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In an electrically driven automobile, a dynamo-electric generating device(s) is attached to one or more free-running wheels of the vehicle, which are not connected to the power drive of the vehicle. The free-running wheels are rotated by contact with the road surface as the vehicle is powered forwar

In an electrically driven automobile, a dynamo-electric generating device(s) is attached to one or more free-running wheels of the vehicle, which are not connected to the power drive of the vehicle. The free-running wheels are rotated by contact with the road surface as the vehicle is powered forward. The free-running wheels rotate one or more electric generating devices to produce electrical energy which is stored alternately in one or more electrical storage systems. The other non-charging electrical storage system(s) concurrently provides power to the electric motor which drives the vehicle through one or more of the wheels connected to the power train.

대표청구항 ▼

In an electrically driven automobile, a dynamo-electric generating device(s) is attached to one or more free-running wheels of the vehicle, which are not connected to the power drive of the vehicle. The free-running wheels are rotated by contact with the road surface as the vehicle is powered forwar

In an electrically driven automobile, a dynamo-electric generating device(s) is attached to one or more free-running wheels of the vehicle, which are not connected to the power drive of the vehicle. The free-running wheels are rotated by contact with the road surface as the vehicle is powered forward. The free-running wheels rotate one or more electric generating devices to produce electrical energy which is stored alternately in one or more electrical storage systems. The other non-charging electrical storage system(s) concurrently provides power to the electric motor which drives the vehicle through one or more of the wheels connected to the power train. prises forcing epoxy between the silicon die and the plastic substrate to surround the solder columns with the epoxy. 25. The method of claim 24 wherein: forming an integrated circuit further comprises forming each integrated circuit inside an active boundary that is inside the rectangle of scribe lines to define an edge region between the active boundary and the rectangle of scribe lines; and wherein placing a plurality of solder bumps comprises placing a plurality of solder bumps inside each rectangle of scribe lines, the solder bumps having portions in contact with the active boundary and the edge region. 26. The method of claim 24 wherein: forming an integrated circuit further comprises forming each integrated circuit inside an active boundary that is inside the rectangle of scribe lines to define an edge region between the active boundary and the rectangle of scribe lines; and wherein placing a plurality of solder bumps comprises placing a plurality of solder bumps inside each rectangle of scribe lines, the solder bumps being in contact with the edge region between the active boundary and the rectangle of scribe lines.