A complex profile made of a composite comprising a polyolefin polymer and a wood fiber. The composite is useful in conventional structural applications. The profile can be used in residential and commercial structures. The profile is used in the manufacture of the fenestration components such as win
A complex profile made of a composite comprising a polyolefin polymer and a wood fiber. The composite is useful in conventional structural applications. The profile can be used in residential and commercial structures. The profile is used in the manufacture of the fenestration components such as windows and doors. The profile is designed with a cross-sectional shape to form structural elements in the fenestration units that possess sufficient strength, thermal stability and weatherability. The member comprises a hollow cross-section with at least one structural web or one fastener web. The profile can have a visible capstock layer and can be assembled using thermal welding processes.
대표청구항▼
A complex profile made of a composite comprising a polyolefin polymer and a wood fiber. The composite is useful in conventional structural applications. The profile can be used in residential and commercial structures. The profile is used in the manufacture of the fenestration components such as win
A complex profile made of a composite comprising a polyolefin polymer and a wood fiber. The composite is useful in conventional structural applications. The profile can be used in residential and commercial structures. The profile is used in the manufacture of the fenestration components such as windows and doors. The profile is designed with a cross-sectional shape to form structural elements in the fenestration units that possess sufficient strength, thermal stability and weatherability. The member comprises a hollow cross-section with at least one structural web or one fastener web. The profile can have a visible capstock layer and can be assembled using thermal welding processes. rmining an error value and adjusting a characteristic are performed by a digital computer, further wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, further wherein adjusting a characteristic includes adjusting a rate at which the valve changes from the closed state to the open state. 3. The method of claim 1, further comprising selecting the flowable substance to include a photoresist material, and wherein receiving an image includes receiving a video image, further wherein determining an error value and adjusting a characteristic are performed by a digital computer, and wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, still further wherein adjusting a characteristic includes adjusting a rate at which the valve changes from the closed state to the open state. 4. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein initiating the flow of the flowable substance includes transmitting a signal from a digital computer to the valve to change the valve from the closed state to the open state. 5. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein initiating the flow of flowable substance includes transmitting a signal to the valve to change from the closed state to the open state. 6. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein the method further comprises selecting the first point in time to correspond to a time at which a signal is transmitted to the valve, the signal causing the valve to change from the closed state to the open state. 7. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein initiating the flow includes transmitting an electrical signal to a solenoid to move the solenoid, with the movement of the solenoid changing a flow of air operatively coupled to a portion of a valve that changes from a closed position to an open position. 8. The method of claim 1 wherein initiating the flow toward the microelectronic substrate includes initiating the flow along a fluid path that leads toward the microelectronic substrate. 9. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein adjusting a characteristic includes manually adjusting a rate at which the valve changes to the open state. 10. The method of claim 1 wherein a digitally controlled valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein adjusting a characteristic includes automatically adjusting a rate at which the valve changes to the open state. 11. The method of claim 1 wherein adjusting a characteristic includes adjusting a characteristic when the error value exceeds a target error value of approximately 0.4 second. 12. The method of claim 1 wherein adjusting a characteristic includes adjusting a characteris tic when the error value exceeds a target error value of about 0.01 second. 13. The method of claim 1 wherein the microelectronic substrate is a first microelectronic substrate and adjusting a characteristic is performed after dispensing the flowable substance on the first microelectronic substrate and before dispensing the flowable substance on a second microelectronic substrate. 14. The method of claim 1 wherein adjusting a characteristic is performed while dispensing the flowable substance on the microelectronic substrate. 15. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein adjusting a characteristic includes adjusting a rate at which the valve moves from the closed state to the open state. 16. The method of claim 1 wherein a fluid path between a source of the flowable substance and the microelectronic substrate includes a valve configured to selectively reverse movement of the flowable substance toward the microelectronic substrate, and wherein adjusting a characteristic includes adjusting a rate at which the valve reverses the movement of the flowable substance. 17. The method of claim 1 wherein adjusting a characteristic includes adjusting a pressure at which the flowable substance is directed along a fluid path toward the microelectronic substrate. 18. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein adjusting a characteristic includes adjusting a flow area of the valve in the open state. 19. The method of claim 1 wherein a valve is positioned along a flow path of the flowable substance between a source of the flowable substance and the microelectronic substrate, the valve having an open state and a closed state, and wherein a pump is positioned in fluid communication with the flow path, still further wherein adjusting a characteristic includes adjusting a length of time between activating the pump and opening the valve by increasing the length of time when the elapsed time is greater than the target time and decreasing the length of time when the elapsed time is less than the target time. 20. The method of claim 1 wherein determining an elapsed time includes determining an elapsed time between the first time and a time when about 20% of the field is covered with the flowable substance. 21. The method of claim 1 wherein the microelectronic substrate is one of a plurality of microelectronic substrates, and wherein the method further includes disposing the flowable substance on the plurality of microelectronic substrates to an average thickness that varies by less than about ten angstroms from one substrate to another. 22. The method of claim 1 wherein dispensing includes dispensing the flowable substance on the microelectronic substrate to a thickness that varies by less than about 15 angstroms over the surface of the microelectronic substrate. 23. The method of claim 1 wherein initiating, dispensing, receiving, determining, and adjusting are performed with a first apparatus on a first microelectronic substrate, and wherein the method further includes performing these processes with a plurality of apparatuses on a corresponding plurality of microelectronic substrates to form a corresponding plurality of photoresist layers having an average thickness that varies by less than about 15 angstroms for layers formed on one apparatus to layers formed on the next apparatus. 24. The method of claim 1, further comprising selecting the flowable substance to include a photoresist material. 25. The method of claim 1 wherein the portion of the flowable substance is a first portion, and wherein the method further comprises disposing a second portion of the flowable
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