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Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto

Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.

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1. A shielded plastic housing for an electronic component, the housing comprising:an injection molded layer;a thermoform layer comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform layer is couple

1. A shielded plastic housing for an electronic component, the housing comprising:an injection molded layer;a thermoform layer comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform layer is coupled to the injection molded layer; anda decorative layer coupled to one of the injection molded layer, the thermoform layer and the metal layer. 2. A method of shielding an electronic component of a printed circuit board, the method comprising:providing a printed circuit board having an electronic component and a ground trace;placing a housing comprising a metal shielding layer around the electronic component; andcreating a via through a portion of the housing;positioning the via over the ground trace; anddepositing at least one of a conductive adhesive and a solder in the via to conductively ground the metal layer in the housing to the ground trace. 3. The method of claim 2 wherein the housing is an outer housing of an electronic device. 4. A method of shielding an electronic component of a printed circuit board, the method comprising:providing a printed circuit board having an electronic component and a ground trace;placing a shield that comprises a conductive layer around the electronic component;creating a via through a portion of the shield;positioning the via over the ground trace; anddepositing a conductive element in the via to conductively ground the conductive layer in the shield to the ground trace. 5. The method of claim 4 wherein the conductive element is a conductive adhesive. 6. The method of claim 4 wherein the shield that comprises a conductive layer is a metallized polymer substrate. 7. The method of claim 4 wherein the shield is coupled to an outer housing of an electronic device. 8. A shielded plastic housing for an electronic component, the housing comprising:a substantially rigid injection molded layer;a thermoform insert comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform insert is coupled to the injection molded layer; anda decorative layer selectively applied to at least a portion of one of the injection molded layer, the thermoform layer, and the metal layer, wherein the decorative layer has a thickness that is less than a thickness of the injection molded layer. 9. The housing of claim 8 wherein the metal layer is viewable through the injection molded layer. 10. The housing of claim 8 wherein the metal layer provides a reflective surface.