초록 ▼

A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, and higher reliability is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between parts o

A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, and higher reliability is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A castellation is formed to create a riser surrounding the semiconductor chip. The height of the castellations can be made to a desired height so that proper clearance of the semiconductor chip and the glass window is achieved. A transparent window is placed on the top of the castellations. A liquid encapsulant is formed to protectively seal the non-ceramic image sensor semiconductor package thereby shielding the semiconductor chip and vision chip active area from the external environment. Because the same or similar materials are used in the package, the adhesion between these parts is very strong, thus providing a highly reliable device at a lower cost.

대표청구항 ▼

A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, and higher reliability is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between parts o

A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, and higher reliability is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A castellation is formed to create a riser surrounding the semiconductor chip. The height of the castellations can be made to a desired height so that proper clearance of the semiconductor chip and the glass window is achieved. A transparent window is placed on the top of the castellations. A liquid encapsulant is formed to protectively seal the non-ceramic image sensor semiconductor package thereby shielding the semiconductor chip and vision chip active area from the external environment. Because the same or similar materials are used in the package, the adhesion between these parts is very strong, thus providing a highly reliable device at a lower cost. 00, Ross, 361/767; US-D459317, 20020600, Fukumoto et al., 257/668; US-6410859, 20020600, King, 174/260; US-6506981, 20030100, Liberkowski, 174/262