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A product, product by process, and process according to the present invention integrates an ignition coil driver electronics or ignitor into a plughole coil housing. Electronic components are mounted directly to a printed circuit board serving as a direct connection to connector terminals and/or coi

A product, product by process, and process according to the present invention integrates an ignition coil driver electronics or ignitor into a plughole coil housing. Electronic components are mounted directly to a printed circuit board serving as a direct connection to connector terminals and/or coil leads via plated-apertures. If required, at least one protective layer can be applied directly to an external surface of at least some of the electronic components mounted on the printed circuit board to compensate for differences in the coefficients of thermal expansion. The protective layer is selected from a group including a conformal coating, a soft buffer material, a hard epoxy globtop, and combinations thereof.

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1. A process for mounting ignition coil driver electronics comprising the steps of:mounting electronic components directly to a printed circuit board serving as a direct connection to connector terminals and coil leads via plated through-apertures; andenclosing the mounted electronic components in a

1. A process for mounting ignition coil driver electronics comprising the steps of:mounting electronic components directly to a printed circuit board serving as a direct connection to connector terminals and coil leads via plated through-apertures; andenclosing the mounted electronic components in a plughole coil housing. 2. The process of claim 1 further comprising the step of:applying at least one protective layer directly to an external surface of at least some of the electronic components mounted on the printed circuit board. 3. The process of claim 1 wherein the electronic components include an insulated gate bipolar transistor and at least one control chip. 4. The process of claim 1 wherein the electronic components and the printed circuit board have different coefficients of thermal expansion. 5. The process of claim 2 wherein the at least one protective layer is selected from a group consisting of a conformal coating, a soft buffer material, a hard epoxy globtop, and combinations thereof, the at least one protective layer applied on the printed circuit board covering at least some of the electronic components. 6. The process of claim 5 wherein the hard epoxy globtop has a low coefficient of thermal expansion and a high glass transition temperature. 7. The process of claim 5 wherein the soft buffer material has a coefficient of thermal expansion higher than a coefficient of thermal expansion of an epoxy plus a difference between coefficients of thermal expansion of the epoxy and the printed circuit board, and is sufficiently compressible to prevent exertion of stress in the epoxy during heating and to prevent exertion of stress in solder joints of electronic components during cooling. 8. The process of claim 5 wherein the conformal coating has a coefficient of thermal expansion higher than a coefficient of thermal expansion of an epoxy plus a difference between coefficients of thermal expansion of the epoxy and the printed circuit board, and is sufficiently compressible to prevent exertion of stress in the epoxy during heating and to prevent exertion of stress in solder joints of electronic components during cooling. 9. The process of claim 1 further comprising the step of:laying out copper traces on the printed circuit board for dissipating heat generated by the mounted electronic components. 10. The process of claim 9 wherein the electronic component includes an insulated gate bipolar transistor, and further comprising the step of:soldering a copper slug between the insulated gate bipolar transistor and a copper foil to act as a heat spreader. 11. The process of claim 9 wherein the electronic component includes an insulated gate bipolar transistor, and further comprising the step of:press-fitting a copper slug into an aperture formed in the printed circuit board between the insulated gate bipolar transistor and a copper foil to act as a heat spreader. 12. A product manufactured by the process of claim 1 comprising:electronic components mounted directly to a printed circuit board serving as a direct connection to connector terminals and coil leads via plated through-apertures; anda plughole coil housing enclosing the mounted electronic components. 13. The product of claim 12 further comprising:at least one protective layer applied directly to an external surface of at least some of the electronic components mounted on the printed circuit board. 14. The product of claim 13 wherein the electronic components include an insulated gate bipolar transistor and at least one control chip. 15. The product of claim 13 wherein the electronic components and the printed circuit board have different coefficients of thermal expansion. 16. The product of claim 14 wherein the at least one protective layer is selected from a group consisting of a conformal coating, a soft buffer material, a hard epoxy globtop, and combinations thereof, the at least one protective layer applied on the printed circuit board covering at least some of the e lectronic components. 17. The product of claim 16 wherein the hard epoxy globtop has a low coefficient of thermal expansion and a high glass transition temperature. 18. The product of claim 16 wherein the soft buffer material has a coefficient of thermal expansion higher than a coefficient of thermal expansion of an epoxy plus a difference between coefficients of thermal expansion of the epoxy and the printed circuit board, and is sufficiently compressible to prevent exertion of stress in the epoxy during heating and to prevent exertion of stress in solder joints of electronic components during cooling. 19. The product of claim 16 wherein the conformal coating has a coefficient of thermal expansion higher than a coefficient of thermal expansion of an epoxy plus a difference between coefficients of thermal expansion of the epoxy and the printed circuit board, and is sufficiently compressible to prevent exertion of stress in the epoxy during heating and to prevent exertion of stress in solder joints of electronic components during cooling. 20. The product of claim 13 further comprising:copper traces laid out on the printed circuit board for dissipating heat generated by the mounted electronic components. 21. The product of claim 20 further comprising:the electronic components including an insulated gate bipolar transistor; anda copper slug soldered between the insulated gate bipolar transistor and a copper foil to act as a heat spreader. 22. The product of claim 20 further comprising:the electronic components including an insulated gate bipolar transistor; anda copper slug press-fit into an aperture in the printed circuit board between the insulated gate bipolar transistor and a copper foil to act as a heat spreader. 23. A product for ignition coil driver electronics comprising:electronic components mounted directly to a printed circuit board serving as a direct connection to connector terminals and coil leads via plated through-apertures; anda plughole coil housing enclosing the mounted electronic components. 24. The product of claim 23 wherein the electronic components include an insulated gate bipolar transistor and at least one control chip. 25. The product of claim 23 wherein the electronic components and the printed circuit board have different coefficients of thermal expansion. 26. The product of claim 23 further comprising:at least one protective layer applied directly to an external surface of at least some of the electronic components mounted on the printed circuit board. 27. The product of claim 26 wherein the at least one protective layer is selected from a group consisting of a conformal coating, a soft buffer material, a hard epoxy globtop, and combinations thereof, the at least one protective layer applied on the printed circuit board covering at least some of the electronic components. 28. The product of claim 27 wherein the hard epoxy globtop has a low coefficient of thermal expansion and a high glass transition temperature. 29. The product of claim 27 wherein the soft buffer material has a coefficient of thermal expansion higher than a coefficient of thermal expansion of an epoxy plus a difference between coefficients of thermal expansion of the epoxy and the printed circuit board, and is sufficiently compressible to prevent exertion of stress in the epoxy during heating and to prevent exertion of stress in solder joints of electronic components during cooling. 30. The product of claim 27 wherein the conformal coating has a coefficient of thermal expansion higher than a coefficient of thermal expansion of an epoxy plus a difference between coefficients of thermal expansion of the epoxy and the printed circuit board, and is sufficiently compressible to prevent exertion of stress in the epoxy during heating and to prevent exertion of stress in solder joints of electronic components during cooling. 31. The product of claim 23 further comprising:copper traces laid out on the printed circuit board for dissipating he at generated by the mounted electronic components. 32. The product of claim 31 further comprising:the electronic components including an insulated gate bipolar transistor; anda copper slug soldered between the insulated gate bipolar transistor and a copper foil to act as a heat spreader. 33. The product of claim 31 further comprising:the electronic components including an insulated gate bipolar transistor; anda copper slug press-fit into an aperture in the printed circuit board between the insulated gate bipolar transistor and a copper foil to act as a heat spreader.