Method of co-forming metal foam articles and the articles formed by the method thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B22F-003/10
B22F-003/20
출원번호
US-0776643
(2001-02-05)
발명자
/ 주소
Haack, David P.
Lin, Chi-Li
Speckert, Michael
출원인 / 주소
Porvair PLC
대리인 / 주소
Kennedy Covington Lobdell & Hickman, LLP
인용정보
피인용 횟수 :
17인용 특허 :
59
초록▼
A method of co-forming a metal article comprising forming a powdered metal component from a first powdered metal composition, providing a polymeric foam, coating the polymeric foam with a second powdered metal composition to form a coated polymeric foam, placing the coated polymeric foam in contact
A method of co-forming a metal article comprising forming a powdered metal component from a first powdered metal composition, providing a polymeric foam, coating the polymeric foam with a second powdered metal composition to form a coated polymeric foam, placing the coated polymeric foam in contact with the powdered metal component to form a composite, and heat-treating the composite to volatilize the polymeric foam and to solidify the powdered metal component. The powdered metal composition of the powdered metal component can be the same or different than the powdered metal composition used to coat the polymeric foam. The resulting co-formed metal article can be in a variety of configurations including, but not limited to, metal foam on the inside or outside surfaces of a metal tube and metal foam on one or more faces of a metal plate.
대표청구항▼
A method of co-forming a metal article comprising forming a powdered metal component from a first powdered metal composition, providing a polymeric foam, coating the polymeric foam with a second powdered metal composition to form a coated polymeric foam, placing the coated polymeric foam in contact
A method of co-forming a metal article comprising forming a powdered metal component from a first powdered metal composition, providing a polymeric foam, coating the polymeric foam with a second powdered metal composition to form a coated polymeric foam, placing the coated polymeric foam in contact with the powdered metal component to form a composite, and heat-treating the composite to volatilize the polymeric foam and to solidify the powdered metal component. The powdered metal composition of the powdered metal component can be the same or different than the powdered metal composition used to coat the polymeric foam. The resulting co-formed metal article can be in a variety of configurations including, but not limited to, metal foam on the inside or outside surfaces of a metal tube and metal foam on one or more faces of a metal plate. um chamber is connected to earth potential, a negative voltage is applied to the target so that a plasma is formed in the vicinity of the surface of the target, and sputtering particles flying off from the target reach a substrate positioned with a surface facing the target so as to form a film on the surface of the substrate, the film forming method, comprising the steps of surrounding with an anode electrode, the periphery of a portion on the target side, of flying space where sputtering particles flying off from the target are flying, of space between the target and the substrate table, the anode electrode having, at an outer periphery of one end thereof, a flange; surrounding the periphery of the portion of flying space of the substrate with an earth electrode; applying a positive voltage to the anode electrode through a conductive terminal which is electrically insulated from the vacuum chamber, the conductive terminal projecting towards an inside portion of the vacuum chamber, and the flange of the anode electrode being mounted on the conductive terminal; connecting the earth electrode to earth potential; sputtering the target; and curving a flying direction of the sputtering particles to the direction of central axis of the anode electrode by the anode electrode, then curving the flying direction in the opposite direction by the earth electrode so t at sputtering particles are incident to the substrate. 6. The film manufacturing method according to claim 5, further comprising the step of applying a negative bias voltage to the substrate. 7. A sputtering apparatus comprising: a vacuum chamber a target positioned within the vacuum chamber; a substrate table located within the vacuum chamber at a position facing the target; an anode electrode surrounding the periphery of a portion, on the target side, of flying space where sputtering particles flying off from the target are flying, of space between the target and the substrate table, the anode electrode having, at an outer periphery of one end thereof, a flange; an earth electrode encompassing a portion, of the remaining portion of the flying space, between the anode electrode and the substrate table and a conductive terminal, electrically insulated from the vacuum chamber, projects towards an inside portion of the vacuum chamber, the flange of the anode electrode being mounted on the conductive terminal, wherein the earth electrode and the anode electrode are electrically insulated from each other and are subjected to the application of different voltages, an upper portion of the anode electrode is curved in a direction where the target is located, and the earth electrode extends towards the axis of the anode electrode at an angle relative to the anode electrode. 8. A sputtering apparatus comprising: a vacuum chamber a target positioned within the vacuum chamber; a substrate table located within the vacuum chamber at a position facing the target; an anode electrode surrounding the periphery of a portion, on the target side, of flying space where sputtering particles flying off from the target are flying, of space between the target and the substrate table the anode electrode having, at an outer periphery of one end thereof, a flange; an earth electrode encompassing a portion, of the remaining portion of the flying space, between the anode electrode and the substrate table; and a conductive terminal, electrically insulated from the vacuum chamber, projects towards an inside portion of the vacuum chamber, the flange of the anode electrode being mounted on the conductive terminal, wherein the earth electrode and the anode electrode are electrically insulated from each other and are subjected to the application of different voltages, a lower portion of the earth electrode is curved in a direction where the substrate table is located, and the earth electrode extends towards the axis of the anode electrode at an angle relative to the anode electr
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