IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0302692
(2002-11-22)
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발명자
/ 주소 |
- Reiss, Edward A.
- Malofsky, Adam G.
- Barber, John P.
- Claypoole, Gary L.
- Cravens, II, Robert Carl
- Pacholok, David R.
- Kuecker, Charles A.
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
20 인용 특허 :
123 |
초록
▼
An apparatus and system for using magnetic fields to heat magnetically susceptible materials within and/or adjacent to adhesives, resins, or composites so as to reversibly or irreversibly bond, bind, or fasten opaque or non-opaque solid materials to one another. The system makes use of the effect th
An apparatus and system for using magnetic fields to heat magnetically susceptible materials within and/or adjacent to adhesives, resins, or composites so as to reversibly or irreversibly bond, bind, or fasten opaque or non-opaque solid materials to one another. The system makes use of the effect that alternating magnetic fields induce eddy currents and generate heat within susceptors, and the effect that alternating magnetic fields additionally induce magnetic hysteresis that occurs in magnetic materials and thereby generate heat. An induction heating tool is used to emit the magnetic field at its work coil, and an electronic controller measures the energy being used by a power converter that generates the alternating current driving the work coil which creates the magnetic field. The distance between the susceptor and work coil is repeatedly analyzed based upon the power converter's input energy, and the work coil is driven at a repeatedly corrected power level during the heating cycle. Once a sufficient accumulated energy has been delivered to the susceptor, the magnetic field is turned off automatically by the tool, thus preventing overheating of the susceptor.
대표청구항
▼
An apparatus and system for using magnetic fields to heat magnetically susceptible materials within and/or adjacent to adhesives, resins, or composites so as to reversibly or irreversibly bond, bind, or fasten opaque or non-opaque solid materials to one another. The system makes use of the effect th
An apparatus and system for using magnetic fields to heat magnetically susceptible materials within and/or adjacent to adhesives, resins, or composites so as to reversibly or irreversibly bond, bind, or fasten opaque or non-opaque solid materials to one another. The system makes use of the effect that alternating magnetic fields induce eddy currents and generate heat within susceptors, and the effect that alternating magnetic fields additionally induce magnetic hysteresis that occurs in magnetic materials and thereby generate heat. An induction heating tool is used to emit the magnetic field at its work coil, and an electronic controller measures the energy being used by a power converter that generates the alternating current driving the work coil which creates the magnetic field. The distance between the susceptor and work coil is repeatedly analyzed based upon the power converter's input energy, and the work coil is driven at a repeatedly corrected power level during the heating cycle. Once a sufficient accumulated energy has been delivered to the susceptor, the magnetic field is turned off automatically by the tool, thus preventing overheating of the susceptor. e vancomycin. 4. The compound of claim 1 which is glucose-C6-2-thio-4-hydroxy-6-methylpyrimidine vancomycin. 5. The compound of claim 1 which is N-4-(4-chlorophenyl)benzylvarcosamine-glucose-C6-2-thio-5-amino-1,3,4-thiadiazole vancomycin. 6. The compound of claim 1 which is N-4-(4-chlorophenyl)benzylvancosamine-glucose-C6-2-thio-4-amino-3-hydrazineo-1,2,4-triazole vancomycin. 7. The compound of claim 1 which is N-4-(4-chlorophenyl)benzylvancosamine-glucose-C6-2-thio-4-hydoxy-6-methylpyrimidine vancomycin. 8. The compound of claim 1 which is N-4-(4-chlorophenyl)benzylvancosamine-glucose-C6-2-thio-4-hydoxy-6-azathymine vancomycin. 9. The compound of claim 1 which is N-4-(4-chlorophenyl)benzylvancosamine-glucose-C6-ido vancomycin. 10. The compound of claim 1 which is glucose-C6-N-2-quinoxalinyl-vancosamine-N-4-(4-chlorophenyl)benzyl vancomycin. 11. The compound of claim 1 which is vancosamine-N-4-(4-chlorophenyl)benzyl-glucose-C6-S-3-amino-5-mercapto-1,2,4-triazole vancomycin. 12. The compound of claim 1 which is glucose-C6-mesitylenesulfonyl vancomycin. 13. The compound of claim 1 which is glucose-C6-iodo vancomycin. 14. The compound of claim 1 which is glucose-C6-azide vancomycin. 15. The compound of claim 1 which is glucose-C6-bromo vancomycin. 16. The compound of claim 1 which is glucose-C6-amine vancomycin. 17. The compound of claim 1 which is glucose-C6-hydrazine vancomycin. 18. The compound of claim 1 which is N-4-(4-chlorophenyl)benzyl vancosamine-glucose-C6-iminotriphenylphosphorane vancomycin. 19. The compound of claim 1 which is glucose-C6-N-decyl vancomycin. 20. The compound of claim 1 which is N-4-(4-chlorophenyl)benzyl vancosamine-glucose-C6-amine vancomycin. of 0.3 nm to 100 nm. 9. A thermoelectric element comprising a thermoelectric material according to claim 1. 10. The thermoelectric element according to claim 9, wherein said thermoelectric element is used by applying current in a thickness direction of the multilayered body or used by having a temperature difference between both ends in a thickness direction of the multilayered body. 11. A thermoelectric element comprising a multilayered body composed of two or more kinds of laminar bodies made of a metal, and the laminar bodies have an average thickness of 0.3 nm to 100 nm, and the thermoelectric element is used by applying current in a thickness direction of the multilayered body or used by having a temperature difference between both ends in a thickness direction of the multilayered body. 12. The thermoelectric element according to claim 11, wherein the laminar body making up the multilayered body is discontinuous in a film surface. 13. The thermoelectric element according to claim 11, wherein the laminar body is made of any one of metals Ag. Fe, Cu, Ni, Al, Au, Pt, Cr, Zn, Pb, and Sn. 14. The thermoelectric element according to claim 11, wherein said multilayered body is composed of a laminar body made of any one of metals, Fe, Ni, Al, Pt, Cr, and Sn; and a laminar body made of any one of metals Ag, Cu, Au, Zn, and Pb. 15. A method of manufacturing a thermoelectric material, in which the material comprises a multilayered body composed of two or more laminar bodies, and the laminar bodies have an average thickness of 0.3 to 1000 nm, wherein after making of an initial multilayered body composed of all kinds of laminar bodies makes up the multilayered body, a plurality of initial multilayered bodies are stacked and rolling or uniaxially pressing is performed to form the multilayered body. 16. The method of manufacturing a thermoelectric material according to claim 15, wherein a plurality of second multilayered bodies, which are obtained by stacking a plurality of the initial multilayered bodies and performing rolling or uniaxially pressing thereon, are stacked and rolled or uniaxially pressed once or repeatedly more than one time. 17. The method of manufacturing a thermoelectric material according to claim 15, wherein powder having an average particle diameter of 0.1 μm to 500 μm is used as a material of the laminar body, and after the powder is presintered, the initial multilayered body is formed. 18. A thermoelectric material according to claim 1, which is manufactured by the manufacturing methods described in claim 15.
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