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An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of

An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.

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1. A heat exchanger, especially for air or liquid cooling of at least one heat-producing component, said heat exchanger comprising:a base plate configured in heat exchanging contact with the at least one heat-producing component to provide at least one of air and liquid cooling thereof wherein said

1. A heat exchanger, especially for air or liquid cooling of at least one heat-producing component, said heat exchanger comprising:a base plate configured in heat exchanging contact with the at least one heat-producing component to provide at least one of air and liquid cooling thereof wherein said base plate includes an evaporator lid, said base plate and said evaporator lid are fabricated from copper and metallurgically joined;a plurality of liquid flow conduits in fluid flow communication with inlet and outlet manifold means with fluid being suppliable to and withdrawable from said inlet and outlet manifold means through said base plate, said liquid flow conduits are in heat exchanging contact with a first outside surface and a second outside surface defining two sides of said base plate, said liquid flow conduits configured to provide fluid transfer of a liquid coolant therein; anda plurality of heat sink fins arranged in parallel with respect to one another, said fins are in thermal contact with said first outside surface of said base plate which in turn is in heat exchanging contact with the second outside surface in thermal contact with the heat-producing component. 2. The heat exchanger of claim 1, wherein said fins are fabricated from copper, copper alloys, aluminum, aluminum alloys, nickel plated copper, and combinations of the foregoing materials. 3. The cooling unit of claim 1, further comprising a blower unit configured to provide a forced induction of air over said plurality of heat sink fins. 4. The heat exchanger of claim 1, wherein said plurality of heat sink fins are coupled to said base plate by one of solder and braze providing a low resistance thermal path for heat flow from said base plate to said plurality of heat sink finks. 5. The heat exchanger of claim 4 wherein said plurality of heat sink fins are coupled to said evaporator lid configured with holes aligned with complementary holes in said base plate for receiving captive fastening means for fastening said evaporator lid and said base plate to said heat producing component. 6. The heat exchanger of claim 5 wherein said base plate is an evaporator including a base plate portion and a flow plate portion, said flow plate portion configured having said plurality of liquid flow conduits, said base plate portion configured having said inlet and outlet manifold means, said evaporator lid disposed on one surface of said evaporator to provide heat exchanging contact with the heat-producing component in thermal contact with an opposite side of said evaporator. 7. The heat exchanger of claim 6 wherein said inlet and outlet manifold means are coupled to tubing that transports said liquid coolant to and from said evaporator, said tubing is at least partially surrounded with insulation. 8. The heat exchanger of claim 7 wherein said evaporator is configured with an inlet of said inlet and outlet manifold means positioned in a central portion of said evaporator to deliver a coldest portion of said liquid coolant to said central portion first. 9. The heat exchanger of claim 8 wherein said plurality fluid flow conduits includes a plurality of serpentine evaporator channels in fluid communication with said inlet at said central portion of said evaporator and terminating at an outlet of said inlet an outlet manifold means. 10. The heat exchanger of claim 9 wherein said inlet extends from said evaporator at one end and leads to said plurality of serpentine evaporator channels at another end, said inlet includes a throat section defining a first aperture at a first end and a second aperture at a second end of said throat section, said first aperture configured to increase a pressure or entering fluid flow and temperature thereof while said second aperture is configured to decrease pressure of exiting fluid flow resulting in a decrease of temperature thereof to mitigate condensation proximate said inlet extending from said evaporator and an outside surface of said evapor ator proximate said inlet extending from said evaporator exposed to ambient air. 11. The heat exchanger of claim 10 wherein said serpentine evaporator channels are configured with a low aspect ratio to reduce a thermal resistance path from said evaporator to said heat sink fins. 12. The heat exchanger of claim 11 wherein said heat-producing component is a multi-chip module aligned with said central portion of said evaporator. 13. A heat transfer device for a heat-producing component of an electronic device, comprising:a cooling plate assembly having an inner face of a flow plate portion along which a plurality of serpentine channels extend; said inner face being securable in liquid tight engagement with surface of a base plate portion of said cooling plate assembly in heat exchanging contact with the heat-producing component on an opposite surface, said channels being configured to define, with the surface, when said inner face is secured to the surface, a passageway so that liquid coolant circulating through said passageway is in direct contact with said surface, said channels configured to receive a coldest portion of the liquid coolant in a central portion of the surface; anda plurality of heat sink fins extending from a lid plate in heat exchanging contact with the flow plate portion on an outer face opposite the inner face,wherein said cooling plate assembly and said lid plate have a plurality of corresponding openings extending therethrough, and said surface is an inner surface or said base plate portion; and said inner face of the base plate portion is securable to said inner surface, to secure said inner face in liquid tight engagement with said inner surface, by a plurality of fasteners extending through said corresponding openings, respectively. 14. The heat transfer device of claim 13 wherein said cooling plate assembly is an evaporator including the base plate portion and the flow plate portion, said flow plate portion configured having said plurality of serpentine channels, said base plate portion configured having an inlet and outlet manifold means, said lid plate portion disposed on one surface of said evaporator to provide heat exchanging contact with the heat-producing component in thermal component contact with an opposite side of said evaporator. 15. The heat transfer device of claim 14 wherein a shroud is disposed over said fins, said shroud configured having shroud holes aligned with said-corresponding holes in said cooling plate assembly and said lid plate to provide at least one of access to said mounting means and heat exchange between said base plate and ambient air. 16. The heat transfer device of claim 15 wherein said evaporator is configured with an inlet of said inlet and outlet it manifold means positioned in a central portion of said evaporator to deliver a coldest portion of said liquid coolant to said central portion first. 17. The heat transfer device of claim 16 wherein said plurality of channels includes a plurality of serpentine evaporator channels in fluid communication with said inlet at said central portion of said evaporator and terminating at in outlet of said inlet and outlet manifold means. 18. The heat transfer device of claim 17 wherein said inlet extends from said evaporator at one end and leads to said plurality of serpentine evaporator channels at another end, said inlet includes a throat section defining a first aperture at a first end and a second aperture at a second end, said first aperture configured to increase a pressure of entering fluid flow and temperature thereof while said second aperture configured to decrease pressure of exiting fluid flow resulting in a lower temperature thereof to mitigate condensation proximate said inlet extending from said evaporator and an outside surface of said evaporator proximate said inlet extending for said evaporator exposed to ambient air. 19. The heat transfer device of claim 18 wherein said serpentine evaporator channel are configur ed with a low aspect ratio to reduce a thermal resistance path from said evaporator to said heat sink fins.