$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Robot blade with dual offset wafer supports 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44C-001/22
출원번호 US-0946920 (1997-10-08)
발명자 / 주소
  • Tepman, Avi
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Moser, Patterson & Sheridan, LLP
인용정보 피인용 횟수 : 21  인용 특허 : 20

초록

A robot blade and a method of using the robot blade for transferring objects, namely substrates, through a process system, the robot blade comprising an upper platform having a first object supporting surface and a lower platform having a second object supporting surface. The robot blade is mounted

대표청구항

A robot blade and a method of using the robot blade for transferring objects, namely substrates, through a process system, the robot blade comprising an upper platform having a first object supporting surface and a lower platform having a second object supporting surface. The robot blade is mounted

이 특허에 인용된 특허 (20)

  1. Prentakis Antonios E. (Cambridge MA), Apparatus and method for loading and unloading wafers.
  2. Akimoto Masami (Kumamoto JPX) Yoshioka Kazutoshi (Kumamoto JPX) Iida Naruaki (Kumamoto JPX), Apparatus for processing wafer-shaped substrates.
  3. Muka Richard S. (Topsfield MA) Pippins Michael W. (Hamilton MA) Drew Mitchell A. (Portsmouth NH), Cluster tool batchloader of substrate carrier.
  4. Shiraiwa Hirotsugu (Hino JPX), Conveyor apparatus.
  5. Ishii Katsumi (Kanagawa-ken JPX) Kikuchi Hisashi (Esashi JPX), Device for transferring plate-like objects.
  6. Haraguchi Hideo (Toyonaka JPX) Suzuki Masaki (Hirakata JPX) Ishida Toshimichi (Hirakata JPX), Method of handling wafers in a vacuum processing apparatus.
  7. Turlot Emmanuel (Verrires le Buisson FRX) Emeraud Thierry (Bures sur Yvettes FRX) Schmitt Jacques (La Ville du Bois FRX), Plasma treatment apparatus and method for operating same.
  8. Grunes Howard (Santa Cruz CA) Tepman Avi (Cupertino CA) Lowrance Robert (Los Gatos CA), Robot assembly.
  9. Kumagai Hiromi (Tokyo JPX), Semiconductor manufacturing apparatus with a spare vacuum chamber.
  10. Hiroki Tsutomu,JPX, Semiconductor processing apparatus.
  11. Araki Shinichiro (Kumamoto JPX), Semiconductor treatment system and method for exchanging and treating substrate.
  12. Murdoch Steven C. (Palo Alto CA) Steger Robert J. (San Jose CA) Vora Mahasukh (Los Catos CA), Semiconductor wafer transfer in processing systems.
  13. Ueda Issei,JPX ; Akimoto Masami,JPX ; Kudou Hiroyuki,JPX, Substrate transfer apparatus.
  14. Davis ; Jr. James C. (Carlisle MA) Hofmeister Christopher A. (Hampstead NH), Substrate transport apparatus with dual substrate holders.
  15. Nishi Hironobu (Sagamihara JPX), Transfer device.
  16. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  17. Itasaka Hideki,JPX, Vacuum suction forceps.
  18. Chen Chien-Feng (Pei-Twun TWX) Hsu Jun-Sheng (Taipei TWX) Pan Shih-Ming (Ping Jen TWX) Ou Knight-Tian (Miao-Li TWX), Wafer pickup system.
  19. Ohtani Masami (Kyoto JPX) Nishida Masami (Kyoto JPX), Wafer transfer apparatus having an improved wafer transfer portion.
  20. Tada Keishi (Kanagawa JPX), Wafer transfer device for a semiconductor device fabricating system.

이 특허를 인용한 특허 (21)

  1. Kanawade, Dinesh; Metzner, Craig R.; Balasubramanyam, Chandrasekhar, Advanced FI blade for high temperature extraction.
  2. Blonigan, Wendell Thomas; Toshima, Masato; Law, Kam S.; Berkstresser, David Eric; Kleinke, Steve; Stevens, Craig Lyle, Auto-sequencing multi-directional inline processing method.
  3. Stevens, Craig Lyle; Berkstresser, David Eric; Blonigan, Wendell Thomas, Broken wafer recovery system.
  4. Chin-Chin, Chang, Circular sawing machine having a link mechanism.
  5. Morey, Travis, High flow gas diffuser assemblies, systems, and methods.
  6. Klomp, Albert Jan Hendrik; Hoogkamp, Jan Frederik; Vugts, Josephus Cornelius Johannes Antonius; Livesey, Robert Gordon; Franssen, Johannes Hendrikus Gertrudis, Load lock and method for transferring objects.
  7. Kim, Ki-Sang; Jeoung, Gyu-Chan; Kwag, Gyu-hwan, Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing.
  8. Kim, Ki-sang; Jeoung, Gyu-chan; Kwag, Gyu-hwan, Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing.
  9. Weaver, William T.; Yudovsky, Joseph; Schaller, Jason M.; Blahnik, Jeffrey C.; Vopat, Robert B.; Daniel, Jr., Malcolm N.; Mitchell, Robert, Multi-position batch load lock apparatus and systems and methods including same.
  10. Newman, Jacob; Kanawade, Dinesh; Merry, Nir, Multiple substrate transfer robot.
  11. Greenberg, Daniel; Majumdar, Ayan, Pneumatic end effector apparatus and substrate transportation systems with annular flow channel.
  12. Sorabji, Khurshed; Ranish, Joseph M.; Aderhold, Wolfgang; Hunter, Aaron M.; Koelmel, Blake R.; Lerner, Alexander N.; Merry, Nir, Rapid thermal processing chamber with micro-positioning system.
  13. Sorabji, Khurshed; Ranish, Joseph M.; Aderhold, Wolfgang; Hunter, Aaron M.; Koelmel, Blake R.; Lerner, Alexander N.; Merry, Nir, Rapid thermal processing chamber with micro-positioning system.
  14. Sorabji, Khurshed; Ranish, Joseph M.; Aderhold, Wolfgang; Hunter, Aaron M.; Koelmel, Blake R.; Lerner, Alexander N.; Merry, Nir, Rapid thermal processing chamber with micro-positioning system.
  15. Sorabji, Khurshed; Ranish, Joseph M.; Aderhold, Wolfgang; Hunter, Aaron M.; Koelmel, Blake R.; Lerner, Alexander N.; Merry, Nir, Rapid thermal processing chamber with micro-positioning system.
  16. Agarwal, Pulkit; Greenberg, Daniel; Suh, Song-Moon; Brodine, Jeffrey; Sansoni, Steven V.; Mori, Glen, Substrate transfer robot end effector.
  17. Caveney, Robert T.; Gilchrist, Ulysses, Substrate transport apparatus.
  18. Okuno,Eiji, Substrate transport apparatus and substrate transport method.
  19. Yamagishi, Takayuki; Kobayashi, Tamihiro; Watanabe, Akira; Kaneuchi, Kunihiro, Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus.
  20. Ng, Edward; Englhardt, Eric A.; Morey, Travis; Majumdar, Ayan; Hongkham, Steve S., Transfer chamber gas purge apparatus, electronic device processing systems, and purge methods.
  21. Weaver, William T.; Yudovsky, Joseph; Schaller, Jason M.; Blahnik, Jeffrey C.; Vopat, Robert B.; Daniel, Jr., Malcolm N.; Mitchell, Robert, Wafer processing systems including multi-position batch load lock apparatus with temperature control capability.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로