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Method of manufacturing a heat sink assembly with overmolded carbon matrix 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-045/14
출원번호 US-0774521 (2001-01-31)
발명자 / 주소
  • McCullough, Kevin A.
출원인 / 주소
  • Cool Options, Inc.
대리인 / 주소
    Barlow, Josephs & Holmes, Ltd.
인용정보 피인용 횟수 : 19  인용 특허 : 57

초록

A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductive polymer co

대표청구항

1. A method of forming a net-shape molded heat sink, comprising: providing a core plate of carbon-carbon matrix material having an outer surface with a first portion and section portion; injection overmolding a thermally conductive main body, having a top surface and a bottom interface surface a

이 특허에 인용된 특허 (57)

  1. Terasaka Shinji,JPX, Anisotropic conductive film.
  2. Matsui Koji (Tokyo JPX), Anisotropic conductive material and method for connecting integrated circuit element by using the anisotropic conductive.
  3. Rowlette John R. (Clemmons NC), Anisotropically electrically conductive composition with thermal dissipation capabilities.
  4. Kawaguchi Toshiyuki (Ageo JPX) Suzuki Hideki (Omiya JPX), Anisotropically electroconductive film adhesive.
  5. Kendel Michael L. (New Braunfels TX), Circuit board for a component requiring heat sinkage.
  6. Kaufman Lance R. (131 N. White Oak Way Mequon WI 53092), Circuit package with thermal expansion relief chimney.
  7. Kathirgamanathan Poopathy (Middlesex GBX), Coated particulate metallic materials.
  8. de Sorgo Miksa, Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer hav.
  9. Abrams John C. (Tappan NY), Conductive paste, electroconductive body and fabrication of same.
  10. Barma Pradeep (Fremont CA) Chan Chi-Ming (Cupertino CA) Mohebban Manoochehr (Foster City CA) Rosenzweig Nachum (Palo Alto CA), Conductive polymer composition.
  11. Chu Edward F. (Sunnyvale CA) Thein Nelson H. (Union City CA) Reddy Vijay (San Mateo CA) Chandler Daniel A. (Menlo Park CA), Conductive polymer composition and device.
  12. Yoshinaka Minoru (Osaka JPX) Asakura Eizo (Osaka JPX) Oku Mitsumasa (Osaka JPX) Kitano Motoi (Kawanishi JPX) Nakatani Yoshio (Chigasaki JPX) Yoshida Hideyuki (Amagasaki JPX) Hatta Toshiya (Kamakura J, Conductive resin composition containing zinc oxide whiskers having a tetrapod structure.
  13. Okamura Michiya (Yokkaichi JPX) Yui Hiroshi (Yokkaichi JPX) Matsuo Norio (Yokkaichi JPX) Hamano Shuji (Yokkaichi JPX) Hatakeyama Takeshi (Yokkaichi JPX), Conductive thermoplastic resin composition.
  14. Welage Norbert A. (Forest Lake MN), Conformable electrically conductive compositions.
  15. Samarov Victor M. (Carlisle MA) Larson ; Jr. Ralph I. (Bolton MA) Doumani George A. (No. Andover MA), Conformal heat sink for electronic module.
  16. Quella Ferdinand (Neubiberg DEX) Leute Ulrich (Zorneding DEX), Cross-linked polymer coated metal particle filler compositions.
  17. Lee Sang S. (Sunnyvale CA) Fujimoto George (Santa Clara CA), Design for encapsulation of thermally enhanced integrated circuits.
  18. Patterson Timothy P. (Costa Mesa CA) Hoge Carl E. (Encinitas CA), Directionally conductive polymer.
  19. Shuff Gregg Douglas, Electrical circuit cooling device.
  20. Hyatt Hugh M. (Camarillo CA), Electrical overstress pulse protection.
  21. Honda Toshimitsu (Gumma JPX) Yamada Tadahiko (Gumma JPX) Onikata Kazuji (Gumma JPX) Tosaka Shoichi (Gumma JPX), Electrical resistors, electrical resistor paste and method for making the same.
  22. Fukuda Masao (Moka JPX) Fujiwara Tsutae (Tochigi JPX), Electrically conductive material for molding.
  23. Gold Glenn E. (Coconut Creek FL) Suppelsa Anthony B. (Coral Springs FL) Suppelsa Anthony J. (Coral Springs FL), Encapsulated electronic component having a heat diffusing layer.
  24. Hill Richard Frank (Chagrin Falls OH) DaVanzo Stephen Phillip (Chagrin Falls OH), Enhanced boron nitride composition and polymer based high thermal conductivity molding compound.
  25. Duva Frank A. ; Azodi-Kazerooni Mansoor, Feed-through filter capacitor assembly.
