초록 ▼

The present invention provides an apparatus, system, and method of utilizing a Home Power Unit (“HPU”) which functions as a battery charger for a Hybrid Electric Vehicle (“HEV”) or as a generator, utilizing the HEV's electrical power to operate external electrical devices. In its simplest form, the

The present invention provides an apparatus, system, and method of utilizing a Home Power Unit (“HPU”) which functions as a battery charger for a Hybrid Electric Vehicle (“HEV”) or as a generator, utilizing the HEV's electrical power to operate external electrical devices. In its simplest form, the HPU comprises a Transformer, inverter means, rectifier means, a control unit, connection means to the HEV and external electrical loads or sources and switching means to change operation between charger and generator function. Alternative embodiments of the present invention utilize the HEV's existing components thereby avoiding component redundancy within the HPU. Specifically, in the first alternative embodiment, the inverter means are utilized within the vehicle, therefore, requiring only filter and transformer to be added to the vehicle. In the second alternative embodiment, the vehicle's DC-to-DC Converter is utilized as opposed to implementing a transformer. Therefore, only an inverter and filter are added to the system.

대표청구항 ▼

The present invention provides an apparatus, system, and method of utilizing a Home Power Unit (“HPU”) which functions as a battery charger for a Hybrid Electric Vehicle (“HEV”) or as a generator, utilizing the HEV's electrical power to operate external electrical devices. In its simplest form, the

The present invention provides an apparatus, system, and method of utilizing a Home Power Unit (“HPU”) which functions as a battery charger for a Hybrid Electric Vehicle (“HEV”) or as a generator, utilizing the HEV's electrical power to operate external electrical devices. In its simplest form, the HPU comprises a Transformer, inverter means, rectifier means, a control unit, connection means to the HEV and external electrical loads or sources and switching means to change operation between charger and generator function. Alternative embodiments of the present invention utilize the HEV's existing components thereby avoiding component redundancy within the HPU. Specifically, in the first alternative embodiment, the inverter means are utilized within the vehicle, therefore, requiring only filter and transformer to be added to the vehicle. In the second alternative embodiment, the vehicle's DC-to-DC Converter is utilized as opposed to implementing a transformer. Therefore, only an inverter and filter are added to the system. sembly recited in claim 1 wherein the lid comprises material from the group consisting of copper and aluminum-silicon-carbide.3. The assembly recited in claim 1 wherein the solderable thermally conductive element comprises material, including one or more alloys, from the group consisting of tin, bismuth, silver, indium, and lead.4. The assembly recited in claim 1 wherein the lid comprises at least one metal or organic layer to which the thermally conductive element can be coupled.5. The assembly recited in claim 4 wherein the at least one metal or organic layer comprises nickel or gold.6. The assembly recited in claim 1 and further comprising:a diffusion layer between the adhesion layer and the solder-wettable layer.7. The assembly recited in claim 6 wherein the layers comprise material, including one or more alloys, from the group consisting of titanium, chromium, zirconium, nickel, vanadium, and gold.8. The assembly recited in claim 6 wherein the diffusion layer comprises material, including one or more alloys, from the group consisting of titanium, chromium, zirconium, nickel, vanadium, and gold.9. The assembly recited in claim 6 wherein the diffusion layer comprises nickel-vanadium.10. The assembly recited in claim 1 wherein the solderable thermally conductive element has a liquidus temperature of 150 degrees Centigrade or less.11. The assembly recited in claim 1 wherein the solderable thermally conductive element has a liquidus temperature of 140 degrees Centigrade or less.12. The assembly recited in claim 1 wherein the solderable thermally conductive element has a liquidus temperature in the range of 138 to 157 degrees Centigrade.13. The assembly recited in claim 1 wherein the adhesion layer comprises material, including one or more alloys, from the group consisting of titanium, chromium, zirconium, nickel, vanadium, and gold.14. The assembly recited in claim 1 wherein the adhesion layer comprises titanium.15. The assembly recited in claim 1 wherein the solder-wettable layer comprises material, including one or more alloys, from the group consisting of titanium, chromium, zirconium, nickel, vanadium, and gold.16. The assembly recited in claim 1 wherein the solder-wettable layer comprises one of nickel and gold.17. An integrated circuit package comprising: a substrate;a die positioned on a surface of the substrate, the die having a back surface;an adhesion layer of metal formed on the back surface;a solder-wettable layer formed on the adhesion layer;a lid positioned over the die; anda solderable thermally conductive element coupling the solder-wettable layer and the lid.18. The integrated circuit package recited in claim 17 wherein the lid comprises a support member coupled to the substrate.19. The integrated circuit package recited in claim 17 wherein the lid comprises material from the group consisting of copper and aluminum-silicon-carbide.20. The integrated circuit package recited in claim 17 wherein the lid comprises at least one metal or organic layer to which the thermally conductive element is coupled.21. The integrated circuit package recited in claim 20 wherein the at least one metal or organic layer comprises nickel or gold.22. The integrated circuit package recited in claim 17 wherein the solderable thermally conductive element comprises material, including one or more alloys, from the group consisting of tin, bismuth, silver, indium, and lead.23. The integrated circuit package recited in claim 17 wherein the substrate is an organic substrate and wherein the die is coupled to the substrate through a land grid array.24. The integrated circuit package recited in claim 17 and further comprising:a diffusion layer between the adhesion layer and the solder-wettable layer.25. The integrated circuit package recited in claim 24 wherein the layers comprise material, including on