초록 ▼

Method and structures are provided for conformal lining of dual damascene structures in integrated circuits, and particularly of openings formed in porous materials. Trenches and contact vias are formed in insulating layers. The pores on the sidewalls of the trenches and vias are blocked, and then t

Method and structures are provided for conformal lining of dual damascene structures in integrated circuits, and particularly of openings formed in porous materials. Trenches and contact vias are formed in insulating layers. The pores on the sidewalls of the trenches and vias are blocked, and then the structure is exposed to alternating chemistries to form monolayers of a desired lining material. In exemplary process flows chemical or physical vapor deposition (CVD or PVD) of a sealing layer blocks the pores due to imperfect conformality, and is followed by an atomic layer deposition (ALD), particularly alternately pulsed metal halide and ammonia gases injected into a constant carrier flow. An alternating process can also be arranged to function in CVD-mode within pores of the insulator, since the reactants do not easily purge from the pores between pulses. Self-terminated metal layers are thus reacted with nitrogen. Near perfect step coverage allows minimal thickness for a diffusion barrier function, thereby maximizing the volume of a subsequent filling metal for any given trench and via dimensions.

대표청구항 ▼

Method and structures are provided for conformal lining of dual damascene structures in integrated circuits, and particularly of openings formed in porous materials. Trenches and contact vias are formed in insulating layers. The pores on the sidewalls of the trenches and vias are blocked, and then t

Method and structures are provided for conformal lining of dual damascene structures in integrated circuits, and particularly of openings formed in porous materials. Trenches and contact vias are formed in insulating layers. The pores on the sidewalls of the trenches and vias are blocked, and then the structure is exposed to alternating chemistries to form monolayers of a desired lining material. In exemplary process flows chemical or physical vapor deposition (CVD or PVD) of a sealing layer blocks the pores due to imperfect conformality, and is followed by an atomic layer deposition (ALD), particularly alternately pulsed metal halide and ammonia gases injected into a constant carrier flow. An alternating process can also be arranged to function in CVD-mode within pores of the insulator, since the reactants do not easily purge from the pores between pulses. Self-terminated metal layers are thus reacted with nitrogen. Near perfect step coverage allows minimal thickness for a diffusion barrier function, thereby maximizing the volume of a subsequent filling metal for any given trench and via dimensions. rein said barrier coating further extends from said liner ply onto said form adjacent to said window. 34. A label according to claim 24, wherein said form further comprises a fold line that intersects said window such that folding said form about said fold line breaks said barrier coating free from either said label ply or said liner ply. 35. A label according to claim 24, when said barrier coating further extends from said liner ply within said window to said form adjacent to said window. 36. A combination label and form comprising; a form having a form face; a liner ply adhesively held to said form; a label having a label face and a label back, said label back releasably held to said liner ply; and a barrier coating applied to said label such that said barrier coating overlies at least a portion of said label face and extends onto said form adjacent to said liner ply, so as to limit said adhesive from exuding beyond said barrier coating by passing thereunder. 37. A label according to claim 36 wherein said label has a label edge, and said barrier coating straddles said label edge and extends onto said form adjacent to said liner ply. 38. A label according to claim 36 wherein said barrier coating overlies the entire label ply and extends onto said form adjacent to said liner ply. 39. A label according to claim 36 wherein said barrier coat forms a continuous film. 40. A label according to claim 36 wherein said barrier coating is selected from the group consisting of a protective varnish, a toner enhancement coating and a silicone. 41. A label sheet comprising: a liner ply having a ply face; a plurality of label plies, each of said plurality of label plies having a label face and a label periphery; an adhesive applied between each of said plurality of label plies and said liner ply; and a barrier coating that overlaps and bridges at least a portion of said label peripheries of adjacent ones of said plurality of label plies on respective label faces, so as to limit said adhesive from exuding beyond said barrier coating by passing thereunder so as to become exposed on a face of said label sheet. 42. A label sheet according to claim 41, wherein select ones of said plurality of label plies are positioned on said liner ply so as to be generally abutting. 43. A label sheet according to claim 41, wherein select ones of said plurality of label plies are positioned on said liner ply so as to be generally non-abutting. 44. A label sheet acc