초록 ▼

A method of manufacturing a FinFET device includes forming a fin structure on an insulating layer. The fin structure includes a conductive fin. The method also includes forming source/drain regions and forming a dummy gate over the fin. The dummy gate may be removed and the width of the fin in the c

A method of manufacturing a FinFET device includes forming a fin structure on an insulating layer. The fin structure includes a conductive fin. The method also includes forming source/drain regions and forming a dummy gate over the fin. The dummy gate may be removed and the width of the fin in the channel region may be reduced. The method further includes depositing a gate material to replace the removed dummy gate.

대표청구항 ▼

1. A method of forming a gate in a FinFET device, comprising:depositing a first dielectric layer over a silicon on insulator (SOI) wafer, the SOI wafer comprising a silicon layer on an insulating layer;forming a resist mask over a portion of the first dielectric layer;etching portions of the first d

1. A method of forming a gate in a FinFET device, comprising:depositing a first dielectric layer over a silicon on insulator (SOI) wafer, the SOI wafer comprising a silicon layer on an insulating layer;forming a resist mask over a portion of the first dielectric layer;etching portions of the first dielectric layer and silicon layer not covered by the resist mask to form a fin and a dielectric cap covering a top surface of the fin;depositing a gate layer over the dielectric cap;depositing a second dielectric layer over the gate layer;etching the gate layer and second dielectric layer to form a gate structure;forming sidewall spacers adjacent the gate structure;forming a third dielectric layer over the FinFET device;planarizing the third dielectric layer to expose a top surface of the second dielectric layer;removing the second dielectric layer and the gate layer in the gate structure;etching the fin to reduce a width of the fin in a channel region of the semiconductor device; anddepositing a gate material to replace the removed gate layer. 2. The method of claim 1, further comprising:planarizing the gate material such that the gate material is substantially planar with upper surfaces of the sidewall spacers. 3. The method of claim 1, wherein the etching the fin includes: wet etching the fin. 4. The method of claim 1, wherein the etching the fin reduces the width of the fin in the channel region by an amount ranging from about 20 nm to about 100 nm. 5. The method of claim 1, further comprising:forming a source region on the insulating layer adjacent a first end of the fin; andforming a drain region on the insulating layer adjacent a second end of the fin. 6. The method of claim 5, further comprising:depositing a metal over the source and drain regions; andannealing the semiconductor device to form a metal-silicide compound over the source and drain regions. 7. The method of claim 1, wherein the removing the gate layer includes:etching the gate layer using an etch chemistry having a high etch selectivity for the gate layer relative to the first dielectric layer and the sidewall spacers. 8. The method of claim 1, wherein the depositing a gate material comprises:depositing at least one of W, Ti, Ni, TaN and TaSiN. 9. A method of manufacturing a semiconductor device, comprising:forming a fin on an insulating layer;forming source and drain regions;depositing a gate material over the fin;patterning and etching the gate material to form a gate structure comprising the gate material;forming a dielectric layer over the semiconductor device;planarizing the dielectric layer to expose a top surface of the gate structure;removing the gate material in the gate structure to form a recessed area;reducing a width of the fin in a channel region of the semiconductor device; anddepositing a metal in the recessed area. 10. The method of claim 9, further comprising:planarizing the metal. 11. The method of claim 9, wherein the reducing the width of the fin includes:etching the fin to reduce the width of the fin in the channel region by an amount ranging from about 20 nm to 100 nm. 12. The method of claim 11, wherein the etching the fin includes: etching the fin using an acid. 13. The method of claim 9, wherein the dielectric layer comprises a tetraethyl orthosilicate (TEOS) material. 14. The method of claim 9, wherein the gate material comprises silicon and the removing the gate material comprises:etching the gate material using an etch chemistry having a high etch selectivity with respect to silicon. 15. A method of manufacturing a semiconductor device, comprising:forming a fin structure on an insulating layer, the fin structure comprising a conductive fin;forming source and drain regions;forming a gate over the fin structure;forming a dielectric layer over the semiconductor device;planarizing the dielectric layer to expose a top surface of the gate;removing the gate to create a recessed area;thinning a width of the fin in a channel region of the se miconductor device; anddepositing a metal in the recessed area. 16. The method of claim 15, further comprising:planarizing the metal to form at least one gate electrode. 17. The method of claim 15, wherein the thinning the width of the fin comprises:wet etching the fin. 18. The method of claim 15, further comprising:depositing a metal over the source and drain regions; andannealing the semiconductor device to form a metal-silicide compound over the source and drain regions. 19. The method of claim 15, wherein the metal comprises at least one of tungsten, titanium, nickel tantalum. 20. The method of claim 15, wherein the thinning the width of the fin comprises:reducing the fin by an amount ranging from 20 nm to 100 nm.