초록 ▼

A hollow core composite assembly 10 is provided, including a hollow core base 12 having an open core surface 14 , a polyetherketoneketone film 22 applied to the hollow core base 12 , and an adhesive layer 24 positioned between the polyetherketoneketone film 22 and the open core surface 14 . The resu

A hollow core composite assembly 10 is provided, including a hollow core base 12 having an open core surface 14 , a polyetherketoneketone film 22 applied to the hollow core base 12 , and an adhesive layer 24 positioned between the polyetherketoneketone film 22 and the open core surface 14 . The resultant hollow core composite assembly 10 can be cured to provide a structure suitable for use within a liquid molding process.

대표청구항 ▼

1. A hollow core composite assembly, comprising:a hollow core base including at least one open core surface;at least one polyetherketoneketone film affixed to said at least one open core surface;at least one adhesive layer positioned between said at least one open core surface and said at least one

1. A hollow core composite assembly, comprising:a hollow core base including at least one open core surface;at least one polyetherketoneketone film affixed to said at least one open core surface;at least one adhesive layer positioned between said at least one open core surface and said at least one polyetherketoneketone film;at least one outer adhesive film applied to an outer surface of said at least one polyetherketoneketone film; anda liquid resin applied using a liquid molding process, said liquid resin applied over the hollow core base after said at least one adhesive layer and said at least one polyetherketoneketone film are applied to said hollow core base, said at least one polyetherketoneketone film preventing said liquid resin from penetrating said hollow core base. 2. A hollow core composite assembly 10 as described in claim 1, wherein said at least one adhesive layer 24 is an uncured adhesive film. 3. A hollow core composite assembly 10 as described in claim 1, wherein said at least one polyetherketoneketone film 22 and said at least one adhesive layer 24 are bonded to said hollow core base 12 using a pre-cure process. 4. A hollow core composite assembly 10 as described in claim 1, wherein said at least one polyetherketoneketone film 22 and said at least one adhesive layer 24 are bonded to said hollow core base 12 by curing as part of a resin application process. 5. A hollow core composite assembly as described in claim 1, wherein said at least one adhesive layer 24 is an epoxy paste adhesive. 6. A hollow core composite assembly 10 as described in claim 1, wherein said at least one adhesive layer 24 is cyanate ester paste adhesive. 7. A hollow core composite assembly 10 as described in claim 1, wherein said at least one adhesive layer 24 is thermoset adhesive. 8. A hollow core composite assembly 10 as described in claim 1, wherein said at least one adhesive layer 24 is a thermoplastic adhesive. 9. A hollow core composite assembly as described in claim 1, wherein said hollow core base is a honeycomb core. 10. A hollow core composite assembly comprising:a hollow core base including at least one open core surface;at least one polyetherketoneketone film affixed to said at least one open core surface;at least one adhesive layer positioned between said at least one open core surface and said at least one polyetherketoneketone film; anda liquid resin applied using a liquid molding process, said liquid resin applied over the hollow core base after said at least one adhesive layer and said at least one polyetherketoneketone film are applied to said hollow core base. 11. A hollow core composite assembly, comprising:a hollow core base including at least one open core surface;a solid film affixed to said at least one open core surface;at least one adhesive layer positioned between said at least one open core surface and said solid film;at least one outer adhesive film applied to an outer surface of said solid film; anda liquid resin applied using a liquid molding process over the hollow core base after said at least one adhesive layer, said solid film, and said at least one outer adhesive film are applied to said hollow core base. 12. A hollow core composite assembly 10 as described in claim 11, wherein said at least one adhesive layer 24 is an uncured adhesive film. 13. A hollow core composite assembly 10 as described in claim 11, wherein said solid film 22 and said at least one adhesive layer 24 are bonded to said hollow core base 12 by curing as part of a resin application process. 14. A hollow core composite assembly 10 as described in claim 11, wherein said at least one adhesive layer 24 is an epoxy paste adhesive. 15. A hollow core composite assembly 10 as described in claim 11, wherein said at least one adhesive layer 24 is a cyanate ester paste adhesive. 16. A hollow core composite assembly 10 as described in claim 11, wherein said at least one adhesive layer 24 is a hot melt adhesive. 17. A hollow core composite assembly 10 as described in claim 11, wherein said at least one adhesive layer 24 is a thermoplastic adhesive. 18. A hollow core composite assembly 10 as described in claim 11, wherein said at least one adhesive layer 24 is a BMI paste adhesive. 19. A hollow core composite assembly 10 as described in claim 11, wherein said at least one outer adhesive film 26 is an epoxy paste adhesive. 20. A hollow core composite assembly 10 as described in claim 11 wherein said hollow core base 12 is a honeycomb core. 21. A hollow core composite assembly 10 as described in claim 11 wherein said hollow core base 12 is an open cell foam. 22. A method of sealing a hollow core base for use in a liquid molding application process, comprising:applying an uncured adhesive layer onto an open core surface of the hollow core base;applying a polyetherketoneketone film onto said open core surface;applying an outer adhesive film to an outer side of said polyetherkeytonketone film; andapplying a liquid resin to said outer side, said polyetherkeytoneketone film preventing said liquid resin from penetrating into said open core surface. 23. A method of sealing a hollow core base for use in a liquid molding application process as described in claim 22, further comprising:pre-curing said uncured adhesive layer and said polyetherketoneketone film to the hollow core base 106 . 24. A method of sealing a hollow core base for use in a liquid molding application process as described in claim 22, further comprising:curing said uncured adhesive layer and said polyetherketoneketone film to the hollow core base as part of the liquid molding application process 110 .