이 특허에 인용된 특허 (78) 인용/피인용 타임라인 분석

1. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Adapter arrangement for electrically connecting flat wire carriers.

   상세보기
2. Rostoker Michael D. ; Koford James S. ; Scepanovic Ranko ; Jones Edwin R. ; Padmanahben Gobi R. ; Kapoor Ashok K. ; Kudryavtsev Valeriy B.,RUX ; Andreev Alexander E.,RUX ; Aleshin Stanislav V.,RUX ; , Architecture having diamond shaped or parallelogram shaped cells.

   상세보기
3. Grabbe Dimitry G. (Middletown PA), Area array connector.

   상세보기
4. Matunami Mituo (Izumisano JA), Beam lead formation method.

   상세보기
5. Chan Chin-Jong,TWX ; Chung Hsiu-Hsin,TWX ; Lin Rueyway,TWX, Bonding pad structure for integrated circuit (I).

   상세보기
6. Liang Wen-Hao,TWX ; Chan Chin-Jong,TWX ; Chung Hsiu-Hsin,TWX ; Lin Rueyway,TWX, Bonding pad structure for integrated circuit (III).

   상세보기
7. Farnworth Warren M. ; Akram Salman, Compliant contact system with alignment structure for testing unpackaged semiconductor dice.

   상세보기
8. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.

   상세보기
9. Fjelstad Joseph, Connection component with releasable leads.

   상세보기
10. Fjelstad Joseph, Connection component with releasable leads.

    상세보기
11. Pendse Rajendra D., Cost effective structure and method for interconnecting a flip chip with a substrate.

    상세보기
12. Waldron Robert D. (Fort Collins CO) Crafts Harold S. (Fort Collins CO), Electrical connection between buses on a semiconductor integrated circuit.

    상세보기
13. Conn Robert O., Electrically programmable antifuse using metal penetration of a P-N junction.

    상세보기
14. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals.

    상세보기
15. Fjelstad Joseph, Fabrication of deformable leads of microelectronic elements.

    상세보기
16. Distefano Thomas ; Smith John W. ; Faraci Anthony B., Fixtures and methods for lead bonding and deformation.

    상세보기
17. Distefano Thomas ; Smith John W. ; Faraci Anthony B., Fixtures and methods for lead bonding and deformation.

    상세보기
18. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.

    상세보기
19. Shenoy Jayarama N. ; Findley Paul, Flip chip circuit arrangement with redistribution layer that minimizes crosstalk.

    상세보기
20. Kwon Oh-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX) Born Eng C. (Richardson TX), Full wafer integrated circuit testing device.

    상세보기
21. Grabbe Dimitry G. (Middletown PA), High density electrical connector system.

    상세보기
22. Babuka, Robert; Piechota, John L.; Poch, Leonard J., High density planar interconnected integrated circuit package.

    상세보기
23. Ardezzone Frank J. (Santa Clara CA), High density probe-head with isolated and shielded transmission lines.

    상세보기
24. Jones Mark R. ; Khoury Theodore A., High performance integrated circuit chip package.

    상세보기
25. Kwon On-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX), High performance test head and method of making.

    상세보기
26. Leedy Glenn (1061 E. Mountain Dr. Santa Barbara CA 93108), Interconnection structure for integrated circuits and method for making same.

    상세보기
27. Mallik Debendra (Chandler AZ) Bhattacharyya Bidyut K. (Chandler AZ), Lead grid array integrated circuit.

    상세보기
28. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Lithographic contact elements.

    상세보기
29. Littlebury Hugh W. (Chandler AZ) Simmons Marion I. (Tempe AZ), Low resistance probe for semiconductor.

    상세보기
30. Ochs, Christopher D., Metal conductor structure having low electro-migration at high currents for semiconductor devices.

    상세보기
31. Farnworth Warren M. (Nampa ID) Akram Salman (Boise ID) Wood Alan G. (Boise ID), Method for forming contact pins for semiconductor dice and interconnects.

    상세보기
32. Lindberg Frank A. (Catonsville MD), Method for making beam leads for ceramic substrates.

    상세보기
33. Belmont Andre,FRX ; Reynaud Vincent,FRX ; Daniau William,FRX, Method for making cards with multiple contact tips for testing semiconductor chips.

