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An apparatus for rigless subterranean well completion, re-completion, servicing or workover includes at least two substantially vertically oriented double acting prime movers incorporated into a spool for pressure containment, which is mounted to the top of a wellhead. The spool further includes a B

An apparatus for rigless subterranean well completion, re-completion, servicing or workover includes at least two substantially vertically oriented double acting prime movers incorporated into a spool for pressure containment, which is mounted to the top of a wellhead. The spool further includes a Bowen union mounted to a top thereof for sealingly connecting an annular adapter, which provides a seal between the well bore and a tubular that is inserted under the well fluid pressure into the well by the prime movers. The spool may further include a mechanism for securing a hydraulic crane that can be temporarily mounted to the top of the spool to hoist equipment and tools above the wellhead when the prime movers are used to support heavy workloads induced by well fluid pressure or the weight of a tubing string. The apparatus can be used in various operations for well completion, re-completion, servicing or workover without the necessity of using a servicing rig. Consequently, the cost of those operations is significantly reduced.

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An apparatus for rigless subterranean well completion, re-completion, servicing or workover includes at least two substantially vertically oriented double acting prime movers incorporated into a spool for pressure containment, which is mounted to the top of a wellhead. The spool further includes a B

An apparatus for rigless subterranean well completion, re-completion, servicing or workover includes at least two substantially vertically oriented double acting prime movers incorporated into a spool for pressure containment, which is mounted to the top of a wellhead. The spool further includes a Bowen union mounted to a top thereof for sealingly connecting an annular adapter, which provides a seal between the well bore and a tubular that is inserted under the well fluid pressure into the well by the prime movers. The spool may further include a mechanism for securing a hydraulic crane that can be temporarily mounted to the top of the spool to hoist equipment and tools above the wellhead when the prime movers are used to support heavy workloads induced by well fluid pressure or the weight of a tubing string. The apparatus can be used in various operations for well completion, re-completion, servicing or workover without the necessity of using a servicing rig. Consequently, the cost of those operations is significantly reduced. agm end abutting said medial portion of said diaphragm member, said stem member being substantially aligned with said piezoelectric stack such that a vertical throw of said piezoelectric stack moves said stem member, said clamp end of said stem member abutting said annular wafer clamp member for transferring a clamping force generated by said piezoelectric stack through said diaphragm member and said stem member to said annular wafer clamp member; said stack housing further comprises: an annular groove positioned on a lower surface of said flange portion, said annular groove preferably being positioned substantially adjacent to said diaphragm member; an o-ring member, said o-ring member being positioned substantially in said annular groove, said o-ring member providing an environmental barrier between an interior of the processing chamber and an external environment; said stack housing further comprises: a plurality of apertures extending through said flange portion; a plurality of connecting members, each one of said connecting members being positionable through an associated one of said apertures for coupling said stack housing to the processing chamber; said annular wafer clamp member further comprises: a base portion positionable to control a vertical spacing between said semiconductor wafer and said wafer support assembly, a lip portion extending from said base portion such that a bottom surface of said lip portion is coplanar with a bottom surface of said base portion, said lip portion being for engaging a perimeter edge portion of a semiconductor wafer such that a clamping force is transferable to the semiconductor wafer; said annular wafer clamp member further comprises: a plurality of protrusions extending from said lip portion, said plurality of protrusions being positioned such that a top surface of said protrusions is coplanar with a bottom surface of said lip portion, said plurality of protrusions preferably being positioned in a substantially uniformly spaced relationship around an interior edge of said lip portion, said protrusions providing additional contact surfaces for said wafer clamping member with respect to the semiconductor wafer; said wafer support assembly further comprises: a heatsink adapted for providing a thermal sink for cooling the semiconductor wafer; a vertical adjustment assembly for controlling a height of said wafer support assembly; and a bellows assembly for providing an environmental barrier between an interior of a processing chamber and an external environment; said heatsink further comprises: an metal disk having a substantially circular depression centered on a top surface of said metal disk, said metal disk having a cooling channel routed through an interior portion of said metal disk, said cooling channel having an input portion and an output portion each extending from said metal disk; a via positioned at a focus of said depression, said via extending through said metal disk for conducting a barrier gas through said metal disk, said barrier gas providing a heat transfer buffer between a semiconductor wafer and said metal disk; said vertical adjustment assembly further comprises: a vertical adjustment shaft coupled to a bottom surface of said heatsink, said vertical adjustment shaft having an aperture extending from a lower portion radially into said vertical adjustment shaft, said vertical adjustment shaft having a bore extending from a top edge downwardly to said aperture, said bore and aperture being for providing a gas to form a gas barrier for said heatsink; a stepper motor operationally coupled to said vertical adjustment shaft such that the position of said vertical adjustment shaft is controlled by said stepper motor; said bellows assembly further comprises: a upper flange member coupled to a bottom surface of said heatsink; a lower flange member coupled to a lower interior surface of a process chamber; a bellows member extending bet