  26. McArdle Ciaran B.,IEX ; Burke Joseph,IEX, Films and coatings having anisotropic conductive pathways therein.
  27. Davies Bill Tempest,CAX ; Harris Mark Roy,CAX, Flexible integrated circuit package.
  28. Teichmann Robert J. (Towaco NJ) Walther James F. (Mountain Lakes NJ) Wasowicz Andrew M. (West Patterson NJ), Galvanically compatible conductive filler useful for electromagnetic shielding and corrosion protection.
  29. Gengel Glenn W., Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer.
  30. Mariner John Thomas ; Sayir Haluk, High thermal conductivity composite and method.
  31. Ohishi Naoaki (Machida JPX) Sakaida Toshiaki (Shiojiri JPX) Hasegawa Mitsuru (Shiojiri JPX) Hiramatsu Iwao (Shiojiri JPX), Highly thermal conductive and electrical insulating substrate.
  32. Schnberger Eduard (Kmmersbruck DEX) Gruber Stefan (Kmmersbruck DEX) Kasowski Hermann (Kastl DEX) Schmidt Heinz (Kmmersbruck DEX), Insulating part with integral cooling element.
  33. Unger Scott M. ; Riddle Guy T., Integrated circuit heat transfer element and method.
  34. Sono, Michio; Kasai, Junichi, Method and apparatus for a semiconductor device having a radiation part.
  35. Frank Louis Pompeo ; Alain A. Caron CA; Jeffrey Thomas Coffin ; Jeffrey Allen Zitz, Method for direct attachment of a chip to a cooling member.
  36. Koskenmaki David C. (St. Paul MN) Calhoun Clyde D. (Stillwater MN), Method of forming electrically conductive structured sheets.
  37. AuYeung David S. (Austin TX), Molded heat sink for integrated circuit package.
  38. Okamoto Kenji (Kanagawa JPX) Nakajima Yukio (Kanagawa JPX) Imamura Kazuhiko (Kanagawa JPX) Ichihara Takao (Kanagawa JPX), Multilayered printed board structure.
  39. Soens Lode J. (Kortrijk BEX), Plastic article containing electrically conductive fibers.
  40. Soens Lode J. (Oudstrijderslaan 11 B-8710 Kortrijk (Heule) BEX), Plastic article containing electrically conductive fibers.
  41. Kitano Makoto (Tsuchiura) Nishimura Asao (Ushiku) Yaguchi Akihiro (Ibaraki) Yoneda Nae (Ibaraki) Kohno Ryuji (Ibaraki) Kawai Sueo (Ibaraki) Murakami Gen (Tama) Shimizu Ichio (Gunma JPX), Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin st.
  42. Benefield, Joseph A., Process for forming molded heat dissipation devices.
  43. Okamura Michiya (Ibaraki JPX) Konno Tetsuo (Ibaraki JPX) Sagisaka Kouichi (Ibaraki JPX) Ikeda Masakazu (Mie JPX), Process for producing a resin compound.
  44. Wyland Christopher Paul, Semiconductor package with internal heatsink and assembly method.
  45. Durand David (Providence RI), Shielded plastic enclosure to house electronic equipment.
  46. Oehmke ; Richard W., Soft conductive materials.
  47. Toya Masanori (Gunma JPX), Thermal conductive silicone composition.
  48. Latham Carol A. (Lakewood OH) McGuiggan Michael F. (Shaker Heights OH), Thermally conductive ceramic/polymer composites.
  49. McCullough Kevin A., Thermally conductive composite material.
  50. Nelson Richard D. (1500 Cliffside Dr. Austin TX 78704) Dolbear Thomas P. (4009 Eton La. Austin TX 78727) Froehlich Robert W. (9005 Middlebie Dr. Austin TX 78750), Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal.
  51. Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL), Thermally conductive integrated circuit package with radio frequency shielding.
  52. Peterson Adam L. (Midland MI), Thermally conductive organosiloxane compositions.
  53. Hanrahan James R., Thermally conductive polytrafluoroethylene article.
  54. Zhuo Qizhuo ; Harris Ronald M. ; Skovran Dennis C. ; Lightner Leo F. ; Randall Michael S. ; Stygar Vernon E., Thermally conductive thermoplastic.
  55. Nakamura Toshio (Kanagawa JPX) Soeda Yoshimi (Kanagawa JPX) Miyasaka Toshifumi (Kanagawa JPX) Iwata Minoru (Kanagawa JPX), Thermotropic liquid crystal polymer composition and insulator.
  56. Harding Ade\yemi S. K. (12513 Hunters Chase Dr. Austin TX 78729), Unitized packaging arrangement for an energy dissipating device.
  57. Teruo Okamoto (Osaka JPX), Variable-resistance conductive elastomer.

