IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0184782
(2002-06-27)
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발명자
/ 주소 |
- Frye-Mason, Gregory C.
- Martinez, David
- Manginell, Ronald P.
- Heller, Edwin J.
- Chanchani, Rajen
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
19 인용 특허 :
4 |
초록
▼
A method for forming electro-fluidic interconnections in microfluidic devices comprises forming an electrical connection between matching bond pads on a die containing an active electrical element and a microfluidic substrate and forming a fluidic seal ring that circumscribes the active electrical e
A method for forming electro-fluidic interconnections in microfluidic devices comprises forming an electrical connection between matching bond pads on a die containing an active electrical element and a microfluidic substrate and forming a fluidic seal ring that circumscribes the active electrical element and a fluidic feedthrough. Preferably, the electrical connection and the seal ring are formed in a single bonding step. The simple method is particularly useful for chemical microanalytical systems wherein a plurality of microanalytical components, such as a chemical preconcentrator, a gas chromatography column, and a surface acoustic wave detector, are fluidically interconnected on a hybrid microfluidic substrate having electrical connection to external support electronics.
대표청구항
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1. A method for forming an electro-fluidic connection from a microfluidic substrate to a die having at least one active electrical element thereon, comprising:forming at least one bond pad on the die that is electrically connected to the at least one active electrical element,forming a seal ring on
1. A method for forming an electro-fluidic connection from a microfluidic substrate to a die having at least one active electrical element thereon, comprising:forming at least one bond pad on the die that is electrically connected to the at least one active electrical element,forming a seal ring on the die on the outside of the at least one bond pad and the at least one active electrical element,forming at least one matching bond pad on the microfluidic substrate for connection to external support electronics,forming a matching seal ring on the microfluidic substrate on the outside of at least one fluidic via hole,bonding the at least one bond pad to the at least one matching bond pad with a conductive sealant to form electrical connection from the microfluidic substrate to the active electrical element, andbonding the seal ring to the matching seal ring with a sealant to form a fluidic seal around the active electrical element. 2. The method of claim 1, wherein the conductive sealant comprises solder or conductive epoxy. 3. The method of claim 1, wherein the microfluidic substrate comprises a printed wiring board, alumina, or a low-temperature cofired ceramic. 4. The method of claim 1, wherein the die comprises a chemical preconcentrator die, a gas chromatography column die, or a surface acoustic wave detector die. 5. The method of claim 1, wherein the bond pad forming step and the seal ring forming step comprise patterning a metal layer on the die. 6. A method for forming an electro-fluidic connection from a microfluidic substrate to a die having at least one active electrical element thereon, comprising:forming at least one bond pad on the die that is electrically connected to the at least one active electrical element,forming a dielectric seal ring on the die on the outside of the at least one active electrical element and the inside of the at least one bond pad,forming at least one matching bond pad on the microfluidic substrate for electrical connection to external support electronics,forming a matching seal ring on the microfluidic substrate around the outside of at least one fluidic via hole,bonding the at least one bond pad to the at least one matching bond pad with a conductive sealant to form electrical connection from the microfluidic substrate to the active electrical element, andbonding the dielectric seal ring to the matching seal ring with a sealant to form a fluidic seal around the at least one active electrical element. 7. The method of claim 6, wherein the conductive sealant comprises solder or conductive epoxy. 8. The method of claim 6, wherein the microfluidic substrate comprises a printed wiring board, alumina, or a low-temperature cofired ceramic. 9. The method of claim 6, wherein the die comprises a chemical preconcentrator die, a gas chromatography column die, or a surface acoustic wave detector die. 10. The method of claim 6, wherein the bond pad forming step comprises patterning a metal layer on the die. 11. The method of claim 6, wherein the dielectric seal ring forming step comprises depositing a patterned layer of silicon dioxide or silicon nitride on the die. 12. A method for forming an electro-fluidic connection from a microfluidic substrate to a die having at least one active electrical element thereon, comprising:forming at least one bond pad on the die that is electrically connected to the at least one active electrical element,forming at least one matching bond pad on the microfluidic substrate for connection to external support electronics,bonding the at least one bond pad to the at least one matching bond pad with a conductive sealant to form electrical connection from the microfluidic substrate to the active electrical element, andbonding the die to the microfluidic substrate with a sealant to form a fluidic seal ring around the outside of the at least one active electrical element on the die and at least one fluidic via hole in the microfluidic substrate. 13. The method of claim 12, whe rein the conductive sealant comprises solder or conductive epoxy. 14. The method of claim 12, wherein the microfluidic substrate comprises a printed wiring board, alumina, or a low-temperature cofired ceramic. 15. The method of claim 12, wherein the die comprises a chemical preconcentrator die, a gas chromatography column die, or a surface acoustic wave detector die. 16. The method of claim 12, wherein the bond pad forming step comprises patterning a metal layer on the die. 17. A method for forming an electro-fluidic connection from a microfluidic substrate to a die having at least one active electrical element thereon, comprising:forming at least one bond pad on the die that is electrically connected to the at least on active electrical element,forming at least one matching bond pad on the microfluidic substrate for connection to external support electronics, andpressing a ring of Z-axis elastomer between the die and the microfluidic substrate to form an electrical connection between the at least one bond pad on the die and the at least one matching bond on the microfluidic substrate and to form a fluidic seal ring around the outside of the at least one active electrical element on the die and the at least one fluidic via hole in the microfluidic substrate. 18. The method of claim 17, wherein the microfluidic substrate comprises a printed wiring board, alumina, or a low-temperature cofired ceramic. 19. The method of claim 17, wherein the die comprises a chemical preconcentrator die, a gas chromatography column die, or a surface acoustic wave detector die. 20. The method of claim 17, wherein the bond pad forming step comprises patterning a metal layer on the die.
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