초록 ▼

Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulatin

Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulating package body which has the semiconductor chip mounted on a flat inner bottom surface of a concave portion; a transparent cover glass to be fixed on an upper surface of an outer frame of the concave portion for sealing the concave portion; and a lead frame which is brought out to the outside of the package body. The solid state image sensing device has a reference plane for attaching onto an image input apparatus is arranged on the package. The reference plane for attaching is made parallel to the inner bottom surface of the concave portion on which the semiconductor chip is mounted.

대표청구항 ▼

1. A supporting structure for a solid state image sensing device, comprising: an intermediate holding member to which said solid state image sensing device is attached; and a holding member to which said intermediate holding member is attached, said image sensing device including: a semiconduc

1. A supporting structure for a solid state image sensing device, comprising: an intermediate holding member to which said solid state image sensing device is attached; and a holding member to which said intermediate holding member is attached, said image sensing device including: a semiconductor chip for image sensing having at least one photoelectric conversion element line, anda package which has a concave portion into which the semiconductor chip is received; a reference plane for attaching provided on said package, said intermediate holding member fixed to said reference plane, said reference plane being parallel to an inner bottom surface of said concave portion on which said semiconductor chip is mounted. 2. The supporting structure according to claim 1, said package comprises: an insulating package body in which the semiconductor chip is mounted on a flat inner bottom surface of the concave portion, a transparent cover glass fixed on an upper surface of an outer frame of the concave portion of the insulating package body for sealing the concave portion, and a lead frame connected to electrodes on the semiconductor chip within the insulating package body and extending outwardly through the insulating package body, wherein said reference plane for attaching comprises a surface located orthogonally to an optical axis of light coming into an incoming light receiving surface of said semiconductor chip through said cover glass.3. The supporting structure according to claim 1, wherein said package comprises a package body including: a base frame comprising a flat ceramic plate constituting a bottom plate, and an annular window frame made of ceramic fixed on one surface of the base frame through a sealing glass; a transparent cover glass fixed on an upper surface of an outer frame of said window frame; and a lead frame extending outwardly through said sealing glass. 4. The supporting structure according to claim 2, wherein said insulating package body is made of resin; said supporting structure comprises a mechanism in which said semiconductor chip is mounted on a metal plate located on an inner bottom surface of the concave portion of the insulating package body; and said reference plane for attaching is arranged on said metal plate. 5. The supporting structure according to claim 2, wherein said reference plane is arranged on said insulating package.6. The supporting structure according to claim 2, wherein said reference plane is arranged on said cover glass.7. The supporting structure according to claim 2, wherein said reference plane is arranged on a surface of the outer frame of the concave portion of said insulating package body.8. The supporting structure according to claim 3, wherein said reference plane is arranged on an upper surface of said window frame.9. The supporting structure according to claim 3, wherein said reference plane is arranged on an upper surface of said base frame.10. The supporting structure according to claim 4, wherein said reference plane is arranged on a bottom surface of said concave portion of the insulating package body.11. The supporting structure according to claim 3, wherein said reference plane is arranged on a protruding surface projecting from the bottom plate of said base frame.12. The supporting structure according to claim 3, wherein said reference plane is arranged on a protruding surface projecting from the metal plate.