이 특허를 인용한 특허 (19)

  1. Wayman, Michael J., Apparatus for directing heat to a heat spreader.
  2. Wayman, Michael J., Apparatus for spreading heat over a finned surface.
  3. Wayman, Michael J.; Nelson, Michael J., Apparatus for transferring heat in a fin of a heat sink.
  4. Atarashi, Takayuki; Fukuda, Hiroshi; Fujita, Kenji, Dish array apparatus with improved heat energy transfer.
  5. Sagal, E. Mikhail; Panek, Jeffrey; McCullough, Kevin A., Elastomeric heat sink with a pressure sensitive adhesive backing.
  6. McCutcheon, Jeffrey W.; Narum, Timothy N.; Soo, Philip P.; Liu, Yaoqi J., Flexible heat sink.
  7. McCutcheon,Jeffrey W.; Narum,Timothy N.; Soo,Philip P.; Liu,Yaoqi J., Flexible heat sink.
  8. Yoo, Jae-Wook; Choi, Kyoung-Sei; Cho, Eun-Seok; Choi, Mi-Na; Hwang, Hee-Jung; Bae, Se-Ran, Flexible heat sink having ventilation ports and semiconductor package including the same.
  9. Hegde, Shankar, High performance cooling device with side mount fan.
  10. Miller,James, High-density, thermally-conductive plastic compositions for encapsulating motors.
  11. Davis, Terry G.; Rocco, David; Sagal, Mikhail; McCanna, Jessee; Sunderland, Nicolas; Lorenzo, James; Matsco, Mark; Dunay, Kevin, In mold electronic printed circuit board encapsulation and assembly.
  12. Chiang, Tsai Liang; Wu, Takashi, Integrated heat dissipating device with curved fins.
  13. Chandrasekaran, Arvind, Microfabricated pillar fins for thermal management.
  14. Chandrasekaran, Arvind, Microfabricated pillar fins for thermal management.
  15. Glenn, Darin; Blackburn, Scott, Molded body and electrical device having a molded body for high voltage applications.
  16. Krassowski,Daniel W.; Chen,Gary G., Optimized heat sink using high thermal conducting base and low thermal conducting fins.
  17. Misra, Sanjay, Thermal diffusion apparatus.
  18. Jewram, Radesh; Misra, Sanjay, Thermally and electrically conductive interconnect structures.
  19. Hegde,Shankar, Twin fin arrayed cooling device.
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