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A microelectronic die comprises a first area, a second area and an under-layer of conductive material formed in the second area to interconnect components. A method of making a microelectronic die comprises forming a layer of insulative material on a substrate; forming at least one trench in the lay

A microelectronic die comprises a first area, a second area and an under-layer of conductive material formed in the second area to interconnect components. A method of making a microelectronic die comprises forming a layer of insulative material on a substrate; forming at least one trench in the layer of insulative material; and forming at least one line of conductive material in each of the at least one trenches to transmit signals.

대표청구항 ▼

1. A method of making a microelectronic die, comprising:forming a layer of insulative material on a substrate;forming at least one trench in the layer of insulative material spaced above the substrate and extending from proximate one edge of the microelectronic die to proximate another edge of the m

1. A method of making a microelectronic die, comprising:forming a layer of insulative material on a substrate;forming at least one trench in the layer of insulative material spaced above the substrate and extending from proximate one edge of the microelectronic die to proximate another edge of the microelectronic die; andforming at least one line of conductive material in each of the trenches encompassed by the insulative material to transmit signals across the microelectronic die. 2. The method of claim 1, further comprising:forming a layer of metallization on the layer of insulative material; andforming a contact in the layer of insulative material to make contact between the line of conductive material and the layer of metallization. 3. The method of claim 2, wherein forming the contact comprises:forming an opening in the layer of insulative material to expose a portion of the line of conductive material;forming a thin layer of titanium in the opening and on the exposed portion of the line of conductive material; andforming a contact of tungsten on the thin layer of titanium. 4. A method of making a microelectronic die, comprising:forming a layer of insulative material on a substrate;forming at least one device in a first area of the layer of insulative material; andforming an under-layer of conductive material in a second area spaced above the substrate and encompassed by the insulative layer. 5. The method of claim 4, further comprising:forming a first component in one portion of a third area; andforming a second component in another portion of the third area, wherein the first component and the second component are interconnected by the under-layer of conductive material. 6. The method of claim 4, wherein forming the at least one device comprises forming a memory system. 7. The method of claim 4, wherein forming the under-layer of conductive material comprises:forming a trench in the insulative layer; andforming a line of metallization in the trench. 8. A method of forming a microelectronic die, comprising:forming a layer of insulative material on a substrate;forming at least one device in a first area of the layer of insulative material;forming a trench in a second area of the layer of insulative material spaced above the substrate and extending substantially across the microelectronic die; andforming a line of metallization in the trench encompassed by the insulative material to transmit signals across the microelectronic die. 9. The method of claim 8, wherein forming the at least one device comprises forming an array of memory cells. 10. The method of claim 8, further comprising:forming a first component in one portion of a third area; andforming a second component in another portion of the third area, wherein the first component and the second component are interconnected by the line of metallization. 11. The method of claim 8, wherein forming the line of metallization comprises depositing a line including copper, aluminum or a combination of copper and aluminum. 12. A method of making a microelectronic die, comprising:forming a layer of insulative material on a substrate;forming an array of memory cells in a first area of the layer of insulative material;forming a trench in a second area of the layer of insulative material spaced above the substrate;forming a first component in a third area of the layer of insulative material;forming a second component in the third area of the layer of insulative material; andforming a line of metallization in the trench encompassed by the insulated material to transmit signals between the first component and the second component. 13. The method of claim 12, further comprising:forming a layer of metallization on the layer of insulative material; andforming a contact in the layer of insulative material to make contact between the layer of metallization and the line of metallization. 14. A method of making a microelectronic die, comprising:forming a layer of insulative material on a substrate;forming a device in a first area of the layer of insulative material;forming a plurality of trenches in a second area of the layer of insulative material spaced above the substrate;forming a plurality of components in a third area of the layer of insulative material; andforming a line of metallization in each of the trenches encompassed by the insulative material to transmit signals between the plurality of components. 15. A method of making a memory, comprising:forming a layer of insulative material on a substrate;forming an array of memory cells in a first area of the layer of insulative material; andforming an under-layer of conductive material in a second area spaced above the substrate and encompassed by the insulative layer. 16. The method of claim 15, wherein forming the under-layer of conductive material comprises:forming a trench in the insulative layer; andforming a line of metallization in the trench. 17. A method of making a memory, comprising:forming a layer of insulative material on a substrate;forming an array of memory cells in a first area of the layer of insulative material;forming at least one trench in a second area of the layer of insulative material spaced above the substrate and extending substantially completely along one dimension of the memory; andforming at least one line of conductive material in each of the at least one trenches encompassed by the insulative material to transmit signals across the memory. 18. The method of claim 17, further comprising:forming a layer of metallization on the layer of insulative material; andforming a contact in the layer of insulative material to make contact between the line of conductive material and the layer of metallization. 19. The method of claim 17, wherein forming the at least one line of conductive material comprises forming a line of metal to form a low RC interconnect. 20. A method of making an electronic system, comprising:forming a processor; andforming a memory system coupled to the processor, wherein forming the memory system includes:forming a layer of insulative material on a substrate;forming an array of memory cells in a first area of the layer of insulative material; andforming an under-layer of conductive material in a second area spaced above the substrate and encompassed by the insulative layer. 21. The method of claim 20, wherein forming the under-layer of conductive material comprises:forming a trench in the insulative layer; andforming a line of metallization in the trench. 22. A method of making an electronic system, comprising:forming a processor; andforming a memory system coupled to the processor, wherein forming the memory system includes:forming a layer of insulative material on a substrate;forming an array of memory cells in a first area of the layer of insulative material;forming at least one trench in a second area of the layer of insulative material spaced above the substrate and extending substantially completely along one dimension of the memory; andforming at least one line of conductive material in each of the at least one trenches encompassed by the insulative material to transmit signals across the memory. 23. The method of claim 22, wherein forming the at least one line of conductive material comprises forming a line of metal to form a low RC interconnect. 24. The method of claim 22, further comprising forming a plurality of components in a third area of the layer of insulative material, wherein the at least one layer of conductive material interconnects the plurality of components.