 42 wherein said heat pipes are coupled to said component. 51. The substrate assembly of claim 35 wherein said heat pipes are partially exposed to said component. 52. The substrate assembly of claim 38 wherein said heat pipes are partially exposed to said component. 53. The substrate assembly of claim 39 wherein said heat pipes are partially exposed to said component. 54. The substrate assembly of claim 40 wherein said heat pipes are partially exposed to said component. 55. The substrate assembly of claim 41 wherein said heat pipes are partially exposed to said component. 56. The substrate of claim 35, further comprising: at least one heat dissipation fin disposed on the heat dissipation base. 57. The substrate of claim 56, wherein the dissipation fin includes a plurality of fin holes, and wherein each fin hole is aligned with a corresponding hole in the heat dissipation base to form a vertical well to receive one of the screws when the screws are attached to the substrate. 58. A substrate assembly comprising a substrate; at least one component supported by said substrate; a heat dissipation assembly coupled to said substrate and including a heat dissipation base and a plurality of heat-pipes embedded in an interior of said heat dissipation base, the heat dissipation base including a plurality of holes and a flat top surface for supporting a heat dissipation fin, wherein the heat dissipation base is placed on the at least one component and wherein the heat dissipation base is coupled to the substrate by screws, each one of the screws is inserted into an associated one of the holes in the heat dissipation base and wherein the screws are attached to the substrate. 59. The substrate assembly of claim 58 wherein said heat dissipation base comprises a pair of opposed sides, and said heat pipes extend from one opposed side to the other opposed side. 60. The substrate assembly of claim 58 wherein said heat pipes are parallel with respect to each other. 61. The substrate a
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