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Active thermal management of semiconductor devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
  • F25B-023/12
출원번호 US-0382450 (2003-03-06)
발명자 / 주소
  • Law, Jonathan Michael
  • Harley, Nigel Henry
출원인 / 주소
  • Texas Instruments Incorporated
대리인 / 주소
    Frederick J. Telecky, Jr.
인용정보 피인용 횟수 : 45  인용 특허 : 10

초록

The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal ma

대표청구항

The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal ma

이 특허에 인용된 특허 (10)

  1. Newman Robert ; Lee Chu-Chung, Ball grid array package having thermoelectric cooler.
  2. Adelbert M. Gillen, Compact thermoelectric cooling system.
  3. Meissner Edward G., Integrated circuit package having a thermoelectric cooling element therein.
  4. Mansuria Mohanlal S. (Coral Springs FL) Mosley Joseph M. (Boca Raton FL) Musa Richard D. (Boca Raton FL) Shutler William F. (Wappingers Falls NY) Tuozzolo Vito J. (Boca Raton FL), Integrated thermoelectric cooling.
  5. Doke Michael J. (Dallas TX), Integrated thermoelectric system with full/half wave rectifier control.
  6. Bhatia Rakesh, Package with integrated thermoelectric module for cooling of integrated circuits.
  7. Morris Garron K. ; Pal Debabrata ; Pais Martin R., Semiconductor circuit temperature monitoring and controlling apparatus and method.
  8. Ghoshal Uttam Shyamalindu, Thermoelectric cooling apparatus and method for maximizing energy transport.
  9. Mansuria Mohanlal S. (Coral Springs FL) Mosley Joseph M. (Boca Raton FL) Musa Richard D. (Boca Raton FL) Tuozzolo Vito J. (Boca Raton FL), Thermoelectric cooling via electrical connections.
  10. Johnson Norman J. (210 Lincoln St. Lexington MA) Anand Raj K. (210 Lincoln St. Worcester MA 01605), Thermoelectrically controlled heat medical catheter.

이 특허를 인용한 특허 (45)

  1. Gu, Shiqun; Nowak, Matthew Michael; Toms, Thomas Robert, Active thermal control for stacked IC devices.
  2. Gu, Shiqun; Nowak, Matthew; Toms, Thomas R., Active thermal control for stacked IC devices.
  3. Christy, Alexander C., Apparatus for dissipating thermal energy generated by current flow in semiconductor circuits.
  4. Christy, Alexander C., Arrangement for dissipating thermal energy generated by a light emitting diode.
  5. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
  6. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
  7. Lofy, John, Climate controlled seating assembly with sensors.
  8. Lofy, John, Condensation and humidity sensors for thermoelectric devices.
  9. Lofy, John D., Condensation and humidity sensors for thermoelectric devices.
  10. Harttig, Herbert, Cooler / heater arrangement.
  11. Prasher, Ravi, Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel.
  12. Savelli, Guillaume; Coronel, Philippe, Cooling device equipped with a thermoelectric sensor.
  13. Hamman,Brian A., Cooling system.
  14. Kruglick, Ezekiel, Electrocaloric effect heat transfer device dimensional stress control.
  15. Kruglick, Ezekiel, Electrocaloric effect heat transfer device dimensional stress control.
  16. Kruglick, Ezekiel, Electrocaloric effect materials and thermal diodes.
  17. Kruglick, Ezekiel, Electrocaloric heat transfer.
  18. Fitzgerald, Thomas J; Deppisch, Carl L.; Dhindsa, Manjit; Norwil, Mark; Schaenzer, Matthew J., Electronic packaging apparatus and method.
  19. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  20. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  21. Christy, Alexander C., Flexible thermal energy dissipating and light emitting diode mounting arrangement.
  22. Mowry, Anthony C.; Farber, David G.; Austin, Michael J.; Moore, John E., Heat management using power management information.
  23. Petrovski, Dusko, Heating and cooling systems for seating assemblies.
  24. Kruglick, Ezekiel, Heterogeneous electrocaloric effect heat transfer.
  25. Kruglick, Ezekiel, Heterogeneous electrocaloric effect heat transfer device.
  26. Veerasamy, Vijayen S.; Alvarez, Jemssy, Insulating glass (IG) or vacuum insulating glass (VIG) unit including light source, and/or methods of making the same.
  27. Bhatia,Rakesh, Integrated circuit cooling apparatus and method.
  28. Ouyang, Chien; Gross, Kenneth C., Intelligent microchannel cooling.
  29. Hamman,Brian A., Liquid cooling system.
  30. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Method and system for controlling an operation of a thermoelectric device.
  31. Monferrer, Pedro Chaparro; Gonzalez, Jose, Microarchitecture controller for thin-film thermoelectric cooling.
  32. Monferrer, Pedro Chaparro; González, José, Microarchitecture controller for thin-film thermoelectric cooling.
  33. Brykalski, Michael; Marquette, David, Moisture abatement in heating operation of climate controlled systems.
  34. Ouyang, Chien; Gross, Kenneth C., Multichannel cooling system with magnetohydrodynamic pump.
  35. Kruglick, Ezekiel, Multistage thermal flow device and thermal energy transfer.
  36. Kruglick, Ezekiel, Phase change memory thermal management with electrocaloric effect materials.
  37. Kimura, Toru; Goto, Yoichi; Kitai, Kiyofumi, Power semiconductor device.
  38. Lofy, John, Segmented thermoelectric device.
  39. Lee, EungChang, Semiconductor packages and data storage devices including the same.
  40. Noguchi,Takashi, Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same.
  41. Ouyang,Chien, Thermoelectric cooling device arrays.
  42. Lofy, John, Thermoelectric device.
  43. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Thermoelectric device controls and methods.
  44. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian, Thermoelectric device with internal sensor.
  45. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio, Vehicle headliner assembly for zonal comfort.
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