IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0140609
(2002-05-08)
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발명자
/ 주소 |
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출원인 / 주소 |
- ITT Manufacturing Enterprises, Inc.
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인용정보 |
피인용 횟수 :
47 인용 특허 :
7 |
초록
▼
In general, the invention relates to a pump system for use in a heat exchange application having a pump chamber with a fluid inlet and a fluid outlet. A rotating device is contained within the pump chamber, for causing a fluid to move across a surface to be cooled. The surface forms an integral part
In general, the invention relates to a pump system for use in a heat exchange application having a pump chamber with a fluid inlet and a fluid outlet. A rotating device is contained within the pump chamber, for causing a fluid to move across a surface to be cooled. The surface forms an integral part of the pump chamber in such a manner that the fluid as it passes through the rotating device also passes across the surface, resulting in a heat transfer between the surface and the fluid. Another aspect of the invention includes having the surface to be cooled integrally connected with the pump chamber, so that the pump chamber is separable from the surface to be cooled without disturbing the fluid circuit of the heat exchange application. A means for driving the rotating device may also be configured to drive a means for cooling the fluid.
대표청구항
▼
1. A pump system for use in a heat exchange application, comprising: a pump chamber having a fluid inlet and a fluid outlet; a heat source having a surface to be cooled, the surface to be cooled coupled to the pump chamber so that the surface to be cooled forms an integral part of the pump chamb
1. A pump system for use in a heat exchange application, comprising: a pump chamber having a fluid inlet and a fluid outlet; a heat source having a surface to be cooled, the surface to be cooled coupled to the pump chamber so that the surface to be cooled forms an integral part of the pump chamber; and a rotating device contained within the pump chamber for causing a fluid to move across the surface to be cooled, resulting in a heat transfer between the surface and the fluid. 2. The pump system of claim 1, where the rotating device is an impeller. 3. The pump system of claim 1, where the surface to be cooled comprises a wall of the pump chamber. 4. The pump system of claim 1, where a means for driving the rotating device also drives a means for cooling the fluid. 5. The pump system of claim 4, where the means for cooling the fluid is an additional heat exchange application having a separate fluid circuit. 6. The pump system of claim 1, where the fluid inlet is aligned with an inlet to the rotating device. 7. The pump system of claim 1, where the fluid inlet is connected with a passageway for the fluid which is configured so that, before the fluid flows into the pump chamber, the fluid passes through the passageway and across an additional surface to be cooled, resulting in an additional heat transfer between the additional surface and the fluid. 8. The pump system of claim 1, where a means for driving the rotating device has a motor shaft connected to a magnetic element, which is magnetically coupled with the rotating device that is configured as a second magnetic element. 9. The pump system of claim 1, where a means for driving the rotating device is a motor. 10. The pump system of claim 9, where the motor includes a stator having motor windings and a rotor which is configured to operate as the rotating device. 11. The pump system of claim 10, where the stator is contained within the pump chamber and immersed in the fluid, so that the fluid cools the stator. 12. The pump system of claim 10, where the rotor is configured to surround at least a part of the stator. 13. The pump system of claim 10, where a second rotor is configured to operate as a fan for cooling the fluid. 14. The pump system of claim 1, where the rotating device is magnetically coupled to a fan for cooling the fluid, which is coupled to a means for driving both the rotating device and the fan. 15. A pump system for use in a heat exchange application, comprising: a pump chamber, comprising a part of a heat exchange fluid circuit, having a fluid inlet and a fluid outlet; a heat source having a surface to be cooled, the surface to be cooled integrally connected with the pump chamber; and a rotating device, contained within the pump chamber, for causing a fluid to move across the surface to be cooled, resulting in a heat transfer between the surface and the fluid; where the pump chamber is separable from the surface to be cooled without disturbing the heat exchange fluid circuit. 16. The pump system of claim 15, where the surface to be cooled is interfaced with a pump chamber component, which is interfaced with a wall of the pump chamber. 17. The pump system of claim 16, where a thermally conductive material is placed between the surface to be cooled and the pump chamber component, in order to enhance the heat transfer. 18. A method of cooling a heat source having a surface that requires high heat transfer and minimal pumping power comprising the steps of: forming a pump chamber having a fluid inlet and a fluid outlet and a rotating device contained within the pump chamber for moving a fluid across the surface; coupling the surface of the heat source to the pump chamber so that the surface forms an integral part of the pump chamber; and passing the fluid through the pump chamber, where the fluid as it passes through the rotating device also passes across the surface, resulting in a heat transfer between the surface and the fluid.
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