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Pump system for use in a heat exchange application 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0140609 (2002-05-08)
발명자 / 주소
  • Bingler, Douglas J.
출원인 / 주소
  • ITT Manufacturing Enterprises, Inc.
인용정보 피인용 횟수 : 47  인용 특허 : 7

초록

In general, the invention relates to a pump system for use in a heat exchange application having a pump chamber with a fluid inlet and a fluid outlet. A rotating device is contained within the pump chamber, for causing a fluid to move across a surface to be cooled. The surface forms an integral part

대표청구항

1. A pump system for use in a heat exchange application, comprising: a pump chamber having a fluid inlet and a fluid outlet; a heat source having a surface to be cooled, the surface to be cooled coupled to the pump chamber so that the surface to be cooled forms an integral part of the pump chamb

이 특허에 인용된 특허 (7)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Cheon Kioan, Cooling system for computer.
  3. Batchelder John Samuel, Heat exchange apparatus.
  4. Batchelder John Samuel, Heat exchange apparatus.
  5. Burward-Hoy Trevor, Heat exchanger for electronic equipment.
  6. Reichard Jeffrey A. (Menomonee Falls WI), Heat sink for electrical circuit components.
  7. Lian Bin ; Dishongh Terrance J. ; Searls Damion T. ; Dujari Prateek J., Heat sink with integrated fluid circulation pump.

이 특허를 인용한 특허 (47)

  1. Chang, Neng Chao, Apparatus of water-cooled heat sink.
  2. Robinson, Stanley, Carbon-based apparatus for cooling of electronic devices.
  3. Hong,Alex; Masaharu,Miyahara, Cooling device.
  4. Koga,Shinya; Matsuda,Toshihiko; Niwatsukino,Kyo; Sakai,Toshisuke; Kubota,Toshiyuki; Hirose,Masashi; Narakino,Shigeru; Aizono,Yoshimitsu; Kasahara,Kazuyuki, Cooling device and an electronic apparatus including the same.
  5. Kobayashi,Shinichi, Cooling device of electronic device.
  6. Hamman,Brian A., Cooling system.
  7. Saito,Tomonori, Cooling system and projection-type image display apparatus using the same.
  8. Eriksen, André Sloth, Cooling system for a computer system.
  9. Eriksen, André Sloth, Cooling system for a computer system.
  10. Eriksen, André Sloth, Cooling system for a computer system.
  11. Eriksen, André Sloth, Cooling system for a computer system.
  12. Eriksen, André Sloth, Cooling system for a computer system.
  13. Eriksen, André Sloth, Cooling system for a computer system.
  14. Eriksen, André Sloth, Cooling system for a computer system.
  15. Morishita,Yusuke; Inoue,Yoshimitsu, Cooling system for vehicle.
  16. Staben,Paul Ross; Westphall,Paul E., Cooling systems and methods for same.
  17. Laing, Oliver, Device for the local cooling or heating of an object.
  18. Wang, Hao, Dissipation utilizing flow of refrigerant.
  19. Wang, Hao, Dissipation utilizing flow of refrigerant.
  20. Wang, Hao, Dissipation utilizing flow of refrigerant.
  21. Hata,Yukihiko; Tomioka,Kentaro; Tanimoto,Mitsuyoshi; Kusaka,Hiroyuki, Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components.
  22. Tomioka,Kentaro, Electronic apparatus having pump unit.
  23. Wang, Hao, Evaporation-condensation systems and methods for their manufacture and use.
  24. Zhou, Shi-Wen; Chen, Chun-Chi, Heat dissipation device.
  25. Wang, Hao, Heat dissipation utilizing flow of refrigerant.
  26. Hata, Yukihiko; Tomioka, Kentaro, Heat-Receiving apparatus and electronic equipment.
  27. Zoodsma, Randy J., Hybrid heat sink with recirculating fluid and interleaving fins.
  28. Roy,Sanjay K., Impeller driven active heat sink.
  29. Yeh,Yun Yu; Tung,Chia Ming; Lin,Chien Kai, Integrated heat dissipating assembly.
  30. Liu,Tay Jian; Yang,Chih Hao; Tung,Chao Nien; Hou,Chuen Shu, Integrated liquid cooling system for electronic components.
  31. Matsushita,Shinji; Oikawa,Hironori, Liquid cooling module.
  32. Liu,Tay Jian; Lee,Chih Peng, Liquid cooling system suitable for removing heat from electronic components.
  33. Duan,Qiang Fei; Lo,Lieh Feng, Liquid-cooling heat dissipation apparatus.
  34. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  35. Chou, Der Jeou, Method and apparatus for thermally effective removable trim for light fixture.
  36. Chou,Der Jeou; Nelson,Daniel Todd, Methods and apparatus for an integrated fan pump cooling module.
  37. Kim,Kwang Ho; Song,Gwi Eun; Jeon,Jae Hak; Lee,Yoon Pyo, Micro power generator and apparatus for producing reciprocating movement.
  38. Farrow, Timothy Samuel; June, Michael Sean; Makley, Albert Vincent, Minimal fluid forced convective heat sink for high power computers.
  39. Tomioka,Kentaro; Hata,Yukihiko, Pump and electronic device having the pump.
  40. Hata,Yukihiko; Tomioka,Kentaro, Pump, electronic apparatus, and cooling system.
  41. Mounioloux, Stephen, Radiator with integrated pump for actively cooling electronic devices.
  42. Glezer, Ari; Mahalingam, Raghavendran; Heffington, Samuel, Synthetic jet heat pipe thermal management system.
  43. Crocker,Michael T.; Carter,Daniel P.; Kozyra,Kazimierz L., Systems for integrated pump and cold plate.
  44. Crocker, Michael T.; Carter, Daniel P.; Kozyra, Kazimierz L., Systems for integrated pump and reservoir.
  45. Mahalingam, Raghavendran; Glezer, Ari, Thermal management of batteries using synthetic jets.
  46. Wang, Hao, Thin film systems and methods for using same.
  47. Lo,Lieh Feng, Water-cooling heat exchanger and heat-dissipating device for the same.
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