IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0795988
(2001-02-28)
|
발명자
/ 주소 |
- Solomon, Jeffrey L.
- Tapio, Scott Melvyn
- Hennen, Daniel W.
|
출원인 / 주소 |
- 3M Innovative Properties Company
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
10 인용 특허 :
10 |
초록
▼
Described is a process for producing a microstructured composite article including the steps of: providing a tool with a molding surface that is suitable for forming a microstructure; applying to at least a portion of the molding surface a plurality of lines of a flowable, curable resin composition;
Described is a process for producing a microstructured composite article including the steps of: providing a tool with a molding surface that is suitable for forming a microstructure; applying to at least a portion of the molding surface a plurality of lines of a flowable, curable resin composition; contacting the resin composition with a substrate; curing the resin composition; and, transferring the resin composition to the substrate. Alternative embodiments include heating the molding surface or resin composition, or both, to aid in the flow of the resin composition. The advantage of this process is that is that the microstructured composite articles are able to be produced at high speed and are free of air bubbles.
대표청구항
▼
1. A process for producing a microstructured composite article, said process comprising:providing a tool compromising a molding surface that is suitable for forming a microstructure and which surface is heated to a temperature of at least 32° C.;applying to at least a portion of said molding su
1. A process for producing a microstructured composite article, said process comprising:providing a tool compromising a molding surface that is suitable for forming a microstructure and which surface is heated to a temperature of at least 32° C.;applying to at least a portion of said molding surface a plurality of continuous lines of a flowable, curable resin composition that are not touching each other when applied to the molding surface but which flow together to substantially coat said portion of said molding surface;contacting said resin composition with a substrate;curing said resin composition; andtransferring said resin composition to said substrate, said process yielding a substantially bubble-free cured resin. 2. The process as in claim 1 wherein said flowable, curable resin composition is cured by a free radical polymerization mechanism. 3. The process as in claim 1 wherein said substrate is a sheet or film, and it is conveyed through the process at a speed of at least 39.6 meters per minute. 4. Th process as in claim 1 in which said molding surface is heated to a temperature of at least 38° C. 5. The process as in claim 4 wherein said substrate is a sheet or film, and it is conveyed through the process at a speed of at least 15.2 meters per minute. 6. The process as in claim 1 wherein said molding tool temperature is at least 60° C. 7. The process as in claim 1 wherein said substrate is a film or sheet that comprises a material that is selected from a group consisting of a polycarbonate, cellulose acetate butyrate, cellulose acetate propionate, poly(ether sulfone), poly(methyl methacrylate), polyurethane, polyester, poly(vinylchloride), glass, metal and mixtures and combinations thereof. 8. The process as in claim 1 wherein said tool is in the shape of a roll, said substrate is continuously fed to said tool, and said molding surface comprises a plurality of grooves extending across the molding surface in a cross-web direction. 9. The process as in claim 8 wherein said plurality of grooves are cross-hatched in shape. 10. The process as in claim 8 wherein said plurality of grooves are sinusoidal in shape. 11. The process as in claim 1 wherein said tool comprises a transparent material. 12. The process as in claim 1 wherein said tool is in the shape of a roll and said substrate is continuously fed to said tool. 13. A process for producing a microstructured composite article, said process comprising:providing a tool comprising a molding surface comprising a plurality of grooves that are suitable for forming a microstructure said surface being heated to a temperature of at least 32° C.;applying to at least a portion of said molding surface a plurality of lines of a flowable, curable resin composition that flow together to substantially coat said at least a portion of said molding surface;applying to at least a portion of a substrate said flowable, curable resin composition;contacting said resin composition on said molding surface with said substrate after resin composition is applied to said substrate;curing said resin composition; andtransferring said resin composition on said molding surface to said substrate, said process yielding a substantially bubble-free cured resin. 14. The process of claim 13 wherein said lines of said resin composition applied to said molding surface are continuous. 15. The process of claim 13 wherein said substrate is a sheet or film, and it is conveyed through the process at a speed of at least 9.1 meters per minute, and said flowable, curable resin composition applied to said substrate is applied as a continuous layer. 16. The process of claim 13 and further comprising heating said molding surface to a temperature of at least 82° C. 17. The process of claim 13 and further comprising heating said flowable, curable resin composition before applying said resin composition. 18. The process of claim 17 and further comprising heating said molding surface to a temperature of at least 82° C. 19. A process for making a microstructured composite article, said process comprising:a) providing a tool having a molding surface suitable for forming a microstructure on a moving web, said surface being heated to a temperature of at least 32° C.;b) applying to said molding surface a plurality of lines of a curable resin which lines do not touch each other when applied to the molding surface, but which flow together to substantially coat at least a portion of said molding surface, said curable resin consisting essentially of a resin composition selected from the group consisting ofi) urethane acrylate oligomer, tetrahydrofurfuryl acrylate, 1,6-hexanediol adiacrylate and photoinitiator in a weight ratio of 65/25/10/1; andii) urethane acrylate oligomer, 2(2-ethoxyethoxy)ethylacrylate, 1,6-hexanediol diacrylate and photoinitiator in a weight ratio of 43/43/14/1;c) contacting said resin composition with a substrate film conveyed through said process, said substrate comprising a polymer selected from the group consisting of polyethylene terephthalate and polycarbonate;d) curing said resin composition; ande) transferring said resin composition to said substrate, said process yielding a substantially bubble-free cured resin.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.