초록

A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.

대표청구항 ▼

1. A heat sink comprising: a core; and a plurality of fins extending outwardly from the core, the fins being at least partially curved and each fin splitting into a plurality of tines that extend away from the core, at least some of the fins each having a cured surface that faces toward an adjac

1. A heat sink comprising: a core; and a plurality of fins extending outwardly from the core, the fins being at least partially curved and each fin splitting into a plurality of tines that extend away from the core, at least some of the fins each having a cured surface that faces toward an adjacent one of the fins. 2. The heat sink of claim 1, wherein all the fins have substantially the same length as each other and all the tines have substantially the same length as each other. 3. The heat sink of claim 2, wherein a ratio of the length of each tine to the length of each fin is in the range 0.3:1 to 0.7:1. 4. The heat sink of claim 1, wherein the plurality of fins includes a number of fins in the range 30-80. 5. The heat sink of claim 4, wherein a total of 50 fins extend from the core. 6. The heat sink of claim 1, wherein each fin splits into a total of two tines. 7. The heat sink of claim 1, wherein the core and fins are formed as a unitary body. 8. The heat sink of claim 1, wherein the core has a central axis and each fin has an axis of curvature that is parallel to the central axis. 9. A heat sink comprising: a core; and a plurality of fins extending outwardly from the core, the fins being at least partially curved and each fin splitting into a plurality of tines that extend away from the core; wherein the core has a central axis, and all cross-sections of the heat sink taken normal to the central axis are identical to each other. 10. The heat sink of claim 9, wherein all the fins have substantially the same length as each other and all the tines have substantially the same length as each other. 11. The heat sink of claim 9, wherein the plurality of fins includes a number of fins in the range 30-80. 12. The heat sink of claim 11, wherein a total of 50 fins extend from the core. 13. The heat sink of claim 9, wherein each fin splits into a total of two tines. 14. The heat sink of claim 9, wherein the core and fins are formed as a unitary body. 15. The heat sink of claim 1, wherein the core has a central axis, and all cross-sections of the heat sink taken normal to the central axis are identical to each other. 16. An electronic system comprising: substrate; an electronic component mounted on the substrate; and a heat sink thermally coupled to the electronic component, the heat sink including: a core; and a plurality of fins extending outwardly from the core, the fins being at least partially curved and each fin splitting into a plurality of tines that extend away from the cores least some of the fins each having a curved surface that faces toward an adjacent one of the fins. 17. The electronic system of claim 16, wherein the substrate is a circuit board. 18. The electronic system of claim 16, wherein the electronic component is a microprocessor. 19. The electronic system of claim 16, wherein the system is a personal computer. 20. An electronic system comprising: a substrate; an electronic component mounted on the substrate; and a heat sink thermally coupled to the electronic component, the heat sink including: a core; and a plurality of fins extending outwardly from the core, the fins being at least partially curved and each fin splitting into a plurality of tine; wherein the core has a central axis, and all cross-sections of the heat sink taken normal to the central axis are identical to each other. 21. The electronic system of claim 20, wherein the substrate is a circuit board. 22. The electronic system of claim 20, wherein the electronic component is a microprocessor. 23. The electronic system of claim 20, wherein the system is a personal computer.