초록 ▼

Devices having either wireless data communication capability or RFID tags can be located using dual function fixed devices which are distributed throughout a facility. The devices will identify those units with which they are communicating using a wireless radio data communications protocol and also

Devices having either wireless data communication capability or RFID tags can be located using dual function fixed devices which are distributed throughout a facility. The devices will identify those units with which they are communicating using a wireless radio data communications protocol and also identify items within the local area using RFID tags on the units.

대표청구항 ▼

Devices having either wireless data communication capability or RFID tags can be located using dual function fixed devices which are distributed throughout a facility. The devices will identify those units with which they are communicating using a wireless radio data communications protocol and also

Devices having either wireless data communication capability or RFID tags can be located using dual function fixed devices which are distributed throughout a facility. The devices will identify those units with which they are communicating using a wireless radio data communications protocol and also identify items within the local area using RFID tags on the units. cond plurality of interleaved inductors DC isolated from the first plurality of interleaved inductors, the second plurality of interleaved inductors formed completely within the second conductive layer. 7. An on-chip signal transforming device, the device comprising: a substrate; a first conductive layer above the substrate, wherein the first conductive layer has formed thereon a first plurality of inductors disposed in interleaved manner, the first plurality of interleaved inductors formed completely within the first conductive layer; a second conductive layer above the substrate, and below and insulated from the first conductive layer, wherein the second conductive layer has formed thereon at least one inductor DC isolated from the first plurality of interleaved inductors, the at least one inductor formed completely within one or more layers other than the first conductive layer; a third conductive layer above the first conductive layer and insulated from the first and second conductive layers, wherein the at least one inductor is also partly formed in the third conductive. 8. An on-chip signal transforming device, the device comprising: a substrate; a first conductive layer above the substrate, wherein the first conductive layer has a first spiral inductor and a second spiral inductor that are disposed in interleaved manner, the first spiral inductor formed substantially within the first conductive layer and the second spiral inductor formed completely within the first conductive layer; a second conductive layer above the substrate insulated from the first conductive layer; and a conductive path from the first conductive layer to the second conductive layer and back to the first conductive layer to allow the first spiral inductor to cross over the second spiral inductor. 9. The device according to claim 8, further comprising: a third conductive layer above the substrate and insulated from the first and second conductive layers, wherein the third conductive layer has a third spiral inductor that inductively couples to the first and second spiral inductors, the third spiral inductor formed completely within the third conductive layer.