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A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, compr

A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.

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1. A curable melt blended composition comprising:a) 60 to 99.9 weight percent of a thermoplastic polymer comprising1) 1-99 weight percent of polyphenylene ether (PPE) polymer, and2) 1-99 weight percent of a polystyrene polymer; andb) 0.1 to 40 weight percent of an epoxy component, which is substanti

1. A curable melt blended composition comprising:a) 60 to 99.9 weight percent of a thermoplastic polymer comprising1) 1-99 weight percent of polyphenylene ether (PPE) polymer, and2) 1-99 weight percent of a polystyrene polymer; andb) 0.1 to 40 weight percent of an epoxy component, which is substantially uncured, comprising1) a curable epoxy, and2) an effective amount of curing agent for said curable epoxy, wherein the thermoplastic polymer (a) and epoxy component (b) are melt blended at a temperature of greater than 150° C. to a substantially uncured state. 2. The curable melt blended composition of claim 1 additionally comprising 0-25 weight percent of a compatiblizer. 3. The curable melt blended composition of claim 1 comprising 70-99.9 weight percent of said thermoplastic polymer. 4. The curable melt blended composition of claim 1, wherein said polystyrene polymer is a high impact polystyrene (HIPS) polymer. 5. The curable melt blended composition of claim 4, wherein said thermoplastic polymer comprises 10-90 weight percent of said high impact polystyrene (HIPS) polymer. 6. The curable melt blended composition of claim 1, wherein said curing agent is an epoxy cure catalyst. 7. The curable melt blended composition of claim 1, wherein said curable melt blended composition is an adhesive. 8. The curable melt blended composition of claim 7, wherein said curable melt blended composition is an adhesive for electronics applications.