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The present invention relates to water treatment, in particular to a process for the removal of dissolved organic carbon from water. The process includes the following steps, adding an ion-exchange resin to water containing a contaminant such as dissolved organic carbon, dispersing the resin in the

The present invention relates to water treatment, in particular to a process for the removal of dissolved organic carbon from water. The process includes the following steps, adding an ion-exchange resin to water containing a contaminant such as dissolved organic carbon, dispersing the resin in the contaminated water to enable adsorption of the dissolved organic carbon onto the resin, and separating the resin loaded with contaminant from the water. In a preferred embodiment the process employs a magnetic ion-exchange resin.

대표청구항 ▼

The present invention relates to water treatment, in particular to a process for the removal of dissolved organic carbon from water. The process includes the following steps, adding an ion-exchange resin to water containing a contaminant such as dissolved organic carbon, dispersing the resin in the

The present invention relates to water treatment, in particular to a process for the removal of dissolved organic carbon from water. The process includes the following steps, adding an ion-exchange resin to water containing a contaminant such as dissolved organic carbon, dispersing the resin in the contaminated water to enable adsorption of the dissolved organic carbon onto the resin, and separating the resin loaded with contaminant from the water. In a preferred embodiment the process employs a magnetic ion-exchange resin. , and the first and second cathodes are connected to an adjustable power supply. 14. The process of claim 1 wherein: the openings are formed between parallel wires extending across the substrate, and the first and second cathodes are connected to an adjustable power supply. 15. The process of claim 1 wherein: the openings comprise a wire mesh extending across the substrate, and the first and the second cathodes are connected to an adjustable power supply. 16. The process of claim 1 wherein: the openings comprise apertures through the second cathode extending across the substrate and the first cathode, and the second cathode are connected to the same power supply with a resistor in series with the second cathode. 17. The process of claim 1 wherein: the openings are formed between parallel wires extending across the substrate, and the first and second cathodes are connected to the same power supply with a resistor in series with the second cathode. 18. The process of claim 1 wherein: the openings comprise a wire mesh extending across the substrate, and the first and second cathodes are connected to the same power supply with a resistor in series with the second cathode. 19. A process for electroplating metal features onto a substrate having a top side including a plating surface comprising: providing a plating tank with a bottom, side walls, a front wall and a back wall and containing an electroplating bath with an anode at a positive voltage, placing a substrate to be electroplated into the electroplating bath, connecting surfaces to be plated to a first cathode which is at a first negative voltage, providing agitating means for agitating the electrolyte inside the tank, the agitating means including a paddle and suspension means for reciprocating the paddle in the plating bath along a paddle path between the front and back walls and parallel to the surfaces to be plated in very close proximity thereto with the paddle path being spaced on the order of 4 mm from the substrate, supporting a second cathode including a partially open screening electrode at a second negative voltage, the screening electrode being located in close proximity to the first cathode and to the substrate in juxtaposition therewith between the substrate and the paddle path, the structure of the screening electrode being selected from the group consisting of a plating mesh, an aperture plate, and an array of parallel wires, whereby the portion of the second cathode with the partially open screening electrode maintains the second cathode voltage at a substantially uniform value across the substrate, thereby dominating the electropotential in the bath across the total surface area of the substrate. 20. The process of claim 19 wherein: the openings comprise a wire mesh extending across the substrate, and the first and second cathodes are connected to power supplied in a manner selected from the group consisting of as follows: connecting the second cathode in series with a resistor to the power supply, and connecting the first and second cathodes with a resistor in series with the second cathode to the power supply which is adjustable. 21. Apparatus for electroplating metal features onto a workpiece comprising a substrate having a top side including a plating surface comprising: a plating tank with an electroplating bath and an anode in the bath, with the anode being connected to a positive voltage, means for placing a substrate having plating surfaces to be electroplated in the electroplating bath, means for connecting the substrate to a first cathode, with the first cathode being connected to a first negative voltage, agitating means for agitating the electroplating bath inside the tank, the agitating means including a paddle and suspension means for reciprocating the paddle along a paddle path parallel to the plating surfaces in the plating bath, a second cathode connected to means for supplying a sec