Magnetic devices using nanocomposite materials
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G11B-005/66
G11B-005/33
출원번호
US-0041910
(2002-01-07)
발명자
/ 주소
Wang, Dexin
Qian, Zhenghong
Daughton, James M.
Fayfield, Robert T.
출원인 / 주소
NVE Corporation
대리인 / 주소
Kinney & Lange, P.A.
인용정보
피인용 횟수 :
46인용 특허 :
2
초록▼
A ferromagnetic thin-film based magnetoresistive device with a first ferromagnetic material based film having electrically conductive, ferromagnetic material nanogranules embedded in an intergranular material of a smaller electrical conductivity first nonmagnetic. The device may have an intermediate
A ferromagnetic thin-film based magnetoresistive device with a first ferromagnetic material based film having electrically conductive, ferromagnetic material nanogranules embedded in an intergranular material of a smaller electrical conductivity first nonmagnetic. The device may have an intermediate layer adjacent the first ferromagnetic material based film and a second film is on the other side of the intermediate layer of a substantially ferromagnetic material. The first film is less than 1.0 μm thick.
대표청구항▼
A ferromagnetic thin-film based magnetoresistive device with a first ferromagnetic material based film having electrically conductive, ferromagnetic material nanogranules embedded in an intergranular material of a smaller electrical conductivity first nonmagnetic. The device may have an intermediate
A ferromagnetic thin-film based magnetoresistive device with a first ferromagnetic material based film having electrically conductive, ferromagnetic material nanogranules embedded in an intergranular material of a smaller electrical conductivity first nonmagnetic. The device may have an intermediate layer adjacent the first ferromagnetic material based film and a second film is on the other side of the intermediate layer of a substantially ferromagnetic material. The first film is less than 1.0 μm thick. 3): CF2=CF--Rf3 (3) wherein Rf3is --ORf4,in which Rf4is a perfluoroalkyl group having 1 to 5 carbon atoms. 6. The method of adhering substrates of claim 1, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is a monomer mixture comprising 40 to 80% by mole of tetrafluoroethylene or chlorotrifluoroethylene, 20 to 60% by mole of ethylene, and 0 to 15% by mole of a monomer copolymerizable with those monomers. 7. The method of adhering substrates of claim 1, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is vinylidene fluoride. 8. The method of adhering substrates of claim 1, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is a monomer mixture comprising 70 to 99% by mole of vinylidene fluoride and 1 to 30% by mole of tetrafluoroethylene, a monomer mixture comprising 50 to 99% by mole of vinylidene fluoride, 0 to 30% by mole of tetrafluoroethylene, and 1 to 20% by mole of chlorotrifluoroethylene, or a monomer mixture comprising 60 to 99% by mole of vinylidene fluoride, 0 to 30% by mole of tetrafluoroethylene, and 1 to 10% by mole of hexafluoropropylene. 9. A method of adhering substrates of claim 1, wherein the fluorine-containing adhesive is a fluorine-containing adhesive film obtained by molding the fluorine-ccntaining adhesive. 10. A laminated article which is a three-layered laminated article consisting essentially of: (A-4) a layer of a fluorine-containing adhesive which comprises a fluorine-containing ethylenic polymer having hydroxyl and prepared by copolymerizing: (a) 0.05 to 30% by mole of at least one of fluorine-containing ethylenic monomers having hydroxyl and (b) 70 to 99.95% by mole of at least one of fluorine-containing ethylenic monomers having no hydroxyl and being copolymerizable with the component (a), said at least one of fluorine-containing ethylenic monomers having no hydroxyl (b) being selected from the group consisting of (b-1) tetrafluoroethylene (b-2) a monomer mixture comprising 85 to 99.7% by mole of tetrafluoroethylene and 0.3 to 15% by mole of a monomer represented by the formula (3): CF2=CF--Rf3 (3) wherein Rf3is --CF3,or --ORf4,in which Rf4is a perfluoroalkyl group having 1 to 5 carbon atoms, (b-3) a monomer mixture comprising 40 to 80% by mole of tetrafluoroethylene or chlorotrifluoroethylene, 20 to 60% by mole of ethylene, and 0 to 15% by mole of a monomer copolymerizable with those monomers, (b-4) vinylidene fluoride and (b-5) a monomer mixture comprising 70 to 99% by mole of vinylidene fluoride and 1 to 30% by mole of tetrafluoroethylene, a monomer mixture comprising 50 to 99% by mole of vinyledene fluoride, 0 to 30% by mole of tetrafluoroethylene, and 1 to 20% by mole of chlorotrifluoroethylene, or a monomer mixture comprising 60 to 99% by mole of vinylidene fluoride, 0 to 30% by mole of tetrafluoroethylene, and 1 to 10% by mole of hexafluoropropylene, (B-2) a layer of a fluorine-containing ethylenic polymer having a branched chain which does not contain a functional group, and (E) a substrate, wherein the layer of the fluorine containing adhesive (A-4) is an adhesive layer and is arranged between the layer of a fluorine-containing ethylenic polymer having no functional group (B-2) and the substrate and is applied directly to substrate (E) and is applied directly to substrate (E). 