IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0039722
(2001-10-24)
|
발명자
/ 주소 |
- Autterson, Christopher S.
- Haapala, John A.
- Perenic, Jeffery
|
출원인 / 주소 |
- Argent International, Inc.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
8 인용 특허 :
4 |
초록
▼
The bonding of steel locating hinge washers to a hinge assembly to facilitate doors-off/door-on processing through an automotive trim shop. The adhesive bonding system cures during the cathodic electro-cost primer bake cycle. The adhesive maintains an intimate, positive contact with both metal surfa
The bonding of steel locating hinge washers to a hinge assembly to facilitate doors-off/door-on processing through an automotive trim shop. The adhesive bonding system cures during the cathodic electro-cost primer bake cycle. The adhesive maintains an intimate, positive contact with both metal surfaces ensuring adequate bonding performance and maximized bonding surface area during a defined heat or bake cycle.
대표청구항
▼
The bonding of steel locating hinge washers to a hinge assembly to facilitate doors-off/door-on processing through an automotive trim shop. The adhesive bonding system cures during the cathodic electro-cost primer bake cycle. The adhesive maintains an intimate, positive contact with both metal surfa
The bonding of steel locating hinge washers to a hinge assembly to facilitate doors-off/door-on processing through an automotive trim shop. The adhesive bonding system cures during the cathodic electro-cost primer bake cycle. The adhesive maintains an intimate, positive contact with both metal surfaces ensuring adequate bonding performance and maximized bonding surface area during a defined heat or bake cycle. 84. English Language Derwent Abstract of FR 2 738 744, Mar. 21, 1997. English Language Derwent Abstract of FR 2 750 050, Dec. 26, 1997. English Language Derwent Abstract of FR 2 776 518, Oct. 1, 1999. English Language Derwent Abstract of JP 10-324614, Dec. 8, 1998. English Language Derwent Abstract of JP 61-112602, May 30, 1986. English Language Translation of JP 61-187808, Aug. 21, 1986. English Language Derwent Abstract of JP 2001-178541, Jul. 3, 2001. Patent Abstracts of Japan, JP 55 081809, Jun. 20, 1980. Patent Abstracts of Japan, vol. 017, No. 571, Oct. 18, 1993, JP 05 168530. Patent Abstracts of Japan, Vo. 018, No. 521, Sep. 30, 1994, JP 06 179411. Patent Abstracts of Japan, vol. 1999, No. 09, Jul. 30, 1999, JP 11 113638. Patent Abstracts of Japan, vol. 2000, No. 09, Oct. 13, 2000, JP 2000 175942. English language translation of Japanese Patent Application H10-167928, Jun. 23, 1998. English language translation of Japanese Patent Application H10-245319, Sep. 14, 1998. English language translation of Japanese Patent Application H10-287587, Oct. 27, 1998. English language translation of Japanese Laid Open Patent Publication 11-113638, Apr. 27, 1999. From copending U.S. patent application Ser. No. 09/790,794, Attorney Docket No. 08048.0011-00000, Amendment and Response to Electron of Species filed: Oct. 18, 2002; Amendment filed: Apr. 3, 2003; and Supplemental Amendment filed: Apr. 4, 2003. Supplement Amendment filed: Apr. 4, 2003.
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