An integrated circuit die includes an input/output (I/O) cell. The I/O cell includes active I/O circuitry in a substrate, a plurality of metal interconnect layers, an insulating layer, a first pad, and a second pad. The plurality of metal interconnect layers are formed over the substrate. The insula
An integrated circuit die includes an input/output (I/O) cell. The I/O cell includes active I/O circuitry in a substrate, a plurality of metal interconnect layers, an insulating layer, a first pad, and a second pad. The plurality of metal interconnect layers are formed over the substrate. The insulating layer is formed over the plurality of metal interconnect layers. The second pad is formed over the insulating layer and positioned directly over at least two metal structures in a final metal layer of the plurality of interconnect layers. The pad is selectively coupled to one of at least two metal structures by at least one opening in the insulating layer.
대표청구항▼
An integrated circuit die includes an input/output (I/O) cell. The I/O cell includes active I/O circuitry in a substrate, a plurality of metal interconnect layers, an insulating layer, a first pad, and a second pad. The plurality of metal interconnect layers are formed over the substrate. The insula
An integrated circuit die includes an input/output (I/O) cell. The I/O cell includes active I/O circuitry in a substrate, a plurality of metal interconnect layers, an insulating layer, a first pad, and a second pad. The plurality of metal interconnect layers are formed over the substrate. The insulating layer is formed over the plurality of metal interconnect layers. The second pad is formed over the insulating layer and positioned directly over at least two metal structures in a final metal layer of the plurality of interconnect layers. The pad is selectively coupled to one of at least two metal structures by at least one opening in the insulating layer. [FOREIGN-PATENT]0271736, EP; 0618614, EP; 0775716, EP; 0837498, EP; 0285051, EP; 1979-012266, JP; A-54-12266, JP; 1979-013871, JP; A-54-138371, JP; 1983-057730, JP; 1983-222530, JP; 1985-038825, JP; 1985-145630, JP; 1987-141038, JP; 1988-289822, JP; S64-9226, JP; 1989-022744, JP; 1989-165635, JP; 1990-168636, JP; 64-19735, JP; 1990-246125, JP; 1990-256251, JP; A-2-256251, JP; 1991-000228, JP; 3215014, JP; 1992-003438, JP; 1992-003438, JP; 1992-227782, JP; 1993-117596, JP; 1993-125337, JP; 1993-152355, JP; 1993-152386, JP; 1993-152466, JP; 1993-190022, JP; 1993-190022, JP; 1993-218107, JP; 1993-218107, JP; 1993-331424, JP; 1993-331425, JP; 1993-335379, JP; 1994-104300, JP; 1994-145639, JP; 1994-151478, JP; 1994-172714, JP; 1994-204264, JP; 1994-218880, JP; 1994-248241, JP; 1994-256733, JP; 1994-264035, JP; 1994-264035, JP; 1994-326240, JP; 1995-022441, JP; 1995-090239, JP; 1995-090244, JP; 1995-090239, JP; 1995-171154, JP; 1995-242820, JP; 3117966, JP; 3117971, JP; 3117972, JP; WO94/021744, WO
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