초록

A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a controllable load to a substrate in an area with a controllable inner diameter.

대표청구항 ▼

A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a controllable load to a substrate in an area with a controllable inner diameter. y from the upper ply, the lower ply having a first portion with a first thickness and a laterally spaced apart seco

A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a controllable load to a substrate in an area with a controllable inner diameter. y from the upper ply, the lower ply having a first portion with a first thickness and a laterally spaced apart second portion with a second thickness greater than the first thickness, the first portion of the lower ply being aligned with a first part of the microelectronic substrate and applying a first force to the substrate when the lower ply engages the microelectronic substrate and presses the substrate against the medium, the second portion of the lower ply being aligned with a second part of the microelectronic substrate and applying a second force different from the first force when the lower ply engages the microelectronic substrate and presses the substrate against the medium, the first and second portions simultaneously contacting the microelectronic substrate when the lower ply engages the substrate.13. The carrier of claim 12 wherein the support member has a generally circular planform shape.14. The carrier of claim 12 wherein the upper ply has a generally circular planform shape and the lower ply has a generally annular shape with the first portion disposed radially inwardly from the second portion.15. The carrier of claim 12 wherein the upper ply has a generally circular planform shape and the lower ply has a generally annular shape with the second portion disposed radially inwardly from the first portion.16. The carrier of claim 12 wherein a ratio of the second thickness of the lower ply to the first thickness of the lower ply is less than approximately two.17. The carrier of claim 12 wherein the first thickness of the lower ply is approximately 0.030 inches.18. The carrier of claim 12 wherein the upper ply includes at least one of neoprene and silicone.19. The carrier of claim 12 wherein the lower ply includes at least one of neoprene and silicone.20. The carrier of claim 12 wherein the upper ply and the lower ply are formed from a compressible material by injecting the compressible material into a mold.21. The carrier of claim 12 wherein the upper ply and the lower ply are adhesively attached.22. The carrier of claim 12 wherein the first and second portions of the lower ply are radially disposed relative to each other and an intermediate thickness of the lower ply varies in a generally continuous manner between the first thickness and the second thickness.23. A carrier for supporting a microelectronic substrate relative to a planarizing medium during planarization of the microelectronic substrate, the carrier comprising: a support member; anda flexible, compressible membrane adjacent to the support member, the membrane having a first portion with a first thickness and a laterally spaced apart second portion with a second thickness greater than the first thickness, the first portion of the membrane being configured to apply a first force to the substrate when the membrane engages the microelectronic substrate, the second portion of the membrane being configured to apply a second force to the substrate when the membrane engages the microelectronic substrate, the second force being different from the first force and the first and second portions simultaneously contacting the microelectronic substrate when the membrane engages the substrate.