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Passive thermal spreader and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0677720 (2000-10-02)
발명자 / 주소
  • Lin, Lanchao
  • Leland, John E.
출원인 / 주소
  • The United States of America as represented by the Secretary of the Air Force
대리인 / 주소
    Lambert, Richard A.Scearce, Bobby D.Kundert, Thomas L.
인용정보 피인용 횟수 : 28  인용 특허 : 10

초록

A passive thermal spreader and method of fabrication are disclosed. The passive thermal spreader includes a heat transfer plate formed from laminated plates including an internal sealed thermosyphon defined within the interface of the plates. The preferred embodiment of the passive thermal spreader

대표청구항

1. A passive thermal spreader, comprising; a heat transfer plate including a first plate and a second plate; a thermosyphon within said heat transfer plate defined within the interface of said first and second plates, said thermosyphon having a plurality of channels arranged boustrophedonically,

이 특허에 인용된 특허 (10)

  1. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
  2. Patel Ramchandra L. (Southgate MI) Patel Chhotubhai N. (Farmington Hills MI), Heat exchanger structure.
  3. Wargo Alec, Heat sink device for power semiconductors.
  4. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  5. Rosman Irwin E. (Woodland Hills CA) Wagner William R. (Los Angeles CA), Internally manifolded unibody plate for a plate/fin-type heat exchanger.
  6. Ikegame Hiroo (Tokyo JPX) Nonaka Shigeo (Yokohama JPX) Ito Takuro (Yokohama JPX) Matsumoto Toshiaki (Tokyo JPX), Method for producing heat sink and heat sink thus produced.
  7. Skoog Malte (Tumba SEX), Plate heat exchanger.
  8. Lee Yung (Ontario CAX) Park Hern Jin (Ansan-si KRX), Plate type heat transfer device.
  9. Akachi Hisateru (Sagamihara JPX), Ribbon-like plate heat pipes.
  10. Akachi Hisateru (No. 6-5-603 ; Kamitsuruma 5-chome Sagamihara City ; Kanagawa Perfecture JPX), Tunnel-plate type heat pipe.

이 특허를 인용한 특허 (28)

  1. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion.
  2. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  3. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  4. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  5. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  6. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  7. Moon, Seok Hwan; Hwang, Gunn, Flat plate type micro heat transport device.
  8. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Geometrically reoriented low-profile phase plane heat pipes.
  9. Kamoshida, Osamu; Nobusue, Mitsuru, Heat exchanger with thermal storage function.
  10. Quisenberry,Tony; Havis,Clark R., Heat pipe connection system and method.
  11. Tsoi, Vadim; Henningsson, Uno; Hong, Yuping; Peng, Feng; Yang, Hua; Li, Haipeng, Heat spreading device and method with sectioning forming multiple chambers.
  12. Quisenberry, Tony, Method and system for automotive battery cooling.
  13. Quisenberry, Tony, Method for automotive battery cooling.
  14. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Method of removing heat utilizing geometrically reoriented low-profile phase plane heat pipes.
  15. Hardesty, Robert E., Micro-channel pulsating heat pipe.
  16. Short, Jr., Byron Elliott; Francis, Nathan R.; Brandt, David B., Multi-level oscillating heat pipe implementation in an electronic circuit card module.
  17. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  18. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  19. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
  20. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
  21. Parish, Overton L.; DeVilbiss, Roger S., Stacked low profile cooling system and method for making same.
  22. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  23. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  24. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  25. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  26. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  27. Quisenberry,Tony; Hester,Darren C.; Parish,Overton L., Toroidal low-profile extrusion cooling system and method thereof.
  28. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
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