11. The laminated article of claim 10, wherein the fluorine-containing ethylenic monomer having hydroxyl (a) is at least one of monomers represented by the formula (1): CX2=CX1--Rf--CH2OH (1) wherein X and X1are the same or different and each is hydrogen atom or fluorine atom, Rfis a divalent fluorine-containing alkylene group having 1 to 40 car bon atoms, a fluorine-containing oxyalkylene group having 1 to 40 carbon atoms, a fluorine-containing alkylene group having ether bond and 1 to 40 carbon atoms, or a fluorine-containing oxyalkylene group having ether bond and 1 to 40 carbon atoms. 12. The laminated article of claim 10, wherein the fluorine-containing ethylenic monomer having hydroxyl (a) is a fluorine-containing monomer represented by the formula (2): CH2=CFCF2--Rf1--CH2OH (2) wherein Rf1is a divalent fluorine-containing alkylene group having 1 to 39 carbon atoms or --ORf2,in which Rf2is a divalent fluorine-containing alkylene group having 1 to 39 carbon atoms, or a divalent fluorine-containing alkylene group having ether bond and 1 to 39 carbon atoms. 13. The laminated article of claim 10, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is tetrafluoroethylene. 14. The laminated article of claim 10, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is a monomer mixture comprising 85 to 99.7% by mole of tetrafluoroethylene and 0.3 to 15% by mole of a monomer represented by the formula (3): CF2=CF--Rf3 (3) wherein Rf3is --ORf4,in which Rf4is a perfluoroalkyl group having 1 to 5 carbon atoms. 15. The laminated article of claim 10, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is a monomer mixture comprising 40 to 80% by mole of tetrafluoroethylene or chlorotrifluoroethylene, 20 to 60% by mole of ethylene, and 0 to 15% by mole of a monomer copolymerizable with those monomers. 16. The laminated article of claim 10, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is vinylidene fluoride. 17. The laminated article of claim 10, wherein the fluorine-containing ethylenic monomer having no hydroxyl (b) is a monomer mixture comprising 70 to 99% by mole of vinylidene fluoride and 1 to 30% by mole of tetrafluoroethylene, a monomer mixture comprising 50 to 99% by mole of vinylidene fluoride, 0 to 30% by mole of tetrafluoroethylene, and 1 to 20% by mole of chlorotrifluoroethylene, or a monomer mixture comprising 60 to 99% by mole of vinylidene fluoride, 0 to 30% by mole of tetrafluoroethylene, and 1 to 10% by mole of hexafluoropropylene. 18. A laminated article of claim 10, wherein the fluorine-containing adhesive is a fluorine-containing adhesive film obtained by molding the fluorine-containing adhesive. 19. A method of adhering substrates comprising applying to a substrate a fluorine-containing adhesive film obtained by laminating: (A-1) a layer of an adhesive comprising a fluorine-containing ethylenic polymer having hydroxyl and prepared by copolymerizing: (a) 0.05 to 30% by mole of at least one of fluorine-containing ethylenic monomers having hydroxyl and (b) 70 to 99.95% by mole of at least one of fluorine-containing ethylenic monomers having no hydroxyl and being copolymerizable with the component (a), said at least one of fluorine-containing ethylenic monomers having no hydroxyl (b) being selected from the group consisting of (b-1) tetrafluoroethylene, (b-2) a monomer mixture comprising 85 to 99.7% by mole of tetrafluoroethylene and 0.3 to 15% by mole of a monomer represented by the formula (3): CF2=CF--Rf3 (3) wherein Rf3is --CF3,or --ORf4,in which Rf4is a perfluoroalkyl group having 1 to 5 carbon atoms, (b-3) a monomer mixture comprising 40 to 80% by mole of tetrafluoroethylene or chlorotrifluoroethylene, 20 to 60% by mole of ethylene, and 0 to 15% by mole of a monomer copolymerizable with those monomers, (b-4) vinylidene fluoride and (b-5) a monomer mixture comprising 70 to 99% by mole of vinylidene fluoride and 1
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (2)
Mallary Michael ; Gyasi Kofi, Laminated plated pole pieces for thin film magnetic transducers.
Lim, Chee-kheng; Cho, Eun-hyoung; Choa, Sung-hoon, Information storage devices using movement of magnetic domain walls and methods of manufacturing the same.
Schabes, Manfred Ernst; Pinarbasi, Mustafa Michael; Kardasz, Bartlomiej Adam, Perpendicular magnetic tunnel junction device with offset precessional spin current layer.
Pinarbasi, Mustafa Michael; Hernandez, Jacob Anthony; Datta, Arindom; Gajek, Marcin Jan; Zantye, Parshuram Balkrishna, Polishing stop layer(s) for processing arrays of semiconductor elements.
Tofigh, Farshid; Kruppa, Otmar; Khan, Imtiaz; Ghahramani, Iraj; Lawton, David; Policky, Kent, Power distribution system using solid state power controllers.
Tofigh, Farshid; Kruppa, Otmar; Khan, Imtiaz; Ghahramani, Iraj; Lawton, David; Policky, Kent, Solid state power controllers including current sensing circuitry is configured to bias a general signal to a predetermined level in order to substantially eliminate the offset error in an amplifier and an A/D converter.
Schabes, Manfred Ernst; Pinarbasi, Mustafa Michael; Kardasz, Bartlomiej Adam, Switching and stability control for perpendicular magnetic tunnel junction device.
Tofigh, Farshid; Kruppa, Otmar; Khan, Imtiaz; Ghahramani, Iraj; Lawton, David; Policky, Kent, Voltage sensing circuitry for solid state power controllers.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.