초록 ▼

With interferometric test systems, the test object is frequently measured over several sections in order to realize a complete test. If special structural features are found, in particular defects, it is usually difficult to localize the structural features shown on the result images on the object.

With interferometric test systems, the test object is frequently measured over several sections in order to realize a complete test. If special structural features are found, in particular defects, it is usually difficult to localize the structural features shown on the result images on the object. It is the object of the present method to transfer the interferometrically measured data from the various sections to a joint object coordinate system. To achieve this object, the shape of the object is measured and the spatial coordinates for the deformation data on the object surface are determined from this measured. Thus, a method is realized which permits determining the exact spatial orientation and position of the discovered structural features on the object. On the one hand, the defects on the object can thus be localized precisely while, on the other hand, an exact quantitative evaluation of the results is possible.

대표청구항 ▼

With interferometric test systems, the test object is frequently measured over several sections in order to realize a complete test. If special structural features are found, in particular defects, it is usually difficult to localize the structural features shown on the result images on the object.

With interferometric test systems, the test object is frequently measured over several sections in order to realize a complete test. If special structural features are found, in particular defects, it is usually difficult to localize the structural features shown on the result images on the object. It is the object of the present method to transfer the interferometrically measured data from the various sections to a joint object coordinate system. To achieve this object, the shape of the object is measured and the spatial coordinates for the deformation data on the object surface are determined from this measured. Thus, a method is realized which permits determining the exact spatial orientation and position of the discovered structural features on the object. On the one hand, the defects on the object can thus be localized precisely while, on the other hand, an exact quantitative evaluation of the results is possible. 4. The method of claim 23 wherein said N channel metal oxide semiconductor field effect transistor switch comprises: providing a second output node; providing a ground node; and providing a third transistor wherein said third transistor is an N channel metal oxide semiconductor field effect transistor having a source, a gate, and a drain; connecting said source of said third transistor to said second node; connecting said gate of said third transistor to said second node; and connecting said drain of said third transistor to said second output node. 25. The method of claim 22 wherein said multistage charge pump circuit is a four phase charge pump circuit. 26. The method of claim 22 wherein said multistage charge pump circuit is a two phase charge pump circuit. 27. The method of claim 22 wherein said first capacitor has a capacitance of between about 0.6 and 0.8 picofarads. 28. The method of claim 22 wherein said second capacitor has a capacitance of between about 0.06 and 0.08 picofarads. 29. The method of claim 22 wherein the voltage at the second clock node is low when the voltage at the first clock node is high. 30. The method of claim 22 wherein the voltage at the first clock node is low when the voltage at the second clock node is high. 31. The method of claim 22 wherein said first diode is replaced by a third transistor, said third transistor is a metal oxide semiconductor field effect transistor connected in diode mode, said second diode is replaced by a fourth transistor, and said fourth transistor is a metal oxide semiconductor field effect transistor connected in diode mode.