    상세보기
34. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Method for manufacturing a probe.

    상세보기
35. Yoshida Kazuhiro (Shiga-ken JPX), Method for manufacturing semiconductor device.

    상세보기
36. Burrows Paul E. ; Forrest Stephen R. ; Bulovic Vladimir ; Tian Peifang ; Brown Julie, Method for patterning light emitting devices incorporating a movable mask.

    상세보기
37. Dennison Charles H., Method of forming contact openings.

    상세보기
38. Chui Benjamin W. ; Kenny Thomas W., Method of making electrical elements on the sidewalls of micromechanical structures.

    상세보기
39. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of making microelectronic contact structures.

    상세보기
40. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.

    상세보기
41. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.

    상세보기
42. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.

    상세보기
43. Quate Calvin F. (Stanford CA) Minne Stephen Charles (Danville IL), Method of performing lithography using cantilever array.

    상세보기
44. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.

    상세보기
45. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.

    상세보기
46. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Micro contact pin structure with a piezoelectric element and probe card using the same.

    상세보기
47. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.

    상세보기
48. Maddix John Thomas ; Palagonia Anthony Michael ; Pikna Paul Joseph ; Vallett David Paul, Micro probe ring assembly and method of fabrication.

    상세보기
49. Rothenberger Richard E. (5 State Dr. Harrisburg PA 17112), Micro-power connector.

    상세보기
50. Smith John W. ; Fjelstad Joseph, Microelectronic assembly fabrication with terminal formation from a conductive layer.

    상세보기
51. Fjelstad Joseph (Sunnyvale CA) Smith John W. (Palo Alto CA) Distefano Thomas H. (Monte Sereno CA) Zaccardi James (Sunnyvale CA) Walton A. Christian (Belmont CA), Microelectronic contacts with asperities and methods of making same.

    상세보기
52. DiStefano Thomas H., Microelectronic mounting with multiple lead deformation using restraining straps.

    상세보기
53. Distefano Thomas H., Microelectronic mounting with multiple lead deformation using restraining straps.

    상세보기
54. Thomas H. DiStefano, Microelectronic mounting with multiple lead deformation using restraining straps.

    상세보기
55. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Microstructures and single mask, single-crystal process for fabrication thereof.

    상세보기
56. Raab Kurt ; Pickett Thomas ; Di Stefano Thomas H., Multiple part compliant interface for packaging of a semiconductor chip and method therefor.

    상세보기
57. Jones Mark R. ; Khoury Theodore A., Packaging and interconnection of contact structure.

    상세보기
58. Smith Donald L. (Palo Alto CA) Alimonda Andrew S. (Los Altos CA), Photolithographically patterned spring contact.

    상세보기
59. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.

    상세보기
60. Smith Donald L. ; Thornton Robert L. ; Chua Christopher L. ; Fork David K., Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices.

    상세보기
61. Ueuchi Gen,JPX ; Imanaka Hideyuki,JPX ; Tsunano Hirofumi,JPX, Power control device.

    상세보기
62. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card and method of forming a probe card.

    상세보기
63. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.

    상세보기
64. Trenary Dale T. (San Jose CA), Probe card for integrated circuit chip.

    상세보기
65. Gooch Roland W., Ramped foot support.

    상세보기
66. MacDonald Noel C. (Ithaca NY) Chen Liang-Yuh (Ithaca NY) Zhang Zuoying L. (Ithaca NY), Selective chemical vapor deposition of tungsten for microdynamic structures.

    상세보기
67. Kock Hendrikus G. (Eindhoven NLX), Semiconductor device comprising projecting contact layers.

    상세보기
68. Kariyazono Hiroshi,JPX ; Honna Katsu,JPX, Semiconductor device having a MOS structure.

    상세보기
69. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Semiconductor structure and method of manufacture.

    상세보기
70. Ruf Alexander (Mainz DEX) Abraham Michael (Mainz DEX) Lacher Manfred (Mainz DEX) Zetterer Thomas (Schwabenheim DEX) Dietrich Thomas R. (Frankfurt DEX), Sensor head for use in atomic force microscopy and method for its production.

    상세보기
71. Faraci Anthony B. ; Zaccardi James B. ; DiStefano Thomas H. ; Smith John W., Socket for engaging bump leads on a microelectronic device and methods therefor.

