IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0851225
(2001-05-08)
|
우선권정보 |
DE-0022597 (2000-05-10) |
발명자
/ 주소 |
- Eisen, Juergen
- Heim, Harald
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
6 |
초록
▼
A device for detecting the marginal edge or a marking of a material web. The device contains an optical sensor and two light sources associated with the optical sensor. The first light source emits directed light beams and aims such beams at the material web. The first light source is formed by a pl
A device for detecting the marginal edge or a marking of a material web. The device contains an optical sensor and two light sources associated with the optical sensor. The first light source emits directed light beams and aims such beams at the material web. The first light source is formed by a plurality of light-emitting diodes, arranged such that the light reflected by the material web in a diffused manner cannot be detected by the optical sensor. A second light source is also associated with the optical sensor. The second light source contains a diffuser disk. The diffuser disk generates diffused light that is emitted in all three-dimensional directions. When the second light source is active, the condition of reflection is satisfied so that it is possible to scan the material web having mirror-like reflection.
대표청구항
▼
A device for detecting the marginal edge or a marking of a material web. The device contains an optical sensor and two light sources associated with the optical sensor. The first light source emits directed light beams and aims such beams at the material web. The first light source is formed by a pl
A device for detecting the marginal edge or a marking of a material web. The device contains an optical sensor and two light sources associated with the optical sensor. The first light source emits directed light beams and aims such beams at the material web. The first light source is formed by a plurality of light-emitting diodes, arranged such that the light reflected by the material web in a diffused manner cannot be detected by the optical sensor. A second light source is also associated with the optical sensor. The second light source contains a diffuser disk. The diffuser disk generates diffused light that is emitted in all three-dimensional directions. When the second light source is active, the condition of reflection is satisfied so that it is possible to scan the material web having mirror-like reflection. being driven by said wire when said wire is moved in said first coil and said second coil, said method comprising: inserting one end of said first coil and one end of said second coil in a connection pipe from opposite ends thereof; and exposing ends of said connection pipe and portions of said first coil and said second coil corresponding to said ends of said connection pipe to arc columns, respectively, the portions exposed to the arc columns being melted, and thereafter, solidified. 2. The method according to claim 1, wherein an outer diameter of said connection pipe is substantially the same as an outer diameter of said first coil outside said connection pipe and an outer diameter of said second coil outside said connection pipe, and wherein an inner diameter of said connection pipe is substantially the same as an outer diameter of said first coil inside said connection pipe and an outer diameter of said second coil inside said connection pipe. 3. The method according to claim 1, wherein a plurality of positions, along a circumferential direction, of a portion where an end of said connection pipe is to be connected to said first coil are exposed to arc columns, respectively, and wherein a plurality of positions, along a circumferential direction, of a portion where an other end of said connection pipe is to be connected to said second coil are exposed to arc columns, respectively. 4. The method according to claim 1, wherein said connection pipe is formed with a plurality of through holes, each of which is exposed to an arc column, whereby an edge portion of each of said through holes and one of said first and second coils located at each of said through holes are heated and melted. 5. A method of manufacturing a treatment instrument of an endoscope, said treatment instrument including a first coil and a second coil that is different from said first coil and to be connected to said first coil, an operation wire, and a device secured to a distal end of said first coil, said wire being inserted through said first coil and said second coil, a distal end of said wire being connected to said device, said device being driven by said wire when said wire is moved in said first coil and said second coil, said method comprising generating an arc column between a contact portion where a proximal end side of said first coil and a distal end side of said second coil contact with each other and an electrode located in the vicinity of the contact portion, the proximal end side of said first coil and the distal end side of said second coil located at the contact portion being melted as exposed to the arc column, and solidified as cooled. 6. The method according to claim 5, wherein a plurality of positions, along a circumferential direction, of the contact portion are exposed to arc columns, respectively. 7. The method according to claim 5, wherein said first coil includes a flexible coil, and wherein said second coil includes a rigid coil. 8. A method of manufacturing a treatment instrument of an endoscope, said treatment instrument including a first guide coil, an operation wire, and a device to be operated, said wire being inserted through said first guide coil, a distal end of said wire being connected to said device, said device being driven by said wire when said wire is moved in said first guide coil, said method comprising: inserting said first guide coil into a first cover coil; and exposing a plurality of portions of said first cover coil at positions where said first cover coil covers said first guide coil to arc columns, respectively, said first cover coil and said first guide coil at portions exposed to the arc columns being melted, and thereafter, solidified. 9. The method according to claim 8, wherein the exposing includes: locating an electrode at each of the plurality of portions; and applying
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