초록 ▼

A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection b

A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection between the image sensor and a circuit board. The package structure and the powered lens element include complementary surfaces that enable the powered lens element to be attached to the image sensor package. Preferably, the powered lens element is glued to the package structure to create a sealed environment for the image sensor. In an embodiment, a temporary protective cover is attached to the powered lens element to protect the powered lens element during attachment of the image sensor package to the circuit board. In an embodiment of the digital image capture system, an additional powered lens element is attached to the powered lens element to create a composite lens element. In an embodiment of the digital image capture system, the powered lens element includes an opaque surface that prevents unwanted light from contacting the image sensor. An advantage of the digital image capture system is that no additional lens mounting structures are required to attach a powered lens element to the image sensor package.

대표청구항 ▼

A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection b

A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection between the image sensor and a circuit board. The package structure and the powered lens element include complementary surfaces that enable the powered lens element to be attached to the image sensor package. Preferably, the powered lens element is glued to the package structure to create a sealed environment for the image sensor. In an embodiment, a temporary protective cover is attached to the powered lens element to protect the powered lens element during attachment of the image sensor package to the circuit board. In an embodiment of the digital image capture system, an additional powered lens element is attached to the powered lens element to create a composite lens element. In an embodiment of the digital image capture system, the powered lens element includes an opaque surface that prevents unwanted light from contacting the image sensor. An advantage of the digital image capture system is that no additional lens mounting structures are required to attach a powered lens element to the image sensor package. 19930800, Garvey et al.; US-5254821, 19931000, Walters; US-5300746, 19940400, Walters et al.; US-5411202, 19950500, Fenini; US-5464969, 19951100, Miller; US-5530231, 19960600, Walters et al.; US-5698127, 19971200, Lai et al.; US-5772111, 19980600, Kirsch; US-5826786, 19981000, Dickert; US-5830548, 19981100, Andersen et al., 428/036.4; US-5839653, 19981100, Zadravetz; US-5858487, 19990100, Boehler et al., 428/034.3; US-6054698, 20000400, Mast; US-6102281, 20000800, Lafferty et al.; US-6114679, 20000900, Lai et al.; US-6133560, 20001000, Zeng et al.; US-6150646, 20001100, Lai et al.; US-6196408, 20010300, Setty et al.; US-6251451, 20010600, Zeng; US-6259079, 20010700, Ji et al.; US-6261611, 20010700, Berman; US-6386438, 20020500, Walsh et al.; US-20020037344, 20020300, Montserrate Gibernau, 426/112