    상세보기
72. Lien Chuen-Der, Structure for fabricating a bonding pad having improved adhesion to an underlying structure.

    상세보기
73. Ueno Toshiaki,JPX ; Saito Mitsuchika,JPX, Structure for providing an electrical connection between circuit members.

    상세보기
74. Hesselbom Hjalmar,SEX, Substrate edge connnector.

    상세보기
75. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA) Ringler Daniel R. (Elizabethville PA), Surface mount electrical connector.

    상세보기
76. Mueller Robert A. (Portland OR), Thin-film electrothermal device.

    상세보기
77. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.

    상세보기
78. Wilson Lance G. (N. Hollywood CA) Miller William J. (Tempe AZ), Wire shielding for RF circuit boards and amplifiers.

    상세보기
더보기

이 특허를 인용한 특허 (102) 인용/피인용 타임라인 분석

1. Strid, Eric; Gleason, K. Reed, Active wafer probe.

   상세보기
2. Strid,Eric; Gleason,K. Reed, Active wafer probe.

   상세보기
3. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.

   상세보기
4. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

   상세보기
5. Chen, Richard T.; Kruglick, Ezekiel J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

   상세보기
6. Chen,Richard T.; Kruglick,Ezekiel J. J.; Bang,Christopher A.; Smalley,Dennis R.; Lembrikov,Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

   상세보기
7. Tran, Lich Thanh; Dang, Son N.; Back, Gerald W.; Rincon, Reynaldo M., Cantilever probe card.

   상세보기
8. Takiar, Hem P.; Kelkar, Nikhil Vishwanath, Chip scale package with compliant leads.

   상세보기
9. Lin, Charles W. C.; Chiang, Cheng-Lien, Compliant test probe with jagged contact surface.

   상세보기
10. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.

    상세보기
11. Strid, Eric; Campbell, Richard, Differential signal probing system.

    상세보기
12. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.

    상세보기
13. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.

    상세보기
14. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.

    상세보기
15. Hasegawa,Yoshiei, Electrical connecting apparatus and contact.

    상세보기
16. Ju, Ted, Electrical connection device and assembly method thereof.

    상세보기
17. Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication process for forming multilayer multimaterial microprobe structures.

    상세보기
18. Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication process for forming multilayer multimaterial microprobe structures.

    상세보기
19. Arat,Vacit; Cohen,Adam L.; Smalley,Dennis R.; Kruglick,Ezekiel J. J.; Chen,Richard T.; Kim,Kieun, Electrochemically fabricated microprobes.

    상세보기
20. Eldridge, Benjamin N.; Wenzel, Stuart W., Electronic components with plurality of contoured microelectronic spring contacts.

    상세보기
21. Cohen, Adam L.; Arat, Vacit; Lockard, Michael S.; Bang, Christopher A.; Lembrikov, Pavel B., Fabrication process for co-fabricating multilayer probe array and a space transformer.

    상세보기
22. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.

    상세보기
23. Eldridge, Benjamin N.; Wenzel, Stuart W., Lithographic type microelectronic spring structures with improved contours.

    상세보기
24. Eldridge,Benjamin N.; Wenzel,Stuart W., Lithographic type microelectronic spring structures with improved contours.

    상세보기
25. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.

    상세보기
26. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.

    상세보기
27. Schwindt,Randy J., Low-current probe card.

    상세보기
28. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.

    상세보기
29. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.

    상세보기
30. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.

    상세보기
31. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.

    상세보기
32. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.

    상세보기
33. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.

    상세보기
34. Smith,Kenneth; Gleason,Reed, Membrane probing system.

    상세보기
35. Smith,Kenneth; Gleason,Reed, Membrane probing system.

    상세보기
36. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.

    상세보기
37. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.

    상세보기
38. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.

    상세보기
39. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.

    상세보기
40. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.

    상세보기
41. Jang,Ben Hwa; Lin,Shin Way; Fang,Wei Leun; Su,Wang Shen, Method for fabricating microconnector and shape of terminals thereof.

    상세보기
42. Jo, Byung Ho, Method for fabricating probe needle tip of probe card.

    상세보기
43. Eldridge, Benjamin N.; Wenzel, Stuart W., Method for forming microelectronic spring structures on a substrate.

