[특허]Self-aligning wafer burn-in probe

[미국특허] Self-aligning wafer burn-in probe 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-031/02
출원번호	US-0902964 (2001-07-11)
발명자 / 주소	Notohardjono, Budy D. Schmidt, Roger R.
출원인 / 주소	International Business Machines Corporation
대리인 / 주소	Cutter Lawrence D.
인용정보	피인용 횟수 : 5 인용 특허 : 15

초록 ▼

The material and geometric properties of an electrical probe contact are combined to produce an electrical contact which is capable of self-alignment over many thousands of uses. The probe contact moves substantially only in a vertical direction and provides a consistent contact force with corresponding electrical contact pads on a semiconductor wafer. The probe contacts are configured in an array of a large plurality of individual contacts which extend from a base to which they are attached through apertures in an overlying mask spaced apart from the base.

대표청구항 ▼

1. A probe assembly for making electrical contact with circuit elements on an integrated circuit wafer, or the like, said probe comprising:a first support which is substantially flat;a second support disposed on said first member and providing a sidewall structure which extends substantially vertically upward from said substantially flat first support;a substantially flat mask having at least one aperture therein, said mask being supported by said second support at a substantially uniform distance from said first support;a flexible, self-supporting wire probe affixed to said first support, said wire probe having a pointed end which extends at least partially through said at least one aperture, said wire probe having two substantially oppositely directed bends therein so as to permit said wire probe to flex in response to force applied to said pointed end;said wire probe comprising a core material selected from the group consisting of platinum and platinum iridium alloys and being plated with material selected from the group consisting of nickel, gold, nickel alloys and gold alloys; andsaid wire probe having a core diameter d, a thickness, p, of concentrically disposed material, and an offset L, said offset being the horizontal distance between the point of affixation of said wire probe to said first support and the aperture through which said wire probe extends, said values of L, p and d being conjointly selected so as to define a point lying substantially within acceptable regions indicated in. 2. The probe structure of claim 1 in which said mask has a plurality of apertures. 3. The probe structure of claim 2 further including a plurality of similarly structured wire probes affixed to said first support and extending through respective ones of said apertures. 4. The probe structure of claim 1 in which said first support comprises ceramic material. 5. The probe structure of claim 1 in which said mask comprises a polyimide layer disposed between an invar layer. 6. A wire probe, for contacting electrically conductive pads on semiconductor wafers and similar devices, said probe comprising:a flexible, self-supporting wire having a first end and a second, pointed end and also having two substantially oppositely directed bends therein so as to permit said wire to flex in response to force applied to said pointed end, said wire having a core diameter d, a thickness p of plated material, and an offset L, said offset being the horizontal distance between said first end and said second end, said values of L, p and d being conjointly selected so as to define a point lying in the volume shown in. 7. The wire probe of claim 6 in which said wire is substantially disposed within a single plane. 8. The wire probe of claim 6 in which said bends are disposed so that flexing of said wire occurs substantially within a single plane. 9. The wire probe of claim 6 in which said aid wire probe comprises a core material selected from the group consisting of platinum and platinum iridium alloys and which is plated with material selected from the group consisting of nickel, gold, nickel alloys, and gold alloys.

이 특허에 인용된 특허 (15) 인용/피인용 타임라인 분석

Doemens Guenter (Holzkirchen DEX) Rose Thomas (Munich DEX), Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards.
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Benedetto William E. (Succasunna NJ) Moran Joseph M. (Berkeley Heights NJ), Apparatus having a buckling beam probe assembly.
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Black Thomas J. (38 Maureen Dr. Smithfield RI 02917), Automatic test system.
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Brandt Wolfram (Sindelfingen DEX) Marquart Bernd (Weil im Schoenbuch DEX) Stoehr Roland R. (Nufringen DEX), Buckling beam test probe assembly.
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Elssser Michael (Herrenberg DEX) Sthr Roland (Nufrigen DEX), Buckling beam test probe assembly.
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Khandros Igor Y. ; Mathieu Gaetar L., Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method.
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Das Gobina ; Gaschke Paul Mathew ; Hegde Suryanarayan G. ; LaForce Mark Raymond ; McHerron Dale Curtis ; Perry Charles Hampton ; Taber ; Jr. Frederick L., Large area multiple-chip probe assembly and method of making the same.
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Harvey C. Hamel ; Charles H. Perry ; Yuet-Ying Yu, Metal buckling beam probe.
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Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
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Prokopp Manfred (Am Felder 27 D-6980 Wertheim-Reicholzheim DEX), Method of testing circuit boards and the like.
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Coughlin Charles P. (Chelsea NY), Modular test probe.
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Lewis Stephan P. (Hermosa Beach CA), Multiple mode buckling beam probe assembly.
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Nagasawa Yasushi (Yamanashi-Ken JPX) Yamashita Satoru (Kofu JPX) Matsudo Masahiko (Kofu JPX), Probe needle.
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Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Structures and processes to create a desired probetip contact geometry on a wafer test probe.
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Cadwallader Robert H. ; Morrison Thomas ; Probst Klaus,DEX ; Yager William A., Substrate tester location clamping, sensing, and contacting method and apparatus.
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이 특허를 인용한 특허 (5) 인용/피인용 타임라인 분석

Farnworth,Warren M.; Tuttle,Mark, Interconnect for testing semiconductor components.
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Farnworth,Warren M.; Tuttle,Mark, Method for testing semiconductor components.
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Farnworth,Warren M.; Tuttle,Mark, Method for testing semiconductor components using bonded electrical connections.
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McQuade, Francis T, Micro probe assembly.
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Farnworth,Warren M.; Tuttle,Mark, System for testing semiconductor components.
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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
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[미국특허] Self-aligning wafer burn-in probe 원문보기

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