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Thermally enhanced interposer and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
  • H05R-001/00
출원번호 US-0055771 (2002-01-23)
발명자 / 주소
  • Li, Che-Yu
  • Fan, Zhineng
  • Brown, Dirk D.
출원인 / 주소
  • High Connection Density, Inc.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 82  인용 특허 : 15

초록 ▼

The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conducti

대표청구항 ▼

The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conducti

이 특허에 인용된 특허 (15)

  1. Fan Zhineng ; Le Ai D. ; Li Che-Yu, Carrier for land grid array connectors.
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  2. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
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  3. Vogel Marlin R. ; Love David G., Integrated circuit device package and heat dissipation device.
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  4. McHugh Robert G. ; Lin Nick,TWX, Land grid array assembly and related contact.
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  5. Mowatt Larry J. (Allen TX) Walter David (Richardson TX), Multi-chip integrated circuit module.
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  6. Okoshi Tokio (Tokuyama JPX) Kato Yuka (Tokuyama JPX) Okoshi Hideki (Tokuyama JPX) Miyahara Kenichiro (Tokuyama JPX) Maeda Masakatsu (Tokuyama JPX), Package for mounting a semiconductor device.
    상세보기
  7. Takahashi Nobuaki (Tokyo JPX), Package with improved heat transfer structure for semiconductor device.
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  8. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Pluggable chip scale package.
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  9. Ronald P. Huemoeller, Printed circuit board with heat spreader and method of making.
    상세보기
  10. Thompson Gordon L. (Cheadle GB3) Gudgeon Brian (Rossendale GB3) Wombwell Kenneth J. (Stockport GB3), Printed circuit boards.
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  11. Rife William B., Reverse mount heat sink assembly.
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  12. Ashiwake Noriyuki,JPX ; Daikoku Takahiro,JPX ; Kasai Kenichi,JPX ; Kawamura Keizou,JPX ; Kimura Hideyuki,JPX ; Nishihara Atsuo,JPX ; Hatada Toshio,JPX ; Iino Toshiki,JPX, Semiconductor module.
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  13. Menzies L. William ; Menzies Stephen W. ; Mackey Dale S., Signal adaptor board for a pin grid array.
    상세보기
  14. Haselby Jeffrey T. ; Peterson Eric C., Spring-loaded backing plate assembly for use with land grid array-type devices.
    상세보기
  15. Li Che-yu ; Korhonen Matti A. ; Shi Weimin, Wire segment based interposer for high frequency electrical connection.
    상세보기

이 특허를 인용한 특허 (82)

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  11. Hermeline, Nicolas; Flers, Alain; Barlerin, Stephane; Stricot, Yves, Dismountable optical coupling device.
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