    상세보기
44. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.

    상세보기
45. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.

    상세보기
46. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Method of making a contact.

    상세보기
47. Hosaka, Hisatomi; Takekoshi, Kiyoshi, Method of producing a probe with a trapezoidal contactor.

    상세보기
48. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.

    상세보기
49. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.

    상세보기
50. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.

    상세보기
51. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.

    상세보기
52. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Microprobe tips and methods for making.

    상세보기
53. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S.; Bang,Christopher A., Microprobe tips and methods for making.

    상세보기
54. Wu, Ming Ting; Larsen, III, Rulon Joseph; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.

    상세보기
55. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.

    상세보기
56. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.

    상세보기
57. Daniel, Jurgen; Fork, David K.; Volkel, Armin R., Oblique parts or surfaces.

    상세보기
58. Daniel, Jurgen; Fork, David K.; Völkel, Armin R., Oblique parts or surfaces.

    상세보기
59. Daniel, Jurgen; Fork, David K.; Völkel, Armin R., Oblique parts or surfaces.

    상세보기
60. Daniel, Jurgen; Fork, David K.; Völkel, Armin R., Oblique parts or surfaces.

    상세보기
61. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.

    상세보기
62. Tervo,Paul A.; Cowan,Clarence E., POGO probe card for low current measurements.

    상세보기
63. Fujii, Ryuji; Honda, Takashi; Tsuchiya, Hiroyasu; Hosaka, Koji, Probe assembly for lapping a bar using a patterned probe.

    상세보기
64. Tatematsu,Tsutomu; Togashi,Kenji; Nanbu,Tetsuhiro; Ishihara,Shigenobu; Hamada,Morihiko; Arisaka,Yoshikazu; Itagaki,Kunihiro; Aoki,Shigekazu, Probe card, having cantilever-type probe and method.

    상세보기
65. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers.

    상세보기
66. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.

    상세보기
67. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.

    상세보기
68. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.

    상세보기
69. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.

    상세보기
70. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.

    상세보기
71. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.

    상세보기
72. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.

    상세보기
73. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.

    상세보기
74. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.

    상세보기
75. Schwindt,Randy, Probe holder for testing of a test device.

    상세보기
76. Hosaka,Hisatomi; Takekoshi,Kiyoshi, Probe with trapezoidal contractor and device based on application thereof, and method of producing them.

    상세보기
77. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.

    상세보기
78. Eldridge, Benjamin N.; Mathieu, Gaetan L., Re-assembly process for MEMS structures.

    상세보기
79. Eldridge,Benjamin N.; Mathieu,Gaetan L., Re-assembly process for MEMS structures.

    상세보기
80. Smith, Kenneth R., Replaceable coupon for a probing apparatus.

    상세보기
81. Gritters, John K.; Eldridge, Benjamin N.; Breinlinger, Keith J., Resilient contact element and methods of fabrication.

    상세보기
82. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.

    상세보기
83. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.

    상세보기
84. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.

    상세보기
85. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.

    상세보기
86. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.

    상세보기
87. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.

    상세보기
88. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.

    상세보기
89. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.

    상세보기
90. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.

    상세보기
91. Andrews, Peter; Hess, David, System for testing semiconductors.

    상세보기
92. Eldridge, Benjamin N.; Wenzel, Stuart W., Test head assembly for electronic components with plurality of contoured microelectronic spring contacts.

    상세보기
93. Eldridge,Benjamin N.; Wenzel,Stuart W., Test head assembly having paired contact structures.

    상세보기
94. Campbell, Richard, Test structure and probe for differential signals.

    상세보기
95. Campbell,Richard, Test structure and probe for differential signals.

    상세보기
96. Chen, Richard T.; Arat, Vacit; Folk, Chris; Cohen, Adam L., Two-part microprobes for contacting electronic components and methods for making such probes.

    상세보기
97. Eldridge,Benjamin N.; Mathieu,Gaetan, Variable width resilient conductive contact structures.

    상세보기
98. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.

    상세보기
99. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.

    상세보기
100. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.

     상세보기
101. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.

     상세보기
102. Campbell, Richard, Wideband active-passive differential signal probe.

     상세보기
더보기

활용도 Top5 특허

더보기

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.