초록 ▼

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact str

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact structures are disposed along the bottom of the support substrate in electrical contact with the ends of the resilient contact structures. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In an embodiment intended to receive an LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate. In an embodiment intended to receive a BGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate.

대표청구항 ▼

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact str

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact structures are disposed along the bottom of the support substrate in electrical contact with the ends of the resilient contact structures. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In an embodiment intended to receive an LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate. In an embodiment intended to receive a BGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate. US-5092699, 19920300, Silvenis; US-5232298, 19930800, Mitsunari et al.; US-5244124, 19930900, Raffo; US-5373970, 19941200, Ophardt; US-5472122, 19951200, Appleby; US-5496123, 19960300, Gaither; US-5636402, 19970600, Kubo et al.; US-5735959, 19980400, Kubo et al.; US-D396908, 19980800, Beechuk et al.; US-D401703, 19981100, Beechuk et al.; US-5864914, 19990200, Salmon; US-5865551, 19990200, Lalli et al.; US-5888006, 19990300, Ping et al.; US-5988920, 19991100, Kunkler et al.; US-6000088, 19991200, Wright et al.; US-6045622, 20000400, Holt et al.; US-6170114, 20010100, Woodnorth et al.; US-6171004, 20010100, Derhammer; US-6206058, 20010300, Nagel et al.; US-6227744, 20010500, Fodrocy et al.; US-D462150, 20020800, Rader et al.; US-6427730, 20020800, Nagel et al.; US-6491069, 20021200, Nagel et al.; US-20010006588, 20010700, Zorzo; US-20020083964, 20020700, McKay; US-20030034084, 20030200, Nagel et al.