초록 ▼

The invention relates to a method for recovering from shock event to a disk drive. Embedded servo wedges are read to generate position error signal (PES) values. The disk drive is transitioned to a write unsafe state if a PES value is greater than a write unsafe (WUS) threshold and is less than a sh

The invention relates to a method for recovering from shock event to a disk drive. Embedded servo wedges are read to generate position error signal (PES) values. The disk drive is transitioned to a write unsafe state if a PES value is greater than a write unsafe (WUS) threshold and is less than a shock detection threshold. The disk drive is transitioned to a shock recovery state if a PES value is greater than the shock detection threshold. The disk drive is transitioned from the shock recovery state to the write unsafe state if a first number of consecutively generated PES values remain less than the WUS threshold. The disk drive is transitioned from the write unsafe state to the on-track state if a second number of consecutively generated PES values remain less than the arrival threshold, which threshold is less than the WUS threshold.

대표청구항 ▼

The invention relates to a method for recovering from shock event to a disk drive. Embedded servo wedges are read to generate position error signal (PES) values. The disk drive is transitioned to a write unsafe state if a PES value is greater than a write unsafe (WUS) threshold and is less than a sh

The invention relates to a method for recovering from shock event to a disk drive. Embedded servo wedges are read to generate position error signal (PES) values. The disk drive is transitioned to a write unsafe state if a PES value is greater than a write unsafe (WUS) threshold and is less than a shock detection threshold. The disk drive is transitioned to a shock recovery state if a PES value is greater than the shock detection threshold. The disk drive is transitioned from the shock recovery state to the write unsafe state if a first number of consecutively generated PES values remain less than the WUS threshold. The disk drive is transitioned from the write unsafe state to the on-track state if a second number of consecutively generated PES values remain less than the arrival threshold, which threshold is less than the WUS threshold. oupling region. 11. The module according to claim 1, wherein said lens is a double lens.12. The module according to claim 4, wherein said lens and said holding edge are integral.13. The module according to claim 4, wherein: said holding edge is a separate support for said lens; and said lens is fastened on said support. 14. The module according to claim 1, wherein: said molding defines a depressed formation in said coupling region; and said coupling lens is inserted into said depressed formation. 15. The module according to claim 14, wherein a projection forms said depressed formation during filling of said module housing with said molding, said projection being a correspondingly shaped dead mold removed after filling of said module housing.16. The module according to claim 15, wherein said lens is adhesively attached to said molding.17. The module according to claim 1, wherein said element has a smaller diameter than the component.18. The module according to claim 1, wherein said coupling region is a protruding connecting piece forming a socket for receiving the component.19. An optoelectronic module, comprising: an element, said element being at least one of a transmitting element and a receiving element; a support on which said element is disposed; a module housing defining an opening for introducing said support, said module housing having: a coupling region for coupling a component thereat; andan interior; and a molding of a translucent, moldable material filling said interior of said module housing, said molding having a functional surface with an outer contour formed during filling of said module housing with said molding by a dead mold having an end face shaped to correspond to said outer contour and removed thereafter, said functional surface having a radially extending structure formed during filling of said module housing with said molding by a radially extending groove of the dead mold. 20. The module according to claim 19, wherein said element has a smaller diameter than the component.21. The module according to claim 19, wherein said coupling region a protruding connecting piece forming a socket for receiving the component.22. The module according to claim 19, including a separate coupling lens for coupling light between said element and the component, said lens being disposed at said functional surface.23. An optoelectronic module, comprising: an element, said element being at least one of a transmitting element and a receiving element; a support on which said element is disposed; a module housing defining an opening for introducing said support, said module housing having: a coupling region for coupling a component thereat; andan interior; and a molding of a translucent, moldable material filling said interior of said module housing, said molding having a dead-mold-shaped functional surface having an outer contour and a radially extending structure. 24. The module according to claim 23, including a separate coupling lens for coupling light between said element and the component, said lens being disposed at said functional surface.25. A method for producing an optoelectronic module with a molding, which comprises: providing a support with an element being at least one of a transmitting element and a receiving element; providing a module housing with an opening for introducing the support therethrough and a coupling region for coupling a component thereon; positioning the support in the module housing to align the element with a predetermined position; at least partly surrounding the support and the element with a translucent, moldable material to form a molding utilizing the module housing as a casting mold; and before filling the moldable material into the module housing, closing the coupling region with a coupling lens aligned with the element. 26. A method for producing an optoelectronic module with a molding, which comprises: providing a support with an eleme nt being at least one of a transmitting element and a receiving element; providing a module housing with an opening for introducing the support therethrough and a coupling region for coupling a component thereon; positioning the support in the module housing to align the element with a predetermined position; at least partly surrounding the support and the element with a translucent, moldable material to form a molding utilizing the module housing as a casting mold while placing a dead mold in the coupling region; forming a depressed formation in the molding material with a projection of the dead mold during the filling of the module housing with the molding material; removing the dead mold after filling the moldable material in the module housing; and inserting a coupling lens into the depressed formation after the dead mold has been removed. 27. A method for producing an optoelectronic module with a molding, which comprises: providing a support with an element being at least one of a transmitting element and a receiving element; providing a module housing with an opening for introducing the support therethrough and a coupling region for coupling a component thereon; positioning the support in the module housing to align the element with a predetermined position; placing a rear side of a coupling lens on an end face of a dead mold, the end face of the dead mold being shaped to correspond to the rear side of the coupling lens, and introducing the coupling lens into the module housing with the dead mold; at least partly surrounding the support and the element with a translucent, moldable material to form a molding utilizing the module housing as a casting mold while keeping the dead mold in the coupling region; holding the coupling lens with the dead mold until the module housing is filled with the molding material; and removing the dead mold after filling the moldable material in the module housing. 28. A method for producing an optoelectronic module with a molding, which comprises: providing a support with a transceiver element; providing a module housing with an opening for introducing the support therethrough and a coupling region for coupling a component thereon; positioning the support in the module housing to align the element with a predetermined position of the coupling region; placing a coupling lens on an end face of a dead mold and locating the coupling lens at the coupling region of the module housing; at least partly surrounding the support and the element with a translucent, moldable material to form a molding utilizing the module housing as a casting mold while keeping the dead mold at the coupling region; holding the coupling lens with the dead mold until the module housing is filled with the molding material; and removing the dead mold after filling the moldable material